TW200529248A - Anisotropic conductive film pad - Google Patents
Anisotropic conductive film pad Download PDFInfo
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- TW200529248A TW200529248A TW93140234A TW93140234A TW200529248A TW 200529248 A TW200529248 A TW 200529248A TW 93140234 A TW93140234 A TW 93140234A TW 93140234 A TW93140234 A TW 93140234A TW 200529248 A TW200529248 A TW 200529248A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
200529248 五、發明說明（1) 【發明所屬之技術領域】 本發明有關於一種使用於如液晶顯示器等裝置中的金 屬末端凸塊，特別是有關於一種用於加強異方性導電膜之 電性連接的連接用凸塊。 【先前技術】 異方性導電膜（anisotropic conductive film， ACF )係用於微型且高效能的電子裝置中做電性連接，該 電子裝置需要細密之配線操作用以連接電路板之終端。關 於ACF的使用及說明，可參照美國專利第5，7 7 〇，3 〇 5號以及 美國專利申請案公開號第“”^丨丨丨⑽^丨號。 顯示器裝置，如液晶顯示器（LCD )以及電漿顯示器 (PDP )，其玻璃基板之間的電性連接是異方性導電膜的 應周例。異方性導電膜經常雨於將可撓性配線之引線 (flexible wiring lea(i)電性連接至一或多個位於該顯 示裝置之玻璃基板周圍的金屬終端凸塊。該可撓性配線之 引線通常用可撓性高分子材料製成，並具有薄的金屬箔配 線終止於A C F連接凸塊中，該凸塊位於可捷性配線之引線 的表面。 第1圖為一習知的異方性導電膜1 〇的剖視圖。該異方 性導電膜10位於一可撓性配線之引線70的ACF連接凸塊20 與一玻璃基板8 0的基底終端凸塊3 0之間。該異方性導電膜 1 0包含導電性粒子1 4，該導電性粒子1 4被覆一層絕緣物質 並散佈於一黏結材料12中。當該連接凸塊20及終端凸塊30 被壓接在一起時，會擠壓該異方性導電膜1 〇，該異方性導200529248 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a metal terminal bump used in a device such as a liquid crystal display, and more particularly to a method for enhancing the electrical properties of an anisotropic conductive film. Connection connection bump. [Previous Technology] Anisotropic conductive film (ACF) is used for making electrical connections in miniature and high-efficiency electronic devices. The electronic devices require fine wiring operations to connect the terminals of circuit boards. For the use and description of ACF, please refer to US Patent No. 5,777,305 and US Patent Application Publication No. "" ^ 丨 丨 丨 ⑽ ^ 丨. For display devices, such as liquid crystal displays (LCDs) and plasma displays (PDPs), the electrical connection between glass substrates is a common example of anisotropic conductive films. The anisotropic conductive film often rains the flexible wiring lea (i) electrically connected to one or more metal terminal bumps located around the glass substrate of the display device. The flexible wiring The lead is usually made of a flexible polymer material and has a thin metal foil wiring terminated in the ACF connection bump, which is located on the surface of the lead of the flexible wiring. Figure 1 shows a conventional alien A cross-sectional view of the flexible conductive film 10. The anisotropic conductive film 10 is located between the ACF connection bump 20 of a flexible wiring lead 70 and a base terminal bump 30 of a glass substrate 80. The anisotropy The conductive film 10 includes conductive particles 14 which are covered with a layer of insulating material and dispersed in an adhesive material 12. When the connection bump 20 and the terminal bump 30 are crimped together, they will squeeze. Pressing the anisotropic conductive film 10, the anisotropic conductive film
0632-A5O15O-TWf(5.O) ； AU0304004 ； chentf.ptd 第6頁 200529248 五、發明說明（2) 電膜1 〇作為黏結劑，將該二金屬凸塊連 、， 該連接凸塊20與該終端凸塊30之間的電性^起，並提供 法在此稱為壓力連接。 。此連接方 第2圖為第！圖中之連接凸塊2 〇與終 合，該麼力以！ 本- 凸塊30以壓力黏 °飞&力以則唬50表不。該連接凸塊20鱼故 的電性連接是由散佈在異方性導電膜1〇中的=凸J間 成。當該連接凸塊20與終端凸塊3〇壓合在，粒子14元 凸塊間的導電粒子被擠壓。該壓力5 〇必須二捕捉於 該導電粒子U變形而破壞其所被覆的絕緣能, 該壓壞的導電粒子14與該連接凸塊2〇以。因此，在 間形成金屬對金屬的接觸，而建立連=端凸塊3〇之| 30間的導電通路。 凸塊20與終端凸塊 在異方性導電膜1 〇中，黏結材料丨 、 端凸塊30連接在一起。作是，去連接 ^ 谷凸塊20與終 广丄 , ^ 田连接凸塊20 |炊妙几祕 壓隹一趕而使異方性導電膜丨〇中的導電粒7 ^田二凸 結材料會被擠出連接凸塊2〇與終端凸塊3〇 : j %，=黏 凸塊20與終端凸塊30之間僅留下很少 二隹=凄 此，如第3圖所示，一旦移除壓力5〇，由於。/科^。因 的彈性會施力於連接凸塊20與、終端凸塊3〇 /使^粒子14= 是在c區域的大量的黏結材料i2鄰接於連接凸塊2〇刀與每終端-凸塊30，會使連接凸塊2〇與終端凸塊3〇周圍區域a不會產 生分離的現象。因此，結果是周圍區域A的連接凸塊2 〇仍 然連接於終端凸塊3 0，而在中央區域，連接凸塊2 〇與終端 凸塊30為分離。因此，在接近周圍區域A，夾於連接凸塊0632-A5O15O-TWf (5.O); AU0304004; chentf.ptd page 6 200529248 V. Description of the invention (2) Electrical film 1 〇 As a bonding agent, the two metal bumps are connected, and the connection bump 20 The electrical connection between the terminal bumps 30 is referred to herein as a pressure connection. . This connecting party Figure 2 is the first! The connecting bump 2 in the picture is the final one. What should we do! Ben-Bump 30 with pressure sticking & Force with 50 Bluffs. The electrical connection of the connecting bump 20 is made up of the convexes J interspersed in the anisotropic conductive film 10. When the connecting bump 20 and the terminal bump 30 are pressed together, the conductive particles between the 14-element bumps are squeezed. The pressure 50 must be captured by the conductive particles U deforming and destroying the insulation energy covered by them, and the crushed conductive particles 14 and the connecting bumps 20 or more. Therefore, a metal-to-metal contact is formed between and a conductive path is formed between the terminal bumps 30 and 30. The bump 20 and the terminal bump In the anisotropic conductive film 10, the bonding material 丨 and the terminal bump 30 are connected together. The operation is to connect ^ valley bump 20 with the terminal, ^ Tian connection bump 20 | a few secrets to make the conductive particles in the anisotropic conductive film 7 ^ Tian two convex junction material It will be extruded to connect the bump 20 and the terminal bump 30: j%, = only a few two are left between the sticky bump 20 and the terminal bump 30 = = this, as shown in FIG. 3, once Removed pressure 50 ° due to. / Section ^. Due to the elasticity, the connecting bumps 20 and the terminal bumps 30 / the particles 14 = is a large amount of bonding material i2 in the region c adjacent to the connecting bump 20 and each terminal-bump 30 There will be no separation between the connecting bump 20 and the terminal bump 30. Therefore, as a result, the connecting bump 20 of the surrounding area A is still connected to the terminal bump 30, and in the central area, the connecting bump 20 is separated from the terminal bump 30. Therefore, in the vicinity of the surrounding area A, the connection bump is sandwiched.
0632-A50150-TWf(5.0) ； AU0304004 ； chentf.ptd 第7頁 200529248 五、發明說明（3) 2 0與終端凸塊3 0之間的導電粒子1 4 a仍然在足夠壓力的作 用下保持連接凸塊2 0與終端凸塊3 0間的電性導通。 該異方性導電膜通常是薄的金屬膜（大約〇 . 〇 3微米 厚），因此在此習知的應用例中，該連接凸塊2 0的中央區 域向外彎曲並與基底的終端凸塊3 0分離。由於基底的終端 凸塊3 0是在剛性的玻璃基板上，所以不會扭曲或彎曲。在 某些應用例中，異方性導電膜可用於連接薄的ACF連接凸 塊。例如，二個具有ACF連接凸塊的可撓性配線的導線， 可用異方性導電膜連接。在這些例子中，兩相接合的ACF 連接凸塊會在其中央區域彎曲，因為兩者皆為可撓性。 由於該連接凸塊2 0及終端凸塊3 0分離，且未施加足夠· 的壓力於導電粒子14b上，因此連接凸塊20及終端凸塊30 間的電性連接僅限於周圍區域A。此問題亦圖示於第4圖， 第4圖為第3圖中習知ACF連接凸塊的顯微平面圖。此圖係 從該連接凸塊2 0的上方觀之。留在連接凸塊2 0周圍區域的 該導電粒子的輪廓可透過該連接凸塊2 0觀察。 因此，需要一種改良的連接凸塊，以改善使用異方性 導電膜的連接凸塊間的電性連接。 【發明内容】 本發明揭露一種與異方性導電膜一起使用的改良的連 接凸塊。該連接凸塊至少具有二個指狀部。 本發明更提供一種可撓性配線的導線，包括一連接凸 塊用於連接一異方性導電膜，其中該連接凸塊包括至少二 指狀部。0632-A50150-TWf (5.0); AU0304004; chentf.ptd page 7 200529248 V. Description of the invention (3) Conductive particles 1 2a between 2 0 and terminal bump 3 0 remain connected under sufficient pressure The bump 20 and the terminal bump 30 are electrically connected. The anisotropic conductive film is usually a thin metal film (approximately 0.03 microns thick). Therefore, in this conventional application example, the central region of the connection bump 20 is curved outward and convex with the terminal of the substrate. Block 30 is separated. Since the terminal bump 30 of the base is on a rigid glass substrate, it does not twist or bend. In some applications, anisotropic conductive films can be used to connect thin ACF connection bumps. For example, two flexible wiring wires having ACF connection bumps may be connected by an anisotropic conductive film. In these examples, a two-phase ACF connection bump will bend in its central region because both are flexible. Since the connection bumps 20 and the terminal bumps 30 are separated, and sufficient pressure is not applied to the conductive particles 14b, the electrical connection between the connection bumps 20 and the terminal bumps 30 is limited to the surrounding area A. This problem is also illustrated in Fig. 4, which is a microscopic plan view of the conventional ACF connection bump in Fig. 3. This figure is viewed from above the connecting bump 20. The outline of the conductive particles remaining in the area around the connection bump 20 can be observed through the connection bump 20. Therefore, there is a need for an improved connection bump to improve the electrical connection between the connection bumps using an anisotropic conductive film. SUMMARY OF THE INVENTION The present invention discloses an improved connection bump for use with an anisotropic conductive film. The connecting bump has at least two fingers. The present invention further provides a flexible wiring wire, which includes a connection bump for connecting an anisotropic conductive film, wherein the connection bump includes at least two fingers.
0632-A50150_TWf(5.0) ; AU0304004 ; chentf.ptd 第8頁 200529248 五、發明說明0632-A50150_TWf (5.0); AU0304004; chentf.ptd page 8 200529248 V. Description of the invention
該連接凸塊的邊緣延伸 該指狀部可由至少一缺口 至該連接凸塊的中央區域。 、特徵、和優點能更 並配合所附圖示，作 為了讓本發明之上述和其他目的 明顯易懂，下文特舉一較佳實施例， 詳細說明如下。 【實施方式】 第5圖為一習知的ACF連接凸德 知矩形外型之連接凸塊，在此係用:比？。意圖，表示習 第6〜14圖為本發明之不同實施例中具有改良外型的 ACF連接凸塊的示意圖。ACF連接凸塊為電性連接的凸塊， 一般設於可撓性配線的引線上用於異方性導電膜的連結。 該运接凸塊一般係由銅基或鋁基的合金所製成的金屬薄片 形成、。將此連接f塊形成於可撓性配線之引線上的方法係 普遍為熟習此技藝之人士所知。 第6〜1 4圖所示的改良的連接凸塊具有至少二個指狀 部。例如’第6圖的ACF连接凸塊1 3 0具有二個指狀部丨3 2、An edge of the connecting bump extends from the finger to a central region of the connecting bump from at least one notch. , Features, and advantages can be combined with the accompanying drawings to make the above and other objects of the present invention obvious and easy to understand. A preferred embodiment is hereinafter described in detail as follows. [Embodiment] Fig. 5 is a conventional ACF connection convex connection structure with a rectangular shape. Here it is used: ratio? . The intention is to show FIGS. 6 to 14 are schematic diagrams of ACF connection bumps with improved appearance in different embodiments of the present invention. The ACF connection bump is an electrical connection bump, and is generally provided on a lead of a flexible wiring for connection of an anisotropic conductive film. The transport bump is generally formed of a metal sheet made of a copper-based or aluminum-based alloy. A method of forming this connecting f block on a lead of a flexible wiring is generally known to those skilled in the art. The improved connecting bumps shown in Figs. 6 to 14 have at least two finger portions. For example, the ACF connection bump 1 of FIG. 6 has two finger portions 3, 2
1 3 4 °該指狀部1 3 2、1 3 4係與連接至該連接凸塊丨3 〇的導線 135千行’但亦可没置成朝其他方向。第7圖的acf連接凸 塊1 4 0具有三個指狀部1 4 2、1 4 3及1 4 4。此實施例中的指狀 部亦平行於連接至該連接凸塊1 4 0的導線1 4 5，但相對於該 導線145該等指狀部可具有不同的方向。第8圖之該acf連1 3 4 ° The finger 1 2 3, 1 3 4 and the wire 135 thousand lines connected to the connecting bump 丨 3 0 ′, but may not be placed in other directions. The acf connection bump 1 4 0 in FIG. 7 has three finger portions 1 4 2, 1 4 3, and 1 4 4. The fingers in this embodiment are also parallel to the wires 145 connected to the connecting bumps 140, but the fingers may have different directions relative to the wires 145. Figure 8 of the acf company
接凸塊150具有三個指狀部1 52、153及154，與連接於連接 凸塊1 5 0的導線1 5 5垂直。第9圖的連接凸塊1 6 0具有四個與 導線165垂直的指狀部161、162、163及164。第10圖的ACFThe connecting bump 150 has three finger portions 152, 153, and 154, which are perpendicular to the lead wire 15 connected to the connecting bump 150. The connecting bump 160 of FIG. 9 has four finger portions 161, 162, 163, and 164 perpendicular to the lead 165. Figure 10 ACF
200529248 五、發明說明（5) 連接凸塊170具有六個指狀部172、173、174、176、177及 1 7 8。該等指狀部亦與連接於連接凸塊丨7 〇的導線丨7 5垂 直。三個指狀部1 7 2、1 7 3及1 7 4朝向離開該連接凸塊之縱 向軸線的方向延伸（該縱向軸線係由導線1 7 5所定義）， 而剩下的三個指狀部176、1 77及178亦朝向離開該連接凸 塊之縱向軸線的方向延伸，但與指狀部1 7 2、1 7 3及1 7 4方 向相反。第1 1圖的ACF連接凸塊180具有五個指狀部丨82、 1 8 3、1 8 4、1 8 6及1 8 7。該等指狀部係與導線丨8 5平行。第 1 2圖的ACF連接凸塊3 1 0具有四個指狀部3丨2自該連接凸塊 3 1 0的幾何中心呈輻射狀向外延伸。第丨3圖的ACF連接凸塊 320具有三個指狀部322。第14圖的ACF連接凸塊330具有四 個指狀部3 3 2。此處所討論的不同形狀的改良之ACF連接凸 塊僅是作為說明的例子，並非用於限制本發明之範圍於該 等特殊之形狀。200529248 V. Description of the invention (5) The connecting bump 170 has six fingers 172, 173, 174, 176, 177, and 178. The fingers are also perpendicular to the wires 750 connected to the connecting bumps 750. The three fingers 1 7 2, 1 7 3, and 1 7 4 extend in a direction away from the longitudinal axis of the connecting bump (the longitudinal axis is defined by the wire 1 7 5), and the remaining three fingers are The portions 176, 177, and 178 also extend in a direction away from the longitudinal axis of the connection bump, but are opposite to the fingers 1 7 2, 1 7 3, and 17 4. The ACF connection bump 180 of FIG. 11 has five fingers 82, 1 8 3, 1 8 4, 1 8 6 and 1 8 7. The fingers are parallel to the lead wires 85. The ACF connection bump 3 1 0 in FIG. 12 has four fingers 3 丨 2 extending radially outward from the geometric center of the connection bump 3 1 0. The ACF connection bump 320 of FIG. 3 has three fingers 322. The ACF connection bump 330 of Fig. 14 has four finger portions 3 3 2. The improved ACF connection bumps of the different shapes discussed here are for illustrative purposes only, and are not intended to limit the scope of the invention to these particular shapes.
另一種定義本發明之ACF連接凸塊的方法是由指狀部 之間的空間或缺口來定義。因此，本發明實施例中的改良 AACF連接凸塊包括至少二指狀部，該等指狀部係由從該 連接凸塊的邊緣向該連接凸塊的中央區域延伸的缺口所定 義。例如，第6圖的連接凸塊丨3〇具有一缺口133，該缺口 133定義出該等指狀部132及134。第12圖的ACF連接凸塊 3 1 0具有三個缺口 3 1 3，該等缺口 3丨3定義出該等四個指狀 部312。第14圖的ACF連接凸塊3μ具有三個缺口 3 3 3，該等 缺口 33 3定義出四個指狀部3 32。 不論本發明之改良式的ACF連接凸塊是由指狀部或缺Another method of defining the ACF connection bumps of the present invention is defined by the space or gap between the fingers. Therefore, the improved AACF connection bump in the embodiment of the present invention includes at least two fingers, which are defined by a notch extending from the edge of the connection bump to the central region of the connection bump. For example, the connecting bump 3 of FIG. 6 has a notch 133, and the notch 133 defines the finger portions 132 and 134. The ACF connection bump 3 1 0 in FIG. 12 has three notches 3 1 3. The notches 3 丨 3 define the four finger portions 312. The ACF connection bump 3 of FIG. 14 has three notches 3 3 3, and the notches 33 3 define four fingers 3 32. Regardless of whether the improved ACF connection bump of the present invention is formed by the finger or the
200529248 五、發明說明（6) 來疋義本赉明之具有新穎改良形狀的aCF連接凸塊與 1二成一或多個較小的指狀部，在該等指狀部之間具有空 :::缺Γ:該空間或缺口提供場所給異方性導電膜的黏結 材料，在兴方性導電膜於該連接凸塊及一對應面（mating sur/ace)之間受壓後，使該黏結材料可存在於連接凸塊 的輪廓内，並存在於接近該連接凸塊的中心區域。該對應 面通常疋LCD或PDP裝置中一玻璃基板的終端凸塊或豆他的 ACF連接凸塊。 〃 本發明之ACF連接凸塊所達成的改良係參照第丨5及工6 圖作說明。第1 5圖為第7圖所示之實施例的ACF連接凸塊 140沿A-A線的剖視圖。可撓性配線之引線5〇〇的連接凸塊 140即將與一異方性導電膜〗1〇受壓而形成與一基板6 〇〇之 一基底終端凸塊2 0 0的電性連接。該ACF連接凸塊14〇的三 個指狀部142、143及144被表示出。該異方性導電膜丨丨〇包 括被覆絕緣物質的導電粒子114散佈於黏結層112 _ '。 第1 6圖為第15圖之ACF連接凸塊14〇在使用異方性導電 膜1 1 0連接至基底終端凸塊2 0 〇以形成電性連接的剖視圖。 該ACF連接凸塊1 40的每一指狀部142、143及144與基底終 端凸塊2 0 0 ’經由接近指狀部1 42、1 43及1 44周圍區域被擠 壓的導電粒子11 4a而形成電性連接。因此，與第3圖所示 之習知的配置相比，在该終端凸塊2 〇 〇與指狀部1 & 2、1 4 3 及1 4 4之間，大體上有較夕的導電粒子11 4 a被擠壓及破 壞。與習知的ACF連接凸塊相比，本發明提供了較多的電200529248 V. Description of the invention (6) The original and improved aCF connection bump with a novel and improved shape and one or more smaller fingers, with a space between the fingers ::: Missing Γ: This space or gap provides a place for the bonding material of the anisotropic conductive film. After the square conductive film is pressed between the connection bump and a mating sur / ace, the bonding material is made It may exist within the outline of the connecting bump and in a region near the center of the connecting bump. The corresponding surface is usually a terminal bump of a glass substrate or a dome ACF connection bump in an LCD or PDP device.的 The improvement achieved by the ACF connection bump of the present invention is described with reference to FIGS. 5 and 6. FIG. 15 is a cross-sectional view of the ACF connection bump 140 of the embodiment shown in FIG. 7 along line A-A. The connecting bump 140 of the lead 500 of the flexible wiring is about to be pressed with an anisotropic conductive film 10 to form an electrical connection with a substrate terminal bump 200 of a substrate 600. The three finger portions 142, 143, and 144 of the ACF connection bump 140 are shown. The anisotropic conductive film includes conductive particles 114 coated with an insulating substance and is dispersed in the bonding layer 112 _ ′. FIG. 16 is a cross-sectional view of the ACF connection bump 14 of FIG. 15 connected to the substrate terminal bump 200 using an anisotropic conductive film 110 to form an electrical connection. The ACF connects each of the fingers 142, 143, and 144 of the bump 1 40 to the base terminal bump 2 0 0 ', and the conductive particles 11 4a that are squeezed through the area around the fingers 1 42, 1 43, and 1 44. An electrical connection is formed. Therefore, compared with the conventional configuration shown in FIG. 3, there is substantially more electrical conductivity between the terminal bump 2000 and the finger 1 & 2, 1 4 3, and 1 4 4 The particles 11 4 a are squeezed and destroyed. Compared with the conventional ACF connection bump, the present invention provides more electricity
0632-A50150-TWf(5.0) ； AU0304004 ； chentf.ptd 第11頁 200529248 五、發明說明（7) 性導通的通路。 如第1 6圖所示，在本發明的配置中，黏結材料丨丨2 a與 112b會保留在ACF連接凸塊的中心區域，在該三個指狀部 142、1 43及1 44之間。該勘結材料丨丨2a及丨12b係黏結於該 可挽性配線之引線5 0 0、該基底終端凸塊2 〇 〇以及該指狀部 H2、143及144。因此，該黏結材料n2a及1121)會使該指 狀部抵接於該基底終端凸塊2 〇 〇以避免該等指狀部與該基 底f端凸塊2 0 0分離。這使導電粒子丨丨4a保持在被擠壓的 狀態，並使該三個指狀部與基底終端凸塊2⑽做電性 接。結果與第3圖所示習知的配置相，有更多 通通路形成於該ACF連接凸媸14〇的兮一乂门北u a i 終端凸塊20。之間。塊0的该二個指狀部與該基底 凸塊第== 的本 =^ 形狀。參照第6〜η圖所二的= =該等特殊之 尺寸以便用於各種不同的應用場人。二塊可以形成各種 的特殊寬度與長度需考慮^同的^素二:f ^塊之指狀部 素包括異方性導電膜之導電粒子的I ，1攻佳化。這些因 厚度、ACF連接凸塊的冶金厚度。尺寸、異方性導電膜的 雖然本發明已以較佳實二^例揭霞 限定本發明，任何熟習此技藝者，，丄’然其並非用以 和範圍内，當可作些許之更動與潤^不脫離本發明之精神 範圍當視後附之申請專利範圍所界^ ’因此本發明之保護 f疋者為準。0632-A50150-TWf (5.0); AU0304004; chentf.ptd Page 11 200529248 V. Explanation of the invention (7) Sexual conduction pathway. As shown in FIG. 16, in the configuration of the present invention, the bonding material 丨 丨 2 a and 112 b will remain in the central area of the ACF connection bump, between the three fingers 142, 1 43, and 1 44 . The bonding materials 丨 2a and 丨 12b are bonded to the lead 500 of the releasable wiring, the substrate terminal bump 200, and the finger portions H2, 143, and 144. Therefore, the bonding materials n2a and 1121) cause the fingers to abut the terminal bumps 200 of the substrate to prevent the fingers from separating from the substrate f-end bumps 2000. This keeps the conductive particles 4a in a squeezed state, and electrically connects the three finger portions to the base terminal bump 2a. As a result, in comparison with the conventional configuration shown in FIG. 3, more communication paths are formed in the terminal block 20 of the UCF abutment 14a of the ACF connection. between. The two fingers of block 0 and the shape of the base bump of the base bump === ^. Refer to Figures 6 to η = = These special dimensions are used for various applications. The two blocks can form a variety of special widths and lengths that need to be considered. Element 2: f ^ The finger portion of the block includes the conductive particles of the anisotropic conductive film I, optimized. These are due to thickness, metallurgical thickness of ACF connection bumps. Size, anisotropic conductive film Although the present invention has been limited to the present invention by two examples, anyone who is familiar with this technology, however, is not intended to use it within the scope, and can make some changes and It does not depart from the spirit of the present invention as it is bounded by the scope of the appended patent application ^ 'thus the protection of the present invention shall prevail.
200529248 圖式簡單說明 第1圖為一習知的ACF連技上 導電膜連接至-第二金屬凸塊、=藉㈣力並使用異方性 第2圖為第1圖中ACF連接的剖視圖。 金屬凸塊結構的組合剖視圖凸塊错由壓力連接於該第二 第3圖為第2圖中之壓力聽^ & 第4圖為-平面照片，表示？的組合剖視圖。、 接凸塊之周圍區域的導電粒子弟圖中接近該習知ACF連 第5圖為一習知ACF連^輪廊° 鬼之外别的不音圖 第6〜1 4圖為本發明之不π者「一扪丁心圖。 意圖 第1 5圖為第7圖之ACF連接凸塊準備要與一底座 凸塊用異方性導電膜形成電性連接的剖視圖。 一 第i6圖為第15圖之ACF速接凸塊/^由目壓^力並使用異方 山Λ塊的剖視圖。 性導電膜連接至該底座的終細^ ^ >职☆加从& ▲咗未按照比例繪製。吒门 以上之參考圖所示的特歡义 二―从 伯同的 〆雜同的兀<丁 〇 參考數字在各圖式中用於表介# 。 冋貫施例之ACF連接凸塊的六 的終端 【符號說明】 1 0〜異方性導電膜； 1 2〜黏結材料， 1 4〜導電性粒子； 14a、14b〜導電粒子； 20〜ACF連接凸塊； 3 0〜基底終端凸塊；200529248 Brief description of the diagram. Figure 1 is a conventional ACF connection technology. The conductive film is connected to the second metal bump, which uses anisotropy. Figure 2 is a cross-sectional view of the ACF connection in Figure 1. Combined sectional view of the metal bump structure. The bumps are connected to the second by pressure. Figure 3 is the pressure in Figure 2. ^ & Figure 4 is a -plane photo, showing? Combination sectional view. The conductive particles in the surrounding area of the bump are close to the conventional ACF company. The fifth picture is a conventional ACF company ^ wheel corridor. The other sounds other than ghosts are shown in Figures 6 ~ 14. Those who do not have a single heart diagram. It is intended that Figure 15 is a cross-sectional view of the ACF connection bump of Figure 7 prepared to form an electrical connection with a base bump using an anisotropic conductive film. Figure i6 is the first 15 ACF quick-connect bumps / ^ by cross-sectional view of the pressure of the force and use of the other side mountain Λ block. The final detail of the conductive conductive film connected to the base ^ ^ > ☆ ☆ from & ▲ 咗 not to scale Draw. Special Huanyi II shown in the reference picture above the gate—the reference numerals from the same and mixed with the Tongtong are used in the drawings to express the reference #. Six terminals of the block [Symbol description] 1 0 ~ anisotropic conductive film; 1 2 ~ bonding material, 1 4 ~ conductive particles; 14a, 14b ~ conductive particles; 20 ~ ACF connection bumps; 3 0 ~ substrate terminal Bump
0632-A50150-TWf(5.0) ； AU0304004 ； chentf.ptd0632-A50150-TWf (5.0); AU0304004; chentf.ptd
第 200529248 圖式簡罩說明 5 0〜壓力； 7 0〜可撓性配線之引線； 8 0〜玻璃基板； 110〜異方性導電膜； 11 2、11 2a、1 12b〜黏結材料； 114、114a、114b〜導電粒子； 12 0、13 0、14 0、1 5 0、1 6 0、17 0、18 0、310、3 2 0、 3 30〜ACF連接凸塊； 132、134、142、143、144、152、153、154、16i、 162、163、164、172、173、174、176、177、178、182、 183、1 84、1 86及1 87〜指狀部； 13 3、31 3、33 3 〜缺口； 135、145、155、165、175、185 〜導線； 2 0 0〜基底終端凸塊， 5 0 0〜可撓性配線之引線； 6 0 0〜基板。200529248 Schematic diagram description 50 ~ pressure; 70 ~ flexible lead; 80 ~ glass substrate; 110 ~ anisotropic conductive film; 11 2, 11 2a, 1 12b ~ bonding material; 114, 114a, 114b ~ conductive particles; 12 0, 13 0, 14 0, 15 0, 16 0, 17 0, 18 0, 310, 3 2 0, 3 30 ~ ACF connection bumps; 132, 134, 142, 143, 144, 152, 153, 154, 16i, 162, 163, 164, 172, 173, 174, 176, 177, 178, 182, 183, 1 84, 1 86, and 1 87 to the finger; 13 3, 31 3, 33 3 ~ notches; 135, 145, 155, 165, 175, 185 ~ wires; 2 00 ~ substrate terminal bumps, 5 0 0 ~ flexible wiring leads; 6 0 0 ~ substrate.
0632-A50150-TWf(5.0) ； AU0304004 ； chentf.ptd 第14頁0632-A50150-TWf (5.0); AU0304004; chentf.ptd page 14
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| US10/787,801 US7038327B2 (en) | 2003-11-11 | 2004-02-26 | Anisotropic conductive film bonding pad |
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| US7630210B2 (en) * | 2005-11-29 | 2009-12-08 | Amphenol Corporation | Lead(Pb)-free electronic component attachment |
| JP2007234915A (en) * | 2006-03-02 | 2007-09-13 | Sony Corp | Wiring board, wiring cable, electronic equipment, and method for connecting wiring |
| JP4370341B2 (en) * | 2007-03-29 | 2009-11-25 | 株式会社日立ハイテクノロジーズ | ACF pasting device |
| JP5004654B2 (en) | 2007-05-16 | 2012-08-22 | パナソニック株式会社 | Wiring board connection method and wiring board structure |
| JP4516103B2 (en) * | 2007-09-27 | 2010-08-04 | 株式会社マーズフラッグ | Server apparatus and computer program |
| KR100918052B1 (en) * | 2008-03-07 | 2009-09-22 | 삼성에스디아이 주식회사 | Plasma display device |
| JP2010205292A (en) * | 2010-05-12 | 2010-09-16 | Mars Flag Corp | Server device and computer program |
| EP3701773A1 (en) | 2017-12-22 | 2020-09-02 | Huawei Technologies Co., Ltd. | Flex on board anisotropic conductive adhesive interconnection |
| TWI806112B (en) * | 2020-07-31 | 2023-06-21 | 矽創電子股份有限公司 | Flow guiding structure of chip |
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| JPH0745671A (en) * | 1993-08-03 | 1995-02-14 | Nec Yamagata Ltd | Semiconductor device |
| JP2546192B2 (en) * | 1994-09-30 | 1996-10-23 | 日本電気株式会社 | Film carrier semiconductor device |
| JPH08102218A (en) * | 1994-09-30 | 1996-04-16 | Nec Corp | Anisotropic conductive film |
| DE69528280T2 (en) * | 1994-11-03 | 2003-05-22 | Ericsson Telefon Ab L M | BALLAST CONTROL FOR RADIO FREQUENCY POWER TRANSISTORS |
| US5749997A (en) * | 1995-12-27 | 1998-05-12 | Industrial Technology Research Institute | Composite bump tape automated bonding method and bonded structure |
| US5907769A (en) * | 1996-12-30 | 1999-05-25 | Micron Technology, Inc. | Leads under chip in conventional IC package |
| US6268643B1 (en) * | 1997-12-22 | 2001-07-31 | Texas Instruments Incorporated | Lead frame device for delivering electrical power to a semiconductor die |
| US6049125A (en) * | 1997-12-29 | 2000-04-11 | Micron Technology, Inc. | Semiconductor package with heat sink and method of fabrication |
| US6310390B1 (en) * | 1999-04-08 | 2001-10-30 | Micron Technology, Inc. | BGA package and method of fabrication |
| JP2000331538A (en) * | 1999-05-17 | 2000-11-30 | Nitto Denko Corp | Anisotropic conductive film and manufacture thereof |
| GB9922763D0 (en) * | 1999-09-28 | 1999-11-24 | Koninkl Philips Electronics Nv | Semiconductor devices |
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