1287902 九、發明說明： 【發明所屬之技術領域】 本發明係關於—種藉由熱壓接手段而對於形成在軟性 電路基板（FP(^iexiblePrin滅丨⑽⑴之電極配線 面來假固定異方性導電膜（就F = An i sotrop i c Conduct丄敗 Film)之技術，特別是關於—種在該假固定製程所利 熱壓接裝置及熱壓接方法、藉由該前述熱壓接方法所 之軟性電路基板以及搭載前述電路基板之電子機器。 【先前技術】 纟於行動電話機或可攜式資輯韻（PDA)等之普及 而要求可以具有高精細之圖像顯示功能並且實現薄型1低 消耗電力的顯示面板，向來，液晶顯示面板係成為滿足該 要求之顯示面板而採用於許多製品。此外，在近來 所謂成為自發光型發光元件之特質之有機EL (電場發幻 顯不面板係也採用於前述一部分之電子機器，這個係 取代習知之液晶顯示面板之下一世代之顯示面板而受注 a 〇 在此種顯示面板，在構成面板之例如玻卿之透明基 板上，呈條紋狀地配列許多資料線以及直交於該資料線之 許多掃描線，在這些資料線和掃描線間之交差位置，分別 例如呈矩陣狀地形成顯示像素。接著，前述各個資料線及 各個掃描線係可以成為在構成顯示面板之前述透明基板所 直交之各個端部，連接於前述軟性電路基板（以下，也稱 為FPC。），透過配列於該FPC之許多電極配線而接受來自 1287902 像素驅動用資料驅動器及掃描驅動器等之驅動訊號之 造。 〜偁 正如前面敘述，例如作為對於構成顯示面板之透明基 板上之資料線及掃描線而分別連接軟性電路基板之各個電 極配線之手段係向來採用透過異方性導電膜（以下，也稱 為ACF。）藉由熱壓接而相互地進行連接之手段。 該ACF係在熱塑性或熱固性樹脂薄膜内分散許多導電 粒子，可以藉由利用既定之壓力來抵接熱壓接頂頭，而在 對峙之端子間，連繫導電粒子，顯示單一方向之導電性， 能夠藉此而得到端子間群之導通，同時，也發揮機械之連 接。因此，利用該ACF之熱壓接手段係正如前面敘述，。 以適當地利用在總括地連接許多端子間群之狀態下。可 正如前面敘述，為了利用ACF而對於例如構成顯示 板之透明基板上之資料線或掃描線來熱壓接Fpc，因此面 首先執行對於FPC之電極配線面來假固定ACF之製程。 著，可以藉由對於透明基板上之資料線或掃描線，= 固，於FPC之前述ACF,由FPC之背面開始，還熱壓接（】 式壓接）頂碩而透過前述ACF，對於透明基板上次正 或掃描線，來連接FPC之各個電極配線。 貝料線 就執行例如對於FPC而假固定前述ACF之製程 用假固定之ACF而將FPC正式壓接於顯示面板面 ： "，揭示在本案申請人之已經申請之專利文獻i。、王 【專利文獻1】日本特開2003—86999號公報 但疋，透過前述ACF而電路連接於例如顯示面板之美 1287902 板面之前述FPC係成為在軟性薄膜狀基底構件面形成銅猪 ，案（電極配線）並且在其上面塗敷絕緣阻劑之構造。接 著’成為在假ϋ定W述ACF之區域不塗敷絕緣阻劑而露 前述電極配線之構造。 /第=圖係顯示該例子，擴大及顯示而之端部。符號 2係頒不構成FPG1之薄難基底構件。在縣底構件2 上正如以虛線所不，藉由銅箱所造成之電極配線3係相 互平仃地形成為條紋狀，在形成該電極配線3之面，在除 了後面敘述之-部分以外之整個面，還塗敷絕緣阻带 成絕緣阻劑層4。 在藉由符號5所示之鏈線而包園之矩形區域係把 =上同樣_5所示)之區域，前述絕緣； θ糸使仔假固疋ACF5之區域内之前述電極配線 成為阻劑層之未形成（未塗裝）部分。也就是二 轭行藉由符號3 a所示之剖面線區域，形成 龙 、d之狀怨。接者，在電極配線之露出部分3a，正 =不露白之狀態來顯示剖面線，配合需要而施行金 = b 〇 、★电锻3 正如丽面敘述，ACF5係覆蓋電極配線之露出部八 U體，同時，還進行假固定而也覆蓋其周邊之施：r: /層4之部分。這個係絕緣阻劑唐4之境界部附处=、县 乏力孥地集中應力，在作用重複彎曲等之力時， :分：生破裂等。因此，為了避免前述問題，因此;亥 ’、固疋在廣泛地覆蓋包含電極配線3之露出部分3 刀 1287902 緣随，層4之形成值置之區域。 决加第—圖及第三圖係顯示對於第一圖所示構造之FPC1 二，定ACF5之狀況。也就是說，第二圖及第三圖之Fpcl 外，、- 圖所不之A部分之剖面圖而進行顯示。此 乐_圖及第三圖’藉由相同符號而 於 圖所示之各部分之部分。 之壯第—圖及第三圖所示，在對於FPC1來假固定ACF5 上。’FPC1係載置於構成熱壓接裝置之支承台座1 〇 辛材台座1Q係藉由比較硬質且熱傳導係數效小之 H構成，電路基板之餘面i Q s係 I::在如 ^ F5之载置位置係正如前面敘述 電極配線3之露ώ邱八q 仃載置而復盘包含 在^分3 3之絕緣阻劑層4之形成位置。 在雜悲下，正如第二圖所示，由於在阻_ 4 t 5之背面側，產生比較大之空間 二Li !:正如第二圖所示，下降構成熱壓接裝置之 土 =頭！ i而加熱鹏，同時，將這健接在卿 侧。猎此而使得構成ACF5之樹月旨素材 頭1 1進饤上升而對於FPC1來假固定ACF5之 -來㈣定ACF5之狀態下，正如第三_ 不，由於電極配線之露出部分3 a和阻割層4間之位差存 在’因此，發生所謂在⑽之背面側還殘留密封之空間工 Ϊ287902 3 b之問題。殘留於該密封之空間1 3 b内之空氣係在進 行後面之正式壓接時，接受來自熱壓接頂頭之熱而進行膨 脹，發生所謂疏忽和電極配線之露出部分3 a間之電氣連 接之問題。 為了避免前述問題，因此，考慮例如在絕緣阻劑層4 預先製作空氣之散逸圖案。但是，由於阻劑層4係一般藉 由網版印刷所形成，因此，發生〇·3腿左右之誤差，不容 易形成對應於細間距之電極端子（電極配線3間）之微細 之空氣之散逸圖案。此外，如果避免網版印刷而使用罩幕 等的話，則能夠在阻劑層4作成微細之空氣之散逸圖案， 因此’ ‘程受件複雜及成本升高而無法實現。 【發明内容】 本發明係著眼於前述問題點而完成的；其課題係提供 —種可以在對於軟性電路基板來假固定異方性導電膜之製 程而極度地減低在f絲板和異方性導電關形成密閉= 間=程度的熱壓接裝置及熱壓接方法；企轉此而提供ς ΐί::罪性之軟性電路基板以及搭載該軟性電路基板之 传在軸所完成之關於本發明之熱壓接们 ^在利祕對㈣成在祕f路基板之電極 疋異方性導電膜之熱壓接製程並且具備载置^又 之支承台座以及對於前述電路基板之； ，異方性導電膜之熱壓接頂頭的熱壓 支承台座之前述軟性電路基板之載置面錢前述電 1287902 :具=基底構件厚度2°〜1_之深度之凹部之方 路其熱壓㈣置而對於形成在軟性電 土板U極配線面來假^^異方性導 法並所述軟性電路基板係具備將薄膜狀基底構件和西己= 前述電極配線-部分的構造二予乂層積而路出 前述絕緣阻劑層間之境界部，配置在前述出：和 凹部之形成位置，將前述電極配線之震八口=之喊 =座之軟性電路基板之载置面，同二由= 性導電臈而覆蓋包含前述電極配線才猎由載置異方 間之境界部之電極配線之露出部之整;絕^且劑層 性導電膜，抵接細妾頂頭，來對於前·=剛逑異方 假固定異方性導電膜之方面，具有特认性電路基板， 【實施方式】 以下，就關於本發明之熱壓接, ί之熱屢接方法而言，根據第四熱壓接裝 遣行說明。此外，即使是在以下^斤不之貫施形態而 接裝置及熱壓接方法，也使用第之關於本發明之熱壓 此，藉由相同符號而顯示對應於第=不形恶之fpc。因 分，其詳細說明係適當地省略。°斤示之各邻分之部 第四圖及第五圖係顯示關於本 1施形態，在該熱壓接裝置所 t、、、壓接裝置之第 用之支承台座1 0，在 10 1287902 軟性電路基板之載置面 接著，在對於FPC1來假°卩刀’械凹部1 4。 承台座1〇之前述凹部、、f^層4間之境界部，配置在支 露出部3 a位處於前述形成位置，使得電極配線之 上。 边支承台座之FPC之載置面i 〇 s 猎由像這樣在支承台座1()上載置_ @ 使得，之端部進入至形成於支承台座 : 也就疋祝’構成Fpci之薄膜狀基底構件2及電極 轉3係其素材具有叫錄性，由於其本錢量而成為 弟四圖所不=狀恶。因此’層積於FPC1端部之絕緣阻劑層 4係也正如第四圖所不’受到變形，形成於該絕緣阻劑層 4和電極配線之露出部3 a間之位差係比較於第二圖所示 之例子時，變得非常小。 在該狀態下’正如第四圖所示，在載置ACF5之狀況， 形成於獅背面側之空間丨3 e係㈣小。因此，在該狀 態下，正如第五圖所示，在ACF5由賴壓接頂頭丄丄而受 到加熱及壓接之狀況下，在ACF5之背面側幾乎不積存空氣 之狀態’可以在FPC1之上面’假固定祕。可以藉此而 即使是在對於例如顯示面板等之其他基板等來進行正式壓 接時，也避免因為存在於ACF5背面側之空氣積存所產生二 前述問題。 第六圖係擴大及顯示前述支承台座i 〇之一部分，這 個係顯示在第四圖藉由虛線所包圍之C&D部分。該支承 11 1287902 i⑽所:1 台座本體1〇3來重合吻^ ίο s。接著，=體1 〇b之上面係成為取之載置面 體10 b之，輔助體之非重合部、也就是不重合輔助 卩分，形成前述凹部1 4。 nt由:述凹部1 4開始而隆起於FPC載置面1 0 S之 二…成為具有相對於前述凹部14之 h之傾斜面心。此外，在第六圖所示之=度^ α係130声户一 Μ 1 1孓例子，刖述 又工古。廷個係因為所謂在前述α成為9()# 之超出狀態之情況下，即 巧90度以= 而受到心h 頭11之抵接壓 -之傾it度變得非常大’相對地’在成為前述角度 、斜面1 0 C之狀態下，FPC1受到損傷之裎 “、之理由所造成的。 --㈣ 方面形成於兩述支承台座1〇之凹部14之深 f、換句話說在該實施形態對於台座本體1 Q a所曹人之 =體i〇b之厚度10d係最好是在構成Fpci之二膜 =基底構件2之厚度2G〜_之範圍。這個係在凹部工 4之洙度更加淺於前述數值之狀態下，藉由設置凹 所得到之前述效果之程度變少。 一在珂述凹部14之深度更加深於前述數值之狀態下， 在藉由熱壓接頂頭1 1所造成之壓接時，FPC1變形:凹部 夕1 4侧之程度係變大，在—部分，發生熱壓接之不良。此 "^凹。卩1 4之深度更加深於前述數值之狀態下，在受 到熱壓接朗1 1之抵減之情況，也發生所謂導致配列 於FPC1之電極配線3之切斷之其他問題。 12 1287902 作為一例子係將使得構成前述 件2之厚度成為25_、電極配線%之賴狀基底構 且絕緣阻劑層4之厚度成為5〜2 厚度成為12/zm並 且求出形成於支承台座丄〇之凹部 1作為樣本而 資料，顯示於第八圖。此外，在絕=理想沬度之實驗 前面敘述而具有幅寬者係由於#^層4之厚度正如 在一片基板内發生相當多之不均之緣故Y形成阻劑層4而 第八圖所示之實驗資料係顯示相 (% )對於構成FPC1之基底構件2厚声而卩14之洙度 率（％)之關係之結果。可以由該第出熱壓接良品 % .特別取好疋具備FPC之基底構件厚度抑〜麵 度之凹部14 ’最好是在實用上，將1有 之凹部14料具備。 ”有20〜⑽％深度 接著二第：圖係藉由剖面圖而顯示關於本發明之熱壓 接裝置之第二實施形態，這個係對應於顯一 ^ %喊不已經說明之第 二實施形態之第四圖。在該第七_示之第二實施形態， 在形成於支承台座1 〇之凹部1 4，开^ #a β ^ ^ ^成设數個吸引孔1 精此而將載置於支承台座10之_之背面，吸 q及固定於凹部14側。 因此，在藉由構成第七圖所示之熱壓接裝置之支承台 座1 0之形態時，對於FPC1之背面，淮钚j、 ° 凹部14侧，因此，在FPC1上載置_之狀態 下’可以使得形成於ACF5背面侧之空間丄3 c之容積緣得 更加小。可以藉此而在藉由利用熱壓接丁貝頭工工來加=壓 13 1287902 接ACF5以便假固定於FpC1上之狀態下，使得在FpCi和 ACF5間殘留空氣之機率變得更加低。 斤以上說明之第四圖〜第七圖所示之實施形態係顯示處 理第-圖所示之軟性電路基板i之端部、也就是處理第一 =所示，軟性電路基板之A部分之熱壓接裝置之部分構 le但疋，即使是在第一圖所示之B部分，也抱持已經說 明之同樣問題，因此，即使是在處理第-圖所示之B部分 之支承台座，也呈對照地形成同樣之凹部1 4。 ^在藉由採用關於本發明之熱壓接裝置及熱壓接方法而 …、I：接/、方f生導電膜之軟性電路基板時，則能夠極度地減 低在電路基板和異方性導電膜間形閉m之程度，因 2，可以提供提高電氣可靠性之軟性電路基板以及搭載該 軟性電路基板之電子機器。 北旦此外，就採用前述軟性電路基板之電子機ϋ而言，在 月:技術之欄位，列舉顯示器之顯示面板，來作為一例子， 旦是’本發明係不僅是採用於前述特定者，此外，也可以 導體積電路之凸塊和軟性電路基板間之連接以及 此:電間之連接等’能夠有助於提升採用這 二千機态之可靠性。 【圖式簡單說明】 俯視Γ圖係說明FPC端部之構造和假固定acf之位置之 之狀明在習知之熱壓接裝置、在FPC假固定仰 14 1287902 第三圖係說明同樣假固定結束之狀況之剖面圖。 第四圖係說明在關於本發明之熱壓接裝置之第一實 施形態、在FPC假固定ACF之狀況之剖面圖。 第五圖係說明同樣假固定結束之狀況之剖面圖。 第六圖係擴大及顯示第四圖之C和D部分之剖面圖。 第七圖係說明在關於本發明之熱壓接裝置之第二實 施形態、在FPC假固定ACF之狀況之剖面圖。 第八圖係顯示將形成在關於本發明之熱壓接裝置之 支承台座之凹部之理想深度予以求出之實驗結果之圖。 【主要元件符號說明】 α角度 Α部分 β部分 C部分 D部分 1 FPC (軟性電路基板） 2 基底構件 3 電極配線 3 a 露出部分 3 b 金電鍍 4 絕緣阻劑層 5 ACF (異方性導電膜） 10 支承台座 1 0 a 平面狀台座本體 1 Ob 板狀輔助體 1 0 c 傾斜面 15 1287902 l〇s 載置面 11 熱壓接頂頭 13a 空間 13b 空間 1 3 c空間 14 凹部 16 吸引孔1287902 IX. Description of the Invention: [Technical Field] The present invention relates to a method of pseudo-fixing anisotropy formed on a flexible circuit substrate (FP (^) a technique of a conductive film (in the case of F = An i sotrop ic Conduct), in particular, a method of thermocompression bonding and thermocompression bonding in the pseudo-fixing process, by the aforementioned thermocompression bonding method A flexible circuit board and an electronic device on which the circuit board is mounted. [Prior Art] It is required to have a high-definition image display function and achieve a low-profile 1 low consumption in the spread of a mobile phone or a portable PDA. In the display panel of the electric power, the liquid crystal display panel has been used as a display panel that satisfies this requirement, and has been used in many products. In addition, an organic EL which is a characteristic of a self-luminous type of light-emitting element has recently been used. In the electronic device of the aforementioned part, this system replaces the display panel of the next generation of the conventional liquid crystal display panel and is in this way. The display panel has a plurality of data lines arranged in stripes on the transparent substrate constituting the panel, and a plurality of scanning lines orthogonal to the data lines, and the intersection positions between the data lines and the scanning lines are respectively, for example, a matrix. The display pixels are formed in a shape. The respective data lines and the respective scanning lines may be connected to the flexible circuit board (hereinafter also referred to as FPC) at each end portion of the transparent substrate constituting the display panel. The drive signal from the 1287902 pixel drive data driver and the scan driver is received through a plurality of electrode wirings arranged in the FPC. As described above, for example, as a data line and a scan line on a transparent substrate constituting the display panel. Further, the means for connecting the respective electrode wirings of the flexible circuit board is a means for mutually connecting by an anisotropic conductive film (hereinafter also referred to as ACF) by thermocompression bonding. The ACF is thermoplastic or thermosetting. Dispersing a large number of conductive particles in the resin film, by using a predetermined pressure When the thermocompression bonding head is connected, the conductive particles are connected between the terminals of the pair of electrodes, and the conductivity in a single direction is displayed, whereby the conduction between the terminals can be obtained, and the mechanical connection is also achieved. Therefore, the ACF is used. The thermocompression bonding means is as described above, in order to appropriately utilize a state in which a plurality of inter-terminal groups are connected in a collective manner. As described above, in order to utilize the ACF, for example, a data line or a scanning line on a transparent substrate constituting a display panel. To heat-bond the Fpc, the surface first performs the process of falsely fixing the ACF to the electrode wiring surface of the FPC. By means of the data line or the scanning line on the transparent substrate, = solid, the ACF of the FPC, by the FPC At the beginning of the back side, the FPC electrode wiring is connected to the transparent substrate by the previous ACF through the ACF. The feed line performs the FPC to the display panel surface by performing a fake fixed ACF for the process of pre-fixing the ACF, for example, for the FPC: ", discloses the patent document i that has been filed by the applicant of the present application. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-86999. However, the FPC system in which the circuit is connected to the surface of the display panel by the ACF, for example, on the surface of the flexible film-like base member, forms a copper pig. Electrode wiring) and a structure in which an insulating resist is applied thereon. Then, the structure in which the electrode wiring is exposed without applying an insulating resist in the region where the ACF is described is assumed. / The figure = shows the example, expanding and displaying the end. Symbol 2 is a thin, difficult base member that does not constitute FPG1. On the bottom member 2, as in the case of a broken line, the electrode wirings 3 formed by the copper boxes are formed in a stripe shape with each other, and the surface of the electrode wiring 3 is formed except for the portion described later. The surface is also coated with an insulating tape to form an insulating resist layer 4. The rectangular region enclosed by the chain line indicated by the symbol 5 is the region of the same _5, the aforementioned insulation; θ糸 causes the electrode wiring in the region of the ACF5 to become a resist. The unformed (unpainted) portion of the layer. That is, the two yoke lines form a dragon and a disgust by the hatching area indicated by the symbol 3a. In the exposed portion 3a of the electrode wiring, the hatching is displayed in the state of positive = no white, and gold = b 〇, ★ electric forging is performed in accordance with the need. As the face is described, the ACF5 covers the exposed portion of the electrode wiring. At the same time, the body is also fixed in a false manner and also covers the periphery of the application: r: / layer 4 part. This is the insulation resistance agent Tang 4 of the boundary of the attachment =, the county is weak and concentrated stress, when the role of repeated bending and other forces, points: raw rupture. Therefore, in order to avoid the aforementioned problem, the solid portion is widely covered with the exposed portion 3 including the electrode wiring 3, and the region where the layer 4 is formed. The first and third figures show the status of the ACF5 for the FPC1 configuration shown in the first figure. That is to say, the Fpcl of the second and third figures is displayed in a cross-sectional view of the A portion of the figure. The music diagrams and the third diagrams are by the same symbols and are part of the various parts shown in the figures. The strong-figure-graph and the third figure show that the ACF5 is fixed on the FPC1. 'FPC1 is placed on the support pedestal 1 that constitutes the thermocompression bonding device. The bismuth pedestal 1Q is composed of a harder H and a smaller heat transfer coefficient. The remaining surface of the circuit board i Q s is I:: as in F5 The mounting position is as described above for the deposition of the electrode wiring 3 and the mounting of the insulating resist layer 4 of the third layer. Under the sorrow, as shown in the second figure, due to the space on the back side of the resistor _ 4 t 5, a relatively large space is created. Two Li!: As shown in the second figure, the soil that constitutes the thermocompression device = head! I heat up Peng, and at the same time, connect this to the side of the Qing. Hunting makes the head of the tree that constitutes ACF5 1 1 饤 而 而 而 而 F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F The difference between the cut layers 4 exists. Therefore, there is a problem that the space work 287902 3 b which remains on the back side of the (10) is formed. The air remaining in the sealed space 1 3 b is heated by the heat from the thermocompression bonding head during the subsequent final pressure bonding, and the electrical connection between the exposed portion 3 a of the electrode wiring occurs. problem. In order to avoid the aforementioned problems, it is considered that, for example, a dissipative pattern of air is prepared in advance in the insulating resist layer 4. However, since the resist layer 4 is generally formed by screen printing, an error of about 3 legs is generated, and it is not easy to form a dispersive pattern of fine air corresponding to the fine pitch electrode terminals (between the electrode wires 3). . Further, if a screen or the like is used to avoid screen printing, a fine air dissipating pattern can be formed in the resist layer 4, so that the "receiving member" is complicated and the cost is increased. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems; the subject of the present invention is to provide a method for pseudo-fixing an anisotropic conductive film on a flexible circuit substrate to extremely reduce the f-plate and anisotropy. Conductively closing a thermocompression bonding device and a thermocompression bonding method for sealing = degree = degree; providing a soft circuit substrate for sin and a transfer of the flexible circuit substrate to the present invention The thermocompression bonding ^ is in the thermal bonding process of the electrode 疋 性 导电 导电 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 异 异 异The surface of the flexible circuit board of the thermocompression bonding pedestal of the thermocompression bonding head of the conductive film is the same as the heat of the concave portion of the depth of the base member having a thickness of 2° to 1 _. The soft circuit board is formed on the U-shaped wiring surface of the flexible earth-moving board, and the flexible circuit board is provided with a structure in which the film-shaped base member and the west electrode = the electrode wiring portion are laminated. The aforementioned insulating resist layer The boundary portion is disposed at the position where the recess and the recess are formed, and the mounting surface of the flexible circuit board of the shunt=seat of the electrode wiring is covered by the second conductive layer, and the electrode wiring is covered. Only the exposed portion of the electrode wiring of the boundary portion between the dislocations is placed; the layered conductive film is abutted against the fine head, and the anisotropic conduction is fixed for the front and the right side. In the case of the film, there is a special circuit board. [Embodiment] Hereinafter, the thermal compression bonding method according to the present invention will be described based on the fourth thermocompression bonding apparatus. Further, even in the following method of attaching the device and the thermocompression bonding method, the hot pressing of the present invention is used, and the fpc corresponding to the third indefinite is displayed by the same symbol. The detailed description is omitted as appropriate. The fourth and fifth figures of each of the adjacent parts of the pin-up display show the configuration of the first embodiment, the support pedestal 10 of the thermo-compression device t, and the crimping device, at 10 1287902 The mounting surface of the flexible circuit board is then smashed into the FPC1. The recessed portion of the pedestal 1 and the boundary between the slabs 4 are disposed at the position where the exposed portion 3a is located so as to be on the electrode wiring. The mounting surface of the FPC supporting the pedestal i 〇s is placed on the support pedestal 1 () such that the end portion enters into the support pedestal: that is, the film-like base member constituting the Fpci 2 and the electrode to 3 series of materials have a callability, due to the amount of money, it is not the same as the four. Therefore, the insulating resist layer 4 laminated on the end of the FPC 1 is also deformed as in the fourth drawing, and the difference between the insulating resist layer 4 and the exposed portion 3 a of the electrode wiring is compared with the first The example shown in the second picture becomes very small. In this state, as shown in the fourth figure, in the case where the ACF 5 is placed, the space 丨3 e (4) formed on the back side of the lion is small. Therefore, in this state, as shown in the fifth figure, in the case where the ACF 5 is heated and crimped by the pressure-bonding head, the state in which the air is hardly accumulated on the back side of the ACF 5 can be above the FPC 1. 'Fake fixed secret. Therefore, even when the main pressure is applied to another substrate such as a display panel, the above-mentioned problems caused by the accumulation of air existing on the back side of the ACF 5 can be avoided. The sixth figure expands and displays a portion of the aforementioned support pedestal i , which is shown in the C&D portion surrounded by a broken line in the fourth figure. The support 11 1287902 i (10): 1 pedestal body 1 〇 3 to coincide with the kiss ^ ίο s. Next, the upper surface of the body 1 〇b is taken as the mounting surface body 10b, and the non-overlapping portion of the auxiliary body, that is, the non-overlapping auxiliary portion is formed, and the concave portion 14 is formed. The nt is formed by the recessed portion 14 and is raised on the FPC mounting surface 10 S S... to have an inclined face center with respect to the concave portion 14 h. In addition, in the sixth figure, the degree = α is 130, and the sound is one. Because the above-mentioned α becomes 9()# in the excess state, that is, the 90 degree is replaced by the heart, the inclination of the head 11 becomes very large, 'relatively' In the state in which the angle and the inclined surface are 10 C, the FPC 1 is damaged. The reason is that the depth of the concave portion 14 of the supporting pedestal 1 两 is formed in the depth f, in other words, in the implementation. The thickness of the pedestal body 1 Q a is = = 体 10 10 10 10 10 10 10 最好 最好 最好 F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F In a state where the value is more shallow than the above value, the degree of the aforementioned effect obtained by providing the concave is reduced. When the depth of the concave portion 14 is further deeper than the aforementioned value, the head 1 1 is thermally crimped. When the crimping is caused, the FPC1 is deformed: the degree of the concave side of the concave portion becomes larger, and in the part, the thermal crimping is bad. This "^ concave. The depth of the 卩1 4 is deeper than the aforementioned value. In the case of being offset by the thermocompression, the so-called electrode that is associated with the FPC1 also occurs. Other problems of the cutting of the wire 3. 12 1287902 As an example, the thickness of the member 2 is made 25_, the electrode wiring % is the base structure, and the thickness of the insulating resist layer 4 is 5 to 2, and the thickness becomes 12/. Zm and the data of the concave portion 1 formed on the support pedestal 求出 is obtained as a sample, and is shown in the eighth figure. In addition, the thickness of the layer is as described above in the experiment of the absolute = ideal enthalpy. A considerable amount of unevenness occurs in a single substrate. Y forms the resist layer 4, and the experimental data shown in the eighth figure shows that the phase (%) is thicker than the base member 2 constituting the FPC1. The result of the relationship of %) can be obtained by the first hot-pressed good product. In particular, the recessed portion 14 having the thickness of the base member having the FPC and the degree of the face is preferably taken, and it is preferable to use a recessed portion 14 Having "20~(10)% depth followed by two: the figure shows a second embodiment of the thermocompression bonding apparatus of the present invention by a cross-sectional view, which corresponds to the second embodiment of the invention The fourth figure of the embodiment. In the second embodiment of the seventh embodiment, the concave portion 14 formed in the support base 1 is opened, and the number of the suction holes 1 is set to be placed on the support base 10. The back of the _ is sucked and fixed to the side of the recess 14 . Therefore, in the form of the support pedestal 10 which constitutes the thermocompression bonding apparatus shown in Fig. 7, the back surface of the FPC 1 is on the side of the concave portion 14 of the FPC 1, and therefore, in the state where the FPC 1 is placed _ The volume of the space 丄3 c formed on the back side of the ACF 5 can be made smaller. It is possible to make the probability of residual air between FpCi and ACF5 become lower by using the thermocompression bonding of the butting head to add the pressure 13 1287902 to the ACF 5 so as to be falsely fixed on the FpC1. The embodiment shown in the fourth to seventh embodiments of the above description shows the heat treatment of the end portion of the flexible circuit board i shown in Fig. 1, that is, the heat of the A portion of the flexible circuit substrate. The part of the crimping device is configured, but even in the portion B shown in the first figure, the same problem has been explained, so even if the supporting pedestal of the portion B shown in the figure is processed, The same recess 14 is formed in contrast. ^ By using the thermal crimping device and the thermocompression bonding method of the present invention, I: a soft circuit substrate with a conductive film, the circuit board and the anisotropic conduction can be extremely reduced. In the case of the degree of closing m between the films, it is possible to provide a flexible circuit board that improves electrical reliability and an electronic device in which the flexible circuit board is mounted. In addition, in the case of the electronic device using the flexible circuit board, the display panel of the display is listed in the column of the technology: as an example, the present invention is not only applied to the specific one, In addition, the connection between the bump of the volumetric circuit and the flexible circuit substrate and the connection between the electrical and the like can also help to improve the reliability of adopting the two thousand states. [Simplified description of the drawing] The top view shows the structure of the FPC end and the position of the false fixed acf. The conventional thermocompression bonding device, the FPC false fixed elevation 14 1287902, the third figure shows the same false fixed end. A cross-sectional view of the condition. Fig. 4 is a cross-sectional view showing the state in which the FCF is falsely fixed in the FPC in the first embodiment of the thermocompression bonding apparatus of the present invention. The fifth figure is a cross-sectional view showing the state of the same false end. The sixth drawing expands and displays a cross-sectional view of portions C and D of the fourth figure. Fig. 7 is a cross-sectional view showing the state in which the ACF is falsely fixed in the FPC in the second embodiment of the thermocompression bonding apparatus of the present invention. Fig. 8 is a view showing an experimental result obtained by determining the desired depth of the concave portion of the support pedestal of the thermocompression bonding apparatus of the present invention. [Description of main component symbols] α angle Α part β section C part D part 1 FPC (flex circuit board) 2 base member 3 electrode wiring 3 a exposed portion 3 b gold plating 4 insulating resist layer 5 ACF (isotropic conductive film 10 Support pedestal 10 0 a Plane pedestal body 1 Ob Plate-shaped auxiliary body 1 0 c Inclined surface 15 1287902 l〇s Mounting surface 11 Thermocompression bonding head 13a Space 13b Space 1 3 c Space 14 Concave 16 Suction hole
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