TW200517486A - Liquid supplying method and apparatus - Google Patents
Liquid supplying method and apparatusInfo
- Publication number
- TW200517486A TW200517486A TW093131616A TW93131616A TW200517486A TW 200517486 A TW200517486 A TW 200517486A TW 093131616 A TW093131616 A TW 093131616A TW 93131616 A TW93131616 A TW 93131616A TW 200517486 A TW200517486 A TW 200517486A
- Authority
- TW
- Taiwan
- Prior art keywords
- supplied liquid
- circulation pipe
- main fluid
- liquid
- supplying
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title abstract 12
- 239000012530 fluid Substances 0.000 abstract 7
- 229910021642 ultra pure water Inorganic materials 0.000 abstract 1
- 239000012498 ultrapure water Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J4/00—Feed or outlet devices; Feed or outlet control devices
- B01J4/02—Feed or outlet devices; Feed or outlet control devices for feeding measured, i.e. prescribed quantities of reagents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/30—Injector mixers
- B01F25/31—Injector mixers in conduits or tubes through which the main component flows
- B01F25/315—Injector mixers in conduits or tubes through which the main component flows wherein a difference of pressure at different points of the conduit causes introduction of the additional component into the main component
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/02—Burettes; Pipettes
- B01L3/0289—Apparatus for withdrawing or distributing predetermined quantities of fluid
- B01L3/0293—Apparatus for withdrawing or distributing predetermined quantities of fluid for liquids
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
- Y10T137/0329—Mixing of plural fluids of diverse characteristics or conditions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/206—Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
- Y10T137/2076—Utilizing diverse fluids
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/87571—Multiple inlet with single outlet
- Y10T137/87676—With flow control
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003361174 | 2003-10-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200517486A true TW200517486A (en) | 2005-06-01 |
TWI367944B TWI367944B (en) | 2012-07-11 |
Family
ID=34463432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093131616A TWI367944B (en) | 2003-10-21 | 2004-10-19 | Liquid supplying method and apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US8171956B2 (zh) |
JP (1) | JP3866274B2 (zh) |
KR (1) | KR101061142B1 (zh) |
CN (1) | CN100477102C (zh) |
TW (1) | TWI367944B (zh) |
WO (1) | WO2005038895A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030229393A1 (en) * | 2001-03-15 | 2003-12-11 | Kutryk Michael J. B. | Medical device with coating that promotes cell adherence and differentiation |
CN103357610B (zh) * | 2013-07-18 | 2015-05-06 | 宜昌南玻硅材料有限公司 | 一种集中补液系统及补液方法 |
KR101981966B1 (ko) * | 2015-04-13 | 2019-05-24 | 디아이씨 가부시끼가이샤 | 비저항값 조정 장치 및 비저항값 조정 방법 |
JP2017154298A (ja) * | 2016-02-29 | 2017-09-07 | 東芝テック株式会社 | 液体循環装置、及び液体吐出装置 |
CN112842771B (zh) * | 2021-02-03 | 2023-03-24 | 潍坊医学院附属医院 | 一种内分泌科糖尿病足用清创装置 |
TW202302215A (zh) * | 2021-07-01 | 2023-01-16 | 日商Dic股份有限公司 | 比電阻值調整裝置以及比電阻值調整方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3410531A (en) * | 1967-05-19 | 1968-11-12 | United Shoe Machinery Corp | Mixing apparatus |
NL160373C (nl) * | 1968-11-08 | 1979-10-15 | Wavin Bv | Pijpverbindingsstuk voor pijpen met uitwendige schroeflijn- vormige ruggen. |
JPS6048160A (ja) * | 1983-08-25 | 1985-03-15 | Asahi Okuma Ind Co Ltd | 二液混合吐出方法及び装置 |
US5016817A (en) * | 1989-11-08 | 1991-05-21 | University Of Georgia Research Foundation, Inc. | Pesticide spraying device and method |
JPH0760082A (ja) * | 1993-08-31 | 1995-03-07 | Mitsubishi Rayon Co Ltd | 超純水の比抵抗調整方法及び装置 |
JPH10324502A (ja) * | 1997-05-21 | 1998-12-08 | Dainippon Ink & Chem Inc | 超純水の炭酸ガス付加装置及び付加方法 |
JP4135780B2 (ja) | 1997-08-29 | 2008-08-20 | ユーシーティー株式会社 | 薬液定量注入装置および方法 |
JPH11139804A (ja) | 1997-11-11 | 1999-05-25 | Dainippon Ink & Chem Inc | 超純水の比抵抗調整装置及び調整方法 |
JP2000208471A (ja) * | 1999-01-11 | 2000-07-28 | Kurita Water Ind Ltd | 電子材料用洗浄水の調製装置 |
JP2001271868A (ja) | 2000-03-24 | 2001-10-05 | Canon Inc | 除振装置 |
TWI275436B (en) * | 2002-01-31 | 2007-03-11 | Ebara Corp | Electrochemical machining device, and substrate processing apparatus and method |
JP4332329B2 (ja) | 2002-02-26 | 2009-09-16 | 三菱レイヨン株式会社 | 中空糸膜モジュールの製造装置並びに製造方法 |
EP1540705A4 (en) * | 2002-07-19 | 2009-12-16 | Entegris Inc | LIQUID FLOW CONTROL AND PRECISION DELIVERY DEVICE AND SYSTEM |
EP1598105B8 (en) * | 2003-02-03 | 2010-05-19 | Toyo Boseki Kabushiki Kaisha | Hollow fiber membrane module and module arrangement group thereof |
-
2004
- 2004-10-15 CN CNB2004800308341A patent/CN100477102C/zh active Active
- 2004-10-15 US US10/574,954 patent/US8171956B2/en active Active
- 2004-10-15 WO PCT/JP2004/015644 patent/WO2005038895A1/ja active Application Filing
- 2004-10-15 KR KR1020067008305A patent/KR101061142B1/ko active IP Right Grant
- 2004-10-15 JP JP2005514871A patent/JP3866274B2/ja active Active
- 2004-10-19 TW TW093131616A patent/TWI367944B/zh active
Also Published As
Publication number | Publication date |
---|---|
US8171956B2 (en) | 2012-05-08 |
KR20060115378A (ko) | 2006-11-08 |
JPWO2005038895A1 (ja) | 2007-02-01 |
TWI367944B (en) | 2012-07-11 |
US20070125423A1 (en) | 2007-06-07 |
WO2005038895A1 (ja) | 2005-04-28 |
JP3866274B2 (ja) | 2007-01-10 |
CN100477102C (zh) | 2009-04-08 |
KR101061142B1 (ko) | 2011-08-31 |
CN1871693A (zh) | 2006-11-29 |
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