TW200517486A - Liquid supplying method and apparatus - Google Patents

Liquid supplying method and apparatus

Info

Publication number
TW200517486A
TW200517486A TW093131616A TW93131616A TW200517486A TW 200517486 A TW200517486 A TW 200517486A TW 093131616 A TW093131616 A TW 093131616A TW 93131616 A TW93131616 A TW 93131616A TW 200517486 A TW200517486 A TW 200517486A
Authority
TW
Taiwan
Prior art keywords
supplied liquid
circulation pipe
main fluid
liquid
supplying
Prior art date
Application number
TW093131616A
Other languages
English (en)
Other versions
TWI367944B (en
Inventor
Toshikazu Suganuma
Yasushi Tomita
Kazunari Sakai
Naoki Hada
Katsuhiko Kazama
Original Assignee
Dainippon Ink & Chemicals
Kitz Sct Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink & Chemicals, Kitz Sct Corp filed Critical Dainippon Ink & Chemicals
Publication of TW200517486A publication Critical patent/TW200517486A/zh
Application granted granted Critical
Publication of TWI367944B publication Critical patent/TWI367944B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J4/00Feed or outlet devices; Feed or outlet control devices
    • B01J4/02Feed or outlet devices; Feed or outlet control devices for feeding measured, i.e. prescribed quantities of reagents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/30Injector mixers
    • B01F25/31Injector mixers in conduits or tubes through which the main component flows
    • B01F25/315Injector mixers in conduits or tubes through which the main component flows wherein a difference of pressure at different points of the conduit causes introduction of the additional component into the main component
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/02Burettes; Pipettes
    • B01L3/0289Apparatus for withdrawing or distributing predetermined quantities of fluid
    • B01L3/0293Apparatus for withdrawing or distributing predetermined quantities of fluid for liquids
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/0318Processes
    • Y10T137/0324With control of flow by a condition or characteristic of a fluid
    • Y10T137/0329Mixing of plural fluids of diverse characteristics or conditions
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/206Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
    • Y10T137/2076Utilizing diverse fluids
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/8593Systems
    • Y10T137/87571Multiple inlet with single outlet
    • Y10T137/87676With flow control

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW093131616A 2003-10-21 2004-10-19 Liquid supplying method and apparatus TWI367944B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003361174 2003-10-21

Publications (2)

Publication Number Publication Date
TW200517486A true TW200517486A (en) 2005-06-01
TWI367944B TWI367944B (en) 2012-07-11

Family

ID=34463432

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093131616A TWI367944B (en) 2003-10-21 2004-10-19 Liquid supplying method and apparatus

Country Status (6)

Country Link
US (1) US8171956B2 (zh)
JP (1) JP3866274B2 (zh)
KR (1) KR101061142B1 (zh)
CN (1) CN100477102C (zh)
TW (1) TWI367944B (zh)
WO (1) WO2005038895A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030229393A1 (en) * 2001-03-15 2003-12-11 Kutryk Michael J. B. Medical device with coating that promotes cell adherence and differentiation
CN103357610B (zh) * 2013-07-18 2015-05-06 宜昌南玻硅材料有限公司 一种集中补液系统及补液方法
KR101981966B1 (ko) * 2015-04-13 2019-05-24 디아이씨 가부시끼가이샤 비저항값 조정 장치 및 비저항값 조정 방법
JP2017154298A (ja) * 2016-02-29 2017-09-07 東芝テック株式会社 液体循環装置、及び液体吐出装置
CN112842771B (zh) * 2021-02-03 2023-03-24 潍坊医学院附属医院 一种内分泌科糖尿病足用清创装置
TW202302215A (zh) * 2021-07-01 2023-01-16 日商Dic股份有限公司 比電阻值調整裝置以及比電阻值調整方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3410531A (en) * 1967-05-19 1968-11-12 United Shoe Machinery Corp Mixing apparatus
NL160373C (nl) * 1968-11-08 1979-10-15 Wavin Bv Pijpverbindingsstuk voor pijpen met uitwendige schroeflijn- vormige ruggen.
JPS6048160A (ja) * 1983-08-25 1985-03-15 Asahi Okuma Ind Co Ltd 二液混合吐出方法及び装置
US5016817A (en) * 1989-11-08 1991-05-21 University Of Georgia Research Foundation, Inc. Pesticide spraying device and method
JPH0760082A (ja) * 1993-08-31 1995-03-07 Mitsubishi Rayon Co Ltd 超純水の比抵抗調整方法及び装置
JPH10324502A (ja) * 1997-05-21 1998-12-08 Dainippon Ink & Chem Inc 超純水の炭酸ガス付加装置及び付加方法
JP4135780B2 (ja) 1997-08-29 2008-08-20 ユーシーティー株式会社 薬液定量注入装置および方法
JPH11139804A (ja) 1997-11-11 1999-05-25 Dainippon Ink & Chem Inc 超純水の比抵抗調整装置及び調整方法
JP2000208471A (ja) * 1999-01-11 2000-07-28 Kurita Water Ind Ltd 電子材料用洗浄水の調製装置
JP2001271868A (ja) 2000-03-24 2001-10-05 Canon Inc 除振装置
TWI275436B (en) * 2002-01-31 2007-03-11 Ebara Corp Electrochemical machining device, and substrate processing apparatus and method
JP4332329B2 (ja) 2002-02-26 2009-09-16 三菱レイヨン株式会社 中空糸膜モジュールの製造装置並びに製造方法
EP1540705A4 (en) * 2002-07-19 2009-12-16 Entegris Inc LIQUID FLOW CONTROL AND PRECISION DELIVERY DEVICE AND SYSTEM
EP1598105B8 (en) * 2003-02-03 2010-05-19 Toyo Boseki Kabushiki Kaisha Hollow fiber membrane module and module arrangement group thereof

Also Published As

Publication number Publication date
US8171956B2 (en) 2012-05-08
KR20060115378A (ko) 2006-11-08
JPWO2005038895A1 (ja) 2007-02-01
TWI367944B (en) 2012-07-11
US20070125423A1 (en) 2007-06-07
WO2005038895A1 (ja) 2005-04-28
JP3866274B2 (ja) 2007-01-10
CN100477102C (zh) 2009-04-08
KR101061142B1 (ko) 2011-08-31
CN1871693A (zh) 2006-11-29

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