TW200515971A - Porous polyurethane polishing pads - Google Patents

Porous polyurethane polishing pads

Info

Publication number
TW200515971A
TW200515971A TW093119592A TW93119592A TW200515971A TW 200515971 A TW200515971 A TW 200515971A TW 093119592 A TW093119592 A TW 093119592A TW 93119592 A TW93119592 A TW 93119592A TW 200515971 A TW200515971 A TW 200515971A
Authority
TW
Taiwan
Prior art keywords
polishing
polishing pads
porous
porous polyurethane
polyurethane polishing
Prior art date
Application number
TW093119592A
Other languages
English (en)
Other versions
TWI327503B (en
Inventor
Clyde A Fawcett
Todd T Crkvenac
Kenneth A Prygon
Bernard Foster
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200515971A publication Critical patent/TW200515971A/zh
Application granted granted Critical
Publication of TWI327503B publication Critical patent/TWI327503B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S451/00—Abrading
    • Y10S451/921—Pad for lens shaping tool
TW093119592A 2003-07-30 2004-06-30 Porous polishing pads, use thereof and methods of preparing porous polishing pads TWI327503B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/630,255 US6899602B2 (en) 2003-07-30 2003-07-30 Porous polyurethane polishing pads

Publications (2)

Publication Number Publication Date
TW200515971A true TW200515971A (en) 2005-05-16
TWI327503B TWI327503B (en) 2010-07-21

Family

ID=33541495

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119592A TWI327503B (en) 2003-07-30 2004-06-30 Porous polishing pads, use thereof and methods of preparing porous polishing pads

Country Status (6)

Country Link
US (1) US6899602B2 (zh)
EP (1) EP1502703B1 (zh)
JP (1) JP2005101541A (zh)
KR (1) KR101107652B1 (zh)
CN (1) CN1583842A (zh)
TW (1) TWI327503B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI405638B (zh) * 2007-10-03 2013-08-21 Fujibo Holdings Inc 研磨布

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US7058719B2 (en) * 2002-07-22 2006-06-06 Ricoh Company, Ltd. System, computer program product and method for managing and controlling a local network of electronic devices and reliably and securely adding an electronic device to the network
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
JP4555559B2 (ja) * 2003-11-25 2010-10-06 富士紡ホールディングス株式会社 研磨布及び研磨布の製造方法
JP4736514B2 (ja) * 2004-04-21 2011-07-27 東レ株式会社 研磨布
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
US20060065290A1 (en) * 2004-09-28 2006-03-30 Jerry Broz Working surface cleaning system and method
US7208325B2 (en) * 2005-01-18 2007-04-24 Applied Materials, Inc. Refreshing wafers having low-k dielectric materials
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
US20070117393A1 (en) * 2005-11-21 2007-05-24 Alexander Tregub Hardened porous polymer chemical mechanical polishing (CMP) pad
US20070161720A1 (en) * 2005-11-30 2007-07-12 Applied Materials, Inc. Polishing Pad with Surface Roughness
US7494404B2 (en) * 2006-02-17 2009-02-24 Chien-Min Sung Tools for polishing and associated methods
US7241206B1 (en) * 2006-02-17 2007-07-10 Chien-Min Sung Tools for polishing and associated methods
US8765259B2 (en) * 2007-02-15 2014-07-01 San Fang Chemical Industry Co., Ltd. Carrier film for mounting polishing workpiece and method for making the same
US8012000B2 (en) * 2007-04-02 2011-09-06 Applied Materials, Inc. Extended pad life for ECMP and barrier removal
TW200942361A (en) * 2008-04-11 2009-10-16 San Fang Chemical Industry Co Polishing pad and method for making the same
US8303375B2 (en) 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
JP5567280B2 (ja) * 2009-02-06 2014-08-06 富士紡ホールディングス株式会社 研磨パッド
CN101850541B (zh) * 2009-04-02 2013-05-08 贝达先进材料股份有限公司 具有阻绝层的抛光垫和其制造方法
US8162728B2 (en) * 2009-09-28 2012-04-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Dual-pore structure polishing pad
JP5428793B2 (ja) * 2009-11-17 2014-02-26 旭硝子株式会社 ガラス基板研磨方法および磁気記録媒体用ガラス基板の製造方法
US8371316B2 (en) 2009-12-03 2013-02-12 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
JP5697889B2 (ja) * 2010-04-19 2015-04-08 帝人コードレ株式会社 平滑加工用シート
JP5858576B2 (ja) * 2011-04-21 2016-02-10 東洋ゴム工業株式会社 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層
US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
US10259099B2 (en) * 2016-08-04 2019-04-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapering method for poromeric polishing pad
US10106662B2 (en) * 2016-08-04 2018-10-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Thermoplastic poromeric polishing pad
US9825000B1 (en) 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
US11434095B2 (en) 2018-02-23 2022-09-06 International Test Solutions, Llc Material and hardware to automatically clean flexible electronic web rolls
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11667061B2 (en) * 2020-04-18 2023-06-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming leveraged poromeric polishing pad
US20210323116A1 (en) * 2020-04-18 2021-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Offset pore poromeric polishing pad
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
CN114701105B (zh) * 2021-04-27 2024-04-19 宁波赢伟泰科新材料有限公司 一种化学机械抛光垫及其制备方法
CN114406895B (zh) * 2022-01-14 2022-09-16 广东粤港澳大湾区黄埔材料研究院 高孔隙率高模量抛光层及其制备方法与抛光垫及其应用

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US4841680A (en) * 1987-08-25 1989-06-27 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
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US6284114B1 (en) * 1997-09-29 2001-09-04 Rodel Holdings Inc. Method of fabricating a porous polymeric material by electrophoretic deposition
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US6117000A (en) * 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
WO2000030159A1 (en) * 1998-11-18 2000-05-25 Rodel Holdings, Inc. Method to decrease dishing rate during cmp in metal semiconductor structures
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JP2001202764A (ja) * 2000-01-17 2001-07-27 Kenwood Corp 車載用電子機器及びパネル回動制御方法
JP2001358101A (ja) * 2000-06-13 2001-12-26 Toray Ind Inc 研磨パッド
KR20020044737A (ko) * 2000-12-06 2002-06-19 윤종용 컨디셔닝 클리너를 포함하는 씨엠피 설비
JP2002200551A (ja) * 2000-12-28 2002-07-16 Jsr Corp 研磨装置用コンディショナー
JP2003017449A (ja) * 2001-06-28 2003-01-17 Hitachi Chem Co Ltd コンディショニングフリーｃｍｐパッド及び基板の研磨方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI405638B (zh) * 2007-10-03 2013-08-21 Fujibo Holdings Inc 研磨布

Also Published As

Publication number Publication date
US6899602B2 (en) 2005-05-31
JP2005101541A (ja) 2005-04-14
EP1502703A1 (en) 2005-02-02
US20050026552A1 (en) 2005-02-03
KR20050014688A (ko) 2005-02-07
EP1502703B1 (en) 2015-09-16
KR101107652B1 (ko) 2012-01-20
TWI327503B (en) 2010-07-21
CN1583842A (zh) 2005-02-23

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