TW200506555A - Method for forming photoresist pattern, method for forming wiring pattern, method for making semiconductor devices, electro-optical device and electronic apparatus - Google Patents

Method for forming photoresist pattern, method for forming wiring pattern, method for making semiconductor devices, electro-optical device and electronic apparatus

Info

Publication number
TW200506555A
TW200506555A TW093123392A TW93123392A TW200506555A TW 200506555 A TW200506555 A TW 200506555A TW 093123392 A TW093123392 A TW 093123392A TW 93123392 A TW93123392 A TW 93123392A TW 200506555 A TW200506555 A TW 200506555A
Authority
TW
Taiwan
Prior art keywords
forming
electro
optical device
semiconductor devices
electronic apparatus
Prior art date
Application number
TW093123392A
Other languages
English (en)
Other versions
TWI285800B (en
Inventor
Naoyuki Toyoda
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200506555A publication Critical patent/TW200506555A/zh
Application granted granted Critical
Publication of TWI285800B publication Critical patent/TWI285800B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/221—Changing the shape of the active layer in the devices, e.g. patterning by lift-off techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00—Climate change mitigation technologies for sector-wide applications
    • Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities
TW093123392A 2003-08-08 2004-08-04 Method for forming photoresist pattern, method for forming wiring pattern, method for making semiconductor devices, electro-optical device and electronic apparatus TWI285800B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003290658A JP2005064143A (ja) 2003-08-08 2003-08-08 レジストパターンの形成方法、配線パターンの形成方法、半導体装置の製造方法、電気光学装置及び電子機器

Publications (2)

Publication Number Publication Date
TW200506555A true TW200506555A (en) 2005-02-16
TWI285800B TWI285800B (en) 2007-08-21

Family

ID=34368624

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093123392A TWI285800B (en) 2003-08-08 2004-08-04 Method for forming photoresist pattern, method for forming wiring pattern, method for making semiconductor devices, electro-optical device and electronic apparatus

Country Status (5)

Country Link
US (1) US20050074705A1 (zh)
JP (1) JP2005064143A (zh)
KR (1) KR20050019024A (zh)
CN (1) CN100375239C (zh)
TW (1) TWI285800B (zh)

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US8097400B2 (en) * 2005-02-22 2012-01-17 Hewlett-Packard Development Company, L.P. Method for forming an electronic device
JP2006332592A (ja) * 2005-04-28 2006-12-07 Ricoh Co Ltd 電気部品、導電パターンの形成方法、およびインクジェットヘッド
US7198879B1 (en) 2005-09-30 2007-04-03 Eastman Kodak Company Laser resist transfer for microfabrication of electronic devices
KR100676520B1 (ko) 2005-10-24 2007-02-01 삼성전자주식회사 포토레지스트 패턴 형성 방법
JP4913750B2 (ja) * 2005-11-21 2012-04-11 富士フイルム株式会社 感光性転写材料、隔壁及びその形成方法、光学素子及びその製造方法、並びに表示装置
JP4837396B2 (ja) * 2006-02-23 2011-12-14 富士フイルム株式会社 多層材料、及び樹脂パターンの形成方法
JP4762756B2 (ja) * 2006-02-23 2011-08-31 富士フイルム株式会社 多層材料及び樹脂パターンの形成方法
KR20080097410A (ko) * 2006-02-23 2008-11-05 후지필름 가부시키가이샤 다층재료, 수지패턴의 형성방법, 기판, 표시장치 및액정표시장치
US7867688B2 (en) * 2006-05-30 2011-01-11 Eastman Kodak Company Laser ablation resist
US20080233404A1 (en) * 2007-03-22 2008-09-25 3M Innovative Properties Company Microreplication tools and patterns using laser induced thermal embossing
KR100770274B1 (ko) 2007-06-13 2007-10-26 삼성에스디아이 주식회사 레지스트의 패턴형성방법
JP2009130180A (ja) * 2007-11-26 2009-06-11 Sony Corp 電子機器の製造方法および電子機器
WO2010005032A1 (ja) * 2008-07-09 2010-01-14 東洋合成工業株式会社 パターン形成方法
JP4892025B2 (ja) * 2008-09-26 2012-03-07 株式会社東芝 インプリント方法
JP5446434B2 (ja) * 2009-04-30 2014-03-19 Ｊｓｒ株式会社 ナノインプリントリソグラフィー用硬化性組成物及びナノインプリント方法
JP6012344B2 (ja) * 2011-10-24 2016-10-25 キヤノン株式会社 膜の形成方法
JP5848320B2 (ja) * 2013-12-20 2016-01-27 デクセリアルズ株式会社 円筒基材、原盤、及び原盤の製造方法
JP6839476B2 (ja) * 2016-09-26 2021-03-10 カンタツ株式会社 パターン形成用シート
CN107301973B (zh) * 2017-06-29 2021-04-13 惠科股份有限公司 一种阵列基板的制造方法及显示装置
JP2018207128A (ja) * 2018-09-12 2018-12-27 東芝メモリ株式会社 テンプレート、テンプレート基材、テンプレート形成方法、および半導体装置の製造方法

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Also Published As

Publication number Publication date
KR20050019024A (ko) 2005-02-28
CN100375239C (zh) 2008-03-12
CN1581436A (zh) 2005-02-16
US20050074705A1 (en) 2005-04-07
TWI285800B (en) 2007-08-21
JP2005064143A (ja) 2005-03-10

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MM4A Annulment or lapse of patent due to non-payment of fees