TW200506097A - Copper electrolytic solution containing a dialkyl amino group-containing polymer having a specific skeleton and an organic sulfur compound as additives, and an electrolytic copper foil prepared by the same - Google Patents
Copper electrolytic solution containing a dialkyl amino group-containing polymer having a specific skeleton and an organic sulfur compound as additives, and an electrolytic copper foil prepared by the sameInfo
- Publication number
- TW200506097A TW200506097A TW093117890A TW93117890A TW200506097A TW 200506097 A TW200506097 A TW 200506097A TW 093117890 A TW093117890 A TW 093117890A TW 93117890 A TW93117890 A TW 93117890A TW 200506097 A TW200506097 A TW 200506097A
- Authority
- TW
- Taiwan
- Prior art keywords
- copper foil
- amino group
- dialkyl amino
- electrolytic
- organic sulfur
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Laminated Bodies (AREA)
- Electrolytic Production Of Metals (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003202920 | 2003-07-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200506097A true TW200506097A (en) | 2005-02-16 |
TWI250226B TWI250226B (en) | 2006-03-01 |
Family
ID=34100616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93117890A TWI250226B (en) | 2003-07-29 | 2004-06-21 | Copper electrolytic solution containing a dialkyl amino group-containing polymer having a specific skeleton and an organic sulfur compound as additives, and an electrolytic copper foil prepared by the same |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4255130B2 (zh) |
KR (1) | KR100729061B1 (zh) |
CN (1) | CN1806067B (zh) |
TW (1) | TWI250226B (zh) |
WO (1) | WO2005010239A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101886914B1 (ko) | 2010-11-15 | 2018-08-08 | 제이엑스금속주식회사 | 전해 구리박 |
EP2735627A1 (en) | 2012-11-26 | 2014-05-28 | ATOTECH Deutschland GmbH | Copper plating bath composition |
JP5810197B2 (ja) * | 2013-09-11 | 2015-11-11 | 古河電気工業株式会社 | 電解銅箔、フレキシブル配線板及び電池 |
KR102377286B1 (ko) | 2017-03-23 | 2022-03-21 | 에스케이넥실리스 주식회사 | 리튬 이온 2차전지, 이 2차전지의 음극 전극을 구성하는 집전체 및 이 음극 집전체를 구성하는 전해동박 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57114685A (en) * | 1981-01-07 | 1982-07-16 | Kuraray Co Ltd | Brightener for plating bath |
JP3313277B2 (ja) * | 1995-09-22 | 2002-08-12 | 古河サーキットフォイル株式会社 | ファインパターン用電解銅箔とその製造方法 |
US5863410A (en) * | 1997-06-23 | 1999-01-26 | Circuit Foil Usa, Inc. | Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby |
JP3506411B2 (ja) * | 1997-12-29 | 2004-03-15 | 日本表面化学株式会社 | 亜鉛めっき方法 |
LU90532B1 (en) * | 2000-02-24 | 2001-08-27 | Circuit Foil Luxembourg Trading Sarl | Comosite copper foil and manufacturing method thereof |
KR100389061B1 (ko) * | 2002-11-14 | 2003-06-25 | 일진소재산업주식회사 | 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법 |
US20060011488A1 (en) * | 2002-12-25 | 2006-01-19 | Masashi Kumagai | Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same |
-
2004
- 2004-06-16 KR KR1020067000706A patent/KR100729061B1/ko active IP Right Grant
- 2004-06-16 JP JP2005511980A patent/JP4255130B2/ja not_active Expired - Lifetime
- 2004-06-16 WO PCT/JP2004/008791 patent/WO2005010239A1/ja active Application Filing
- 2004-06-16 CN CN200480016822.3A patent/CN1806067B/zh not_active Expired - Lifetime
- 2004-06-21 TW TW93117890A patent/TWI250226B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20060026963A (ko) | 2006-03-24 |
CN1806067B (zh) | 2010-06-16 |
KR100729061B1 (ko) | 2007-06-14 |
CN1806067A (zh) | 2006-07-19 |
TWI250226B (en) | 2006-03-01 |
JPWO2005010239A1 (ja) | 2006-09-07 |
WO2005010239A1 (ja) | 2005-02-03 |
JP4255130B2 (ja) | 2009-04-15 |
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