TW200503939A - Electronic component processing device, and method for temperature application in electronic component processing device - Google Patents

Electronic component processing device, and method for temperature application in electronic component processing device

Info

Publication number
TW200503939A
TW200503939A TW093115791A TW93115791A TW200503939A TW 200503939 A TW200503939 A TW 200503939A TW 093115791 A TW093115791 A TW 093115791A TW 93115791 A TW93115791 A TW 93115791A TW 200503939 A TW200503939 A TW 200503939A
Authority
TW
Taiwan
Prior art keywords
processing device
electronic component
component processing
temperature application
magazines
Prior art date
Application number
TW093115791A
Other languages
English (en)
Inventor
Hiroto Nakamura
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200503939A publication Critical patent/TW200503939A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW093115791A 2003-06-04 2004-06-02 Electronic component processing device, and method for temperature application in electronic component processing device TW200503939A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/007082 WO2004109304A1 (ja) 2003-06-04 2003-06-04 電子部品ハンドリング装置および電子部品ハンドリング装置における温度印加方法

Publications (1)

Publication Number Publication Date
TW200503939A true TW200503939A (en) 2005-02-01

Family

ID=33495919

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093115791A TW200503939A (en) 2003-06-04 2004-06-02 Electronic component processing device, and method for temperature application in electronic component processing device

Country Status (8)

Country Link
US (1) US20060104692A1 (zh)
EP (1) EP1637892B1 (zh)
JP (1) JPWO2004109304A1 (zh)
CN (1) CN1802568A (zh)
AU (1) AU2003242036A1 (zh)
DE (1) DE60318124T2 (zh)
TW (1) TW200503939A (zh)
WO (1) WO2004109304A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007023556A1 (ja) * 2005-08-25 2007-03-01 Advantest Corporation Ｔｃｐハンドリング装置
CN103219048A (zh) * 2012-01-19 2013-07-24 宇瞻科技股份有限公司 存储器模块的测试装置
KR20150108578A (ko) * 2014-03-18 2015-09-30 가부시키가이샤 어드밴티스트 온도 제어 장치 및 시험 시스템
US9885748B2 (en) * 2015-06-09 2018-02-06 International Business Machines Corporation Module testing utilizing wafer probe test equipment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5184068A (en) * 1990-09-24 1993-02-02 Symtek Systems, Inc. Electronic device test handler
JP2977337B2 (ja) * 1991-09-18 1999-11-15 株式会社富士通宮城エレクトロニクス リードフレーム検査装置
US5313156A (en) * 1991-12-04 1994-05-17 Advantest Corporation Apparatus for automatic handling
JP3567803B2 (ja) * 1999-07-08 2004-09-22 日立ハイテク電子エンジニアリング株式会社 Ｉｃデバイスの試験装置
US6476629B1 (en) * 2000-02-23 2002-11-05 Micron Technology, Inc. In-tray burn-in board for testing integrated circuit devices in situ on processing trays

Also Published As

Publication number Publication date
JPWO2004109304A1 (ja) 2006-07-20
DE60318124T2 (de) 2008-12-04
EP1637892A1 (en) 2006-03-22
WO2004109304A1 (ja) 2004-12-16
EP1637892B1 (en) 2007-12-12
AU2003242036A1 (en) 2005-01-04
CN1802568A (zh) 2006-07-12
EP1637892A4 (en) 2006-08-02
DE60318124D1 (de) 2008-01-24
US20060104692A1 (en) 2006-05-18

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