EP1637892A4 - Electronic component handling device, and method for temperature application in electronic component handling device - Google Patents

Electronic component handling device, and method for temperature application in electronic component handling device

Info

Publication number
EP1637892A4
EP1637892A4 EP03736028A EP03736028A EP1637892A4 EP 1637892 A4 EP1637892 A4 EP 1637892A4 EP 03736028 A EP03736028 A EP 03736028A EP 03736028 A EP03736028 A EP 03736028A EP 1637892 A4 EP1637892 A4 EP 1637892A4
Authority
EP
European Patent Office
Prior art keywords
electronic component
handling device
component handling
temperature application
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03736028A
Other languages
German (de)
French (fr)
Other versions
EP1637892A1 (en
EP1637892B1 (en
Inventor
Hiroto Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of EP1637892A1 publication Critical patent/EP1637892A1/en
Publication of EP1637892A4 publication Critical patent/EP1637892A4/en
Application granted granted Critical
Publication of EP1637892B1 publication Critical patent/EP1637892B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
EP03736028A 2003-06-04 2003-06-04 Electronic component handling device, and method for temperature application in electronic component handling device Expired - Lifetime EP1637892B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/007082 WO2004109304A1 (en) 2003-06-04 2003-06-04 Electronic component handling device, and method for temperature application in electronic component handling device

Publications (3)

Publication Number Publication Date
EP1637892A1 EP1637892A1 (en) 2006-03-22
EP1637892A4 true EP1637892A4 (en) 2006-08-02
EP1637892B1 EP1637892B1 (en) 2007-12-12

Family

ID=33495919

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03736028A Expired - Lifetime EP1637892B1 (en) 2003-06-04 2003-06-04 Electronic component handling device, and method for temperature application in electronic component handling device

Country Status (8)

Country Link
US (1) US20060104692A1 (en)
EP (1) EP1637892B1 (en)
JP (1) JPWO2004109304A1 (en)
CN (1) CN1802568A (en)
AU (1) AU2003242036A1 (en)
DE (1) DE60318124T2 (en)
TW (1) TW200503939A (en)
WO (1) WO2004109304A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4829889B2 (en) * 2005-08-25 2011-12-07 株式会社アドバンテスト TCP handling device
CN103219048A (en) * 2012-01-19 2013-07-24 宇瞻科技股份有限公司 Memory module testing device
KR20150108578A (en) * 2014-03-18 2015-09-30 가부시키가이샤 어드밴티스트 Temperature control apparatus and test system
US9885748B2 (en) * 2015-06-09 2018-02-06 International Business Machines Corporation Module testing utilizing wafer probe test equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5184068A (en) * 1990-09-24 1993-02-02 Symtek Systems, Inc. Electronic device test handler
US6414510B1 (en) * 1999-07-08 2002-07-02 Hitachi Electronics Engineering Co., Ltd. Testing apparatus and method of IC devices
US20020149389A1 (en) * 2000-02-23 2002-10-17 Bjork Russell S. In-tray burn-in board, device and test assembly for testing integrated circuit devices in situ on processing trays

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2977337B2 (en) * 1991-09-18 1999-11-15 株式会社富士通宮城エレクトロニクス Lead frame inspection equipment
US5313156A (en) * 1991-12-04 1994-05-17 Advantest Corporation Apparatus for automatic handling

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5184068A (en) * 1990-09-24 1993-02-02 Symtek Systems, Inc. Electronic device test handler
US6414510B1 (en) * 1999-07-08 2002-07-02 Hitachi Electronics Engineering Co., Ltd. Testing apparatus and method of IC devices
US20020149389A1 (en) * 2000-02-23 2002-10-17 Bjork Russell S. In-tray burn-in board, device and test assembly for testing integrated circuit devices in situ on processing trays

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2004109304A1 *

Also Published As

Publication number Publication date
EP1637892A1 (en) 2006-03-22
WO2004109304A1 (en) 2004-12-16
TW200503939A (en) 2005-02-01
DE60318124T2 (en) 2008-12-04
EP1637892B1 (en) 2007-12-12
AU2003242036A1 (en) 2005-01-04
JPWO2004109304A1 (en) 2006-07-20
US20060104692A1 (en) 2006-05-18
DE60318124D1 (en) 2008-01-24
CN1802568A (en) 2006-07-12

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