TW200503286A - Heat dissipation structure of light-emitting chip - Google Patents

Heat dissipation structure of light-emitting chip

Info

Publication number
TW200503286A
TW200503286A TW092118409A TW92118409A TW200503286A TW 200503286 A TW200503286 A TW 200503286A TW 092118409 A TW092118409 A TW 092118409A TW 92118409 A TW92118409 A TW 92118409A TW 200503286 A TW200503286 A TW 200503286A
Authority
TW
Taiwan
Prior art keywords
light
heat dissipation
emitting chip
substrate
emitting
Prior art date
Application number
TW092118409A
Other languages
Chinese (zh)
Inventor
Wen-Chih Ho
Original Assignee
Lambda Opto Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lambda Opto Technology Co Ltd filed Critical Lambda Opto Technology Co Ltd
Priority to TW092118409A priority Critical patent/TW200503286A/en
Publication of TW200503286A publication Critical patent/TW200503286A/en

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Abstract

A kind of heat dissipation structure of light-emitting chip is disclosed in the present invention. The light-emitting chip is composed of the epitaxial wafer and the electrodes, and is capable of generating light-emission when current is conducted such that it can be used as the light-emitting source of LED (light-emitting diode). In addition, the material having excellent insulation and heat dissipation properties is used as the substrate of light-emitting layer. Additionally, plural through holes are disposed on the substrate to have even better heat dissipation efficiency. Metal with excellent thermal conduction is filled into each through hole so as to obtain even better thermal conduction and heat dissipation efficiency for the substrate.
TW092118409A 2003-07-04 2003-07-04 Heat dissipation structure of light-emitting chip TW200503286A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092118409A TW200503286A (en) 2003-07-04 2003-07-04 Heat dissipation structure of light-emitting chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092118409A TW200503286A (en) 2003-07-04 2003-07-04 Heat dissipation structure of light-emitting chip

Publications (1)

Publication Number Publication Date
TW200503286A true TW200503286A (en) 2005-01-16

Family

ID=57798108

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092118409A TW200503286A (en) 2003-07-04 2003-07-04 Heat dissipation structure of light-emitting chip

Country Status (1)

Country Link
TW (1) TW200503286A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426844B (en) * 2012-03-13 2014-02-11
TWI683405B (en) * 2017-11-15 2020-01-21 日商歐姆龍股份有限公司 Electronic device and its manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426844B (en) * 2012-03-13 2014-02-11
TWI683405B (en) * 2017-11-15 2020-01-21 日商歐姆龍股份有限公司 Electronic device and its manufacturing method
CN111316426A (en) * 2017-11-15 2020-06-19 欧姆龙株式会社 Electronic device and method for manufacturing the same
CN111316426B (en) * 2017-11-15 2023-07-04 欧姆龙株式会社 Electronic device and method for manufacturing the same

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