TW200503286A - Heat dissipation structure of light-emitting chip - Google Patents
Heat dissipation structure of light-emitting chipInfo
- Publication number
- TW200503286A TW200503286A TW092118409A TW92118409A TW200503286A TW 200503286 A TW200503286 A TW 200503286A TW 092118409 A TW092118409 A TW 092118409A TW 92118409 A TW92118409 A TW 92118409A TW 200503286 A TW200503286 A TW 200503286A
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- heat dissipation
- emitting chip
- substrate
- emitting
- Prior art date
Links
Landscapes
- Led Devices (AREA)
Abstract
A kind of heat dissipation structure of light-emitting chip is disclosed in the present invention. The light-emitting chip is composed of the epitaxial wafer and the electrodes, and is capable of generating light-emission when current is conducted such that it can be used as the light-emitting source of LED (light-emitting diode). In addition, the material having excellent insulation and heat dissipation properties is used as the substrate of light-emitting layer. Additionally, plural through holes are disposed on the substrate to have even better heat dissipation efficiency. Metal with excellent thermal conduction is filled into each through hole so as to obtain even better thermal conduction and heat dissipation efficiency for the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092118409A TW200503286A (en) | 2003-07-04 | 2003-07-04 | Heat dissipation structure of light-emitting chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092118409A TW200503286A (en) | 2003-07-04 | 2003-07-04 | Heat dissipation structure of light-emitting chip |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200503286A true TW200503286A (en) | 2005-01-16 |
Family
ID=57798108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092118409A TW200503286A (en) | 2003-07-04 | 2003-07-04 | Heat dissipation structure of light-emitting chip |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200503286A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI426844B (en) * | 2012-03-13 | 2014-02-11 | ||
TWI683405B (en) * | 2017-11-15 | 2020-01-21 | 日商歐姆龍股份有限公司 | Electronic device and its manufacturing method |
-
2003
- 2003-07-04 TW TW092118409A patent/TW200503286A/en unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI426844B (en) * | 2012-03-13 | 2014-02-11 | ||
TWI683405B (en) * | 2017-11-15 | 2020-01-21 | 日商歐姆龍股份有限公司 | Electronic device and its manufacturing method |
CN111316426A (en) * | 2017-11-15 | 2020-06-19 | 欧姆龙株式会社 | Electronic device and method for manufacturing the same |
CN111316426B (en) * | 2017-11-15 | 2023-07-04 | 欧姆龙株式会社 | Electronic device and method for manufacturing the same |
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