WO2010137868A3 - Light-emitting diode array package having a heat-dissipating function - Google Patents

Light-emitting diode array package having a heat-dissipating function Download PDF

Info

Publication number
WO2010137868A3
WO2010137868A3 PCT/KR2010/003325 KR2010003325W WO2010137868A3 WO 2010137868 A3 WO2010137868 A3 WO 2010137868A3 KR 2010003325 W KR2010003325 W KR 2010003325W WO 2010137868 A3 WO2010137868 A3 WO 2010137868A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
heat
emitting diode
diode array
dissipating
Prior art date
Application number
PCT/KR2010/003325
Other languages
French (fr)
Korean (ko)
Other versions
WO2010137868A2 (en
Inventor
이성수
Original Assignee
(주)파라곤테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=42083214&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2010137868(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by (주)파라곤테크 filed Critical (주)파라곤테크
Publication of WO2010137868A2 publication Critical patent/WO2010137868A2/en
Publication of WO2010137868A3 publication Critical patent/WO2010137868A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N9/00—Details of colour television systems
    • H04N9/12—Picture reproducers
    • H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
    • H04N9/3141—Constructional details thereof
    • H04N9/315—Modulator illumination systems
    • H04N9/3164—Modulator illumination systems using multiple light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)

Abstract

The present invention relates to a light-emitting diode array package having a heat-dissipating function, and more particularly, to a light-emitting diode array package comprising: (1) at least one light-emitting diode for emitting light; (2) a conductive pattern on which said one or more light-emitting diodes are connected together; (3) a heat-dissipating substrate for dissipating the heat generated by said one or more light-emitting diodes; and (4) a stem in which said at least one or more light-emitting diodes, the conductive pattern, and the heat-dissipating substrate are accommodated; and (5) an adhering member for adhering the heat-dissipating substrate to the stem. The light-emitting diode array package having a light-dissipating function according to the present invention has said conductive pattern, which enables the light-emitting diode array to be variably configured in accordance with the service voltage and required quantity of light, thereby effectively arranging light-emitting diodes in a narrow area. In addition, the heat-dissipating substrate having superior heat resistance and thermal conductivity is provided beneath a serial or parallel circuit constituted by the light-emitting diodes, thereby effectively dissipating the heat generated by the light-emitting diodes, and producing a light-emitting diode array package having heat resistance.
PCT/KR2010/003325 2009-05-26 2010-05-26 Light-emitting diode array package having a heat-dissipating function WO2010137868A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0046155 2009-05-26
KR20090046155A KR100941412B1 (en) 2009-05-26 2009-05-26 A light emitting diode array package with heat radiation

Publications (2)

Publication Number Publication Date
WO2010137868A2 WO2010137868A2 (en) 2010-12-02
WO2010137868A3 true WO2010137868A3 (en) 2011-02-17

Family

ID=42083214

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/003325 WO2010137868A2 (en) 2009-05-26 2010-05-26 Light-emitting diode array package having a heat-dissipating function

Country Status (2)

Country Link
KR (1) KR100941412B1 (en)
WO (1) WO2010137868A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8492777B2 (en) 2010-04-09 2013-07-23 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823145A (en) * 1994-07-06 1996-01-23 Mitsubishi Materials Corp Substrate for hybrid ic
KR20060020089A (en) * 2004-08-31 2006-03-06 서울옵토디바이스주식회사 Luminous element having arrayed cells
KR100755615B1 (en) * 2006-04-14 2007-09-06 삼성전기주식회사 Backlight for liquid crystal display comprising light emitting diode
JP2009111099A (en) * 2007-10-29 2009-05-21 Mitsubishi Chemicals Corp Integrated light-emitting source and manufacturing method therefor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823145A (en) * 1994-07-06 1996-01-23 Mitsubishi Materials Corp Substrate for hybrid ic
KR20060020089A (en) * 2004-08-31 2006-03-06 서울옵토디바이스주식회사 Luminous element having arrayed cells
KR100755615B1 (en) * 2006-04-14 2007-09-06 삼성전기주식회사 Backlight for liquid crystal display comprising light emitting diode
JP2009111099A (en) * 2007-10-29 2009-05-21 Mitsubishi Chemicals Corp Integrated light-emitting source and manufacturing method therefor

Also Published As

Publication number Publication date
WO2010137868A2 (en) 2010-12-02
KR100941412B1 (en) 2010-02-10

Similar Documents

Publication Publication Date Title
TW200733436A (en) Light emitting diode package structure and fabrication method thereof
TW200644290A (en) Flexible LED array
MX2012011434A (en) Lightweight heat sinks and led lamps employing same.
WO2012061183A3 (en) Flexible led device for thermal management and method of making
WO2009148483A8 (en) Solid state lighting component
MY165672A (en) Lightweight heat sinks and led lamps employing same
WO2012129523A3 (en) Heat transfer assembly for led-based light bulb or lamp device
TW200746475A (en) Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
TW200802975A (en) Light emitting diode package having anodized insulation layer and fabrication method therefor
WO2011116241A3 (en) Light emitting diodes with enhanced thermal sinking and associated methods of operation
WO2007124277A3 (en) Light emitting diode lighting package with improved heat sink
EP2056363A3 (en) Light emitting diode package and method for fabricating same
WO2012005771A3 (en) Compact optically efficient solid state light source with integrated thermal management
WO2012050994A3 (en) Light emitting devices and methods
WO2008066834A3 (en) A light device having led illumination and an electronic circuit board
US20130277093A1 (en) Substrate structure
TW201130176A (en) Package system
WO2008045886A3 (en) Protection for the epitaxial structure of metal devices
WO2013083528A3 (en) Semiconductor luminaire
JP3168522U (en) Light-emitting diode heat dissipation device
WO2014064671A3 (en) A light bulb, a light bulb holder, and a combination of a light bulb and a light bulb holder
TW200620697A (en) Light emitting device
TW200709471A (en) Bendable high flux LED array
WO2010137841A3 (en) Light-emitting diode package and backlight unit
KR101142963B1 (en) Light emitting diode lighting apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10780779

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10780779

Country of ref document: EP

Kind code of ref document: A2