JP3131092U - High power light emitting diode - Google Patents

Abstract

A high power light emitting diode capable of quickly dissipating heat and lowering a heat source is provided.
A high power light emitting diode is provided with a block, a dimple is formed on the block, a screw lever is extended below the block, an integrally formed column, and a block of the column To connect at least one light emitting chip disposed in the dimple formed above, a substrate provided with two conductive layers and ringed in the vicinity of the dimple on the block, and at least two light emitting chips and the substrate And a light transmission layer for covering the dimples, the light emitting chip and the substrate, so that the heat radiation is fast and easy to wear.
[Selection] Figure 1

Description

  The present invention relates to a high-power light-emitting diode that is quick to dissipate heat and is easy to install, and is particularly applicable to projection lamps, vehicle lamps, illumination lamps, flashlights, or similar structures.

  The current light-emitting diode industry has been greatly developed, and its application products have been spreading more and more, and there is a tendency to gradually switch conventional lamps in various light fields. The brightness has been increased and the brightness has been increased, and light of different colors can be generated, approaching the brightness that is already in daily use.

However, since the brightness of the light-emitting diode is also getting brighter, it is necessary to use high power for the voltage, but another problem that the industry is trying to overcome with all the headaches in the current industry, namely, Even the problem of heat generation of the light emitting diode was caused accordingly.
Since the amount of heat cannot be discharged after a certain period of time after light emission, and the chip itself is likely to burn out, the high power light-emitting diode is always connected to the heat dissipation device to dissipate heat, ensuring that the chip itself does not burn out due to temperature drop To do.

  In view of this, the creator of the present invention aims to provide a high-power light-emitting diode that is quick to dissipate and is easy to wear, and conducts dedicated observation and research, and further rationally designs and assembles it in accordance with the operation of academic theory. Providing to consumers is the motivation this invention is to create.

  Therefore, a main object of the present invention is to provide a high power light emitting diode capable of quickly radiating heat and lowering a heat source by integrally forming a copper pillar.

  The next object of the present invention is to provide a high power light emitting diode that is convenient to wear and easy to operate.

  The next object of the present invention is to provide a high power light emitting diode capable of greatly reducing the manufacturing cost.

  In order to achieve the above object, the present invention is provided with a block, a dimple is formed on the block, a screw lever is extended below the block, an integrally formed column, and the column At least one light-emitting chip arranged in a dimple formed on the block, a substrate provided with two conductive layers and ringed in the vicinity of the dimple on the block, and connecting at least two light-emitting chips and the substrate A high-power light-emitting diode is provided that includes a connecting conductor for connecting and a light transmissive layer for covering the dimple, the light-emitting chip, and the substrate.

  Other features and specific embodiments of the present invention may be further understood from the detailed description and illustrations that follow.

Referring to FIGS. 1 to 3, the present invention is a high power light emitting diode, which is a column 1, at least one light emitting chip 22, a substrate 23, at least two connecting conductors 25, and a light transmission layer 24. The column body 1 is integrally formed with a copper column (here, the column body 1 may be made of other heat dissipation material), and the column body 1 is provided with a block 11. 11 may be a hexagonal surface, an octagonal surface, or a polygonal surface. A dimple 17 is formed on the block 11, and a screw lever 12 is extended below the block 11. The light emitting chip 22 is disposed in the dimple 17 formed on the block 11 of the column 1, and the bottom of the dimple 17 is flat.
A two-conductive layer 21 is provided on the substrate 23, and an insulating passage 27 is provided in the two-conductive layer 21 so as not to conduct the two-conductive layer 21, and the two-conductive layer 21 is electrically connected in series. A polar lead wire 26 was provided, and the substrate 23 was provided in the vicinity of the dimple 17 on the block 11. A connecting wire 25 for connecting at least two light emitting chips 22 and the substrate 23 transmits power to the light emitting chip 22 through the connecting wires 25 to emit light.
The light transmission layer 24 covers and molds the dimple 17, the light emitting chip 22, and the substrate 23, and the light transmission layer 24 may be a resin, such as an epoxy resin or silicon.

4 to 5, in the second and third embodiments of the present invention, the light collecting cover 13 is fixed to the column 1 (as shown in FIG. 4), and the light collecting cover 13 is made of aluminum. The light source is condensed and emitted to the outside, and the heat performance of the light emitting chip 22 is made to flow through the column body 1 by the contact between the light collection cover 13 made from the aluminum sheet and the block 11 of the column body 1. The light is transmitted to the light collecting cover 13 which is a sheet, and the thermal performance of the light emitting chip 22 is quickly discharged, the temperature is lowered and the light emitting chip 22 is protected from being burned by overheating, and a nut 14 is tightened under the light collecting cover 13 To improve the heat dissipation effect.
Further, a screw hole 16 is drilled on the heat dissipating piece 15 (or heat dissipating base), and the screw lever 12 of the column 11 is stably tightened on the heat dissipating piece 15 (as shown in FIG. 5). Is transmitted to the heat radiation piece 15 through the column body 1 and can be discharged.
Further, the screw lever 12 extending below the column body 11 makes it easy to switch and attach.

As described above, the device of the present invention has the following advantages.
1. The light emitting chip and the dimples of the pillar body are closely coupled to each other so that heat can be quickly dissipated and the heat source can be lowered via the pillar body, so that the mounting and positioning can be facilitated.
2. The column body is a hexagonal block, which can be stably clamped on the heat radiating piece, and the heat performance of the light emitting chip is transmitted to the heat radiating piece through the column body, thereby improving the heat radiation effect.
3. The high power light emitting diode can tighten the light collecting cover to concentrate the light source emitted from the light emitting diode, and the light collecting cover also has a heat dissipation effect.

  The configuration disclosed above is merely a preferred embodiment of the present invention and does not limit the features of the present invention, and any expert having ordinary knowledge in the field may However, it is needless to say that such conversion and modification can be carried out as appropriate, but such implementation should be delivered within the scope of the claimed invention.

1 is a perspective external view of the present invention. It is side surface sectional drawing of this invention. It is a top view of the present invention. It is a figure which shows the other Example of this invention. It is a figure which shows one further Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Column 11 Block 12 Screw lever 13 Condensing cover 14 Nut 15 Radiation piece 16 Screw hole 17 Dimple 21 Conductive layer 22 Light emitting chip 23 Substrate 24 Light transmission layer 25 Connection lead 26 Polar lead wire 27 Insulation path

Claims (6)

A block is provided, a dimple is formed on the block, a screw lever is extended below the block, and an integrally formed pillar,
At least one light emitting chip disposed in a dimple formed on the block of the pillars;
A substrate provided with two conductive layers and ringed in the vicinity of the dimples on the block;
A connecting conductor for connecting at least two light emitting chips and the substrate;
A high power light emitting diode comprising a dimple, a light emitting chip, and a light transmission layer for covering the substrate.   The high power light emitting diode according to claim 1, wherein the pillar is a copper pillar.   The high power light-emitting diode according to claim 1, wherein the column body is provided with a light collecting cover that concentrates and emits light sources.   The high power light-emitting diode according to claim 1, wherein a heat dissipating piece for improving heat dissipation is provided below the column body.   The high power light emitting diode according to claim 1, wherein the two conductive layers on the substrate are provided with polar lead wires for electrical connection in series.   The high power light emitting diode according to claim 1, wherein the light transmission layer is made of a resin.

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