TWI422779B - Light emitting diode bulb structure - Google Patents

Description

Light-emitting diode bulb structure

A light-emitting diode bulb structure, in particular, a bulb structure in which a light-emitting diode substrate and a heat sink are tightly combined.

Because the light-emitting diode (LED) has many advantages such as long service life, low power consumption, high brightness, and environmentally friendly materials, with the progress of the light-emitting diode process and the cost reduction, in addition to the use of traffic lights or electrical appliances. In addition to the indicator light, it is further used in environmental decoration and lighting fixtures. In order to make the light-emitting diode suitable for use in a general light bulb, the prior art has combined the light-emitting diode with the outer casing of a conventional light bulb, such as the Republic of China Patent Certificate No. I293807 "Light-emitting diode with constant current circuit" "Light bulb", the prior patent discloses that a light-emitting diode bulb includes a lamp cap, a lamp housing, a plurality of series-connected light-emitting diodes, and a step-down constant current circuit. Wherein the lamp cap has an electrode connected to the power source, and the plurality of light emitting diodes and the step-down constant current circuit are connected to provide a constant current to cause the light emitting diode to emit light, and the light emitting diode bulb is mounted on the conventional lamp holder It can be used directly. However, since the driving LED needs a stable DC current, the driving circuit that converts the AC mains into a DC current will continuously generate and accumulate waste heat during the conversion process. Moreover, the direct current also generates a lot of waste heat through the impedance of the light-emitting diode, and the excessively high temperature for a long time will damage the light-emitting diode or the driving circuit, or the service life is lowered.

Therefore, the industry has developed a variety of light-emitting diode bulbs having a heat-dissipating structure, such as the Republic of China Patent Certificate No. I338106 "Light Emitting Diode Lamp", which discloses that a light-emitting diode lamp includes a light-emitting device, and the light-emitting device The device has a light emitting diode unit, a circuit board for driving and controlling the light emitting diode unit, and an inner lens. The circuit board is disposed in a second accommodating space of a metal lamp cup, and the illuminating diode unit is disposed in a first accommodating space of the metal lamp cup, and has a heat conductive substrate and a fixed A high power light emitting diode chip on the substrate. As can be seen from the illustration of the previous case, the substrate on which the high-power light-emitting diode chip is mounted is locked to the metal lamp cup by a plurality of screws, and the substrate is only positioned through the screws.

Another prior case, such as the Republic of China Patent Certificate No. M350675 "LED Lamp and Its Cover Structure", discloses that an LED lamp comprises a snap-on heat sink fin set and an LED module, wherein the snap-on heat sink fin The inner circumference of the group is formed with an accommodating space, and the LED module is disposed inside the accommodating space and connected to the heat dissipation fin set. The prior art can be clearly seen in the drawings, the circuit board of the LED module is screwed to the heat dissipation fin set.

The prior art, which also uses screws to lock the LED substrate, also includes the Republic of China Patent Certificate No. M365440 and the like.

In order to more clearly show the lack of locking the LED substrate with screws, please refer to Figures 1 and 2. 1 and 2 disclose a structure of a conventional light-emitting diode bulb, comprising a lamp cover 90, a light-emitting diode substrate 91, a heat sink 92, a power conversion plate 93, and a power receiving block 94. One end of the heat sink 92 is coupled to the power receiving base 94 , and the power conversion board 93 is received between the heat sink 92 and the power receiving base 94 . The other end of the heat sink 92 has a bearing surface 921 and a plurality of screw holes provided on the bearing surface 921. 922, and a routing hole 923 extending through the bearing surface 921. The light-emitting diode substrate 91 has a plurality of light-emitting diodes 911 and a plurality of screw holes 912 corresponding to the positions of the screw holes 922. The conventional technique uses the plurality of screws 95 to pass through the screw holes 912 and 922 to fix the LED substrate 91 to the bearing surface 921 of the heat sink 92. The problem is that only the screw 95 is used to lock the light-emitting diode substrate 91, and only the periphery of the screw 95 can be completely fitted to the heat sink 92. When the light-emitting diodes 911 are used as the light-emitting diodes 91, the light-emitting diodes 911 are deformed by the temperature rise when the light-emitting diodes 911 generate heat, and the modified form in the drawings is merely illustrative and practical. The upper use will produce different deformation states depending on the material and temperature. The portion that is at a certain distance from the screw 95 cannot be tightly joined to the heat sink 92 due to thermal expansion and contraction deformation, so that the speed of heat conduction between the light-emitting diode substrate 91 and the heat sink 92 is significantly reduced, which directly affects the light-emitting diode. The temperature of the polar body substrate 91 rises faster. When the temperature rise of the light-emitting diode substrate 91 is higher, the deformation is more conspicuous, resulting in a vicious cycle of poor heat dissipation.

Since the conventional light-emitting diode bulbs use screws to fix the light-emitting diode substrate, although the technical level is very simple, the working time is increased, and the temperature rise causes the light-emitting diode substrate to be deformed, which may affect the heat-dissipating body. The thermal conduction between the two causes a vicious cycle in which heat cannot be effectively exported.

The present invention is a light-emitting diode structure including a light-transmitting cover and a power-receiving base, a heat-dissipating body and an assembly seat mounted between the light-transmitting cover and the power-receiving seat, and at least one of the light-transmitting cover a light source substrate, and a power conversion board electrically connected to the light source substrate and the power receiving base, wherein the heat dissipation body has a mounting space for housing the power conversion board, The heat dissipating body has a bonding wall surface surrounding the area for bonding the light source substrate, and the peripheral edge of the light source substrate has a corresponding bonding surface and the bonding wall surface is tightly engaged to fix the light source substrate to the heat dissipating body. . The light source substrate is pressed into the bonding wall surface tightly, so that the light source substrate is firmly fixed to suppress deformation due to temperature. Moreover, the light source substrate and the heat sink are tightly combined to have good thermal conductivity.

Further, the LED bulb further includes a spacer disposed in the installation space, the spacer includes a partition wall between the power conversion board and the heat sink to form the power conversion A circuit accommodating space of the board, and an outlet hole on the partition wall for connecting the power conversion board to the light source substrate. The power conversion panel is partitioned through the partition wall to meet stringent safety testing.

1‧‧‧Isolation

10‧‧‧ partition wall

11‧‧‧ joints

12‧‧‧Outlet hole

13‧‧‧Protruding

2‧‧‧Assembly

21‧‧‧Insulated wall

211‧‧‧First Positioning Department

22‧‧‧Combination Department

23‧‧‧Shading Department

3‧‧‧Power Conversion Board

30, 31‧‧‧Power wires

4‧‧‧ Heat sink

40‧‧‧Light source substrate

400‧‧‧Fitting surface

401‧‧‧Lighting diode

402‧‧‧Line hole

41‧‧‧Installation space

410‧‧‧ combined with wall

411‧‧‧Second Positioning Department

412‧‧‧Support

42‧‧‧Heat fins

43‧‧‧through holes

44‧‧‧ positioning slot

5‧‧‧Transparent cover

50‧‧‧ neck

6‧‧‧Electrical stand

61‧‧‧Binding end

7‧‧‧Circuit housing space

90‧‧‧shade

91‧‧‧Light Emitting Substrate

911‧‧‧Lighting diode

912‧‧‧ screw hole

92‧‧‧ Heat sink

921‧‧‧ bearing surface

922‧‧‧ screw holes

923‧‧‧Line hole

93‧‧‧Power Conversion Board

94‧‧‧Electrical stand

95‧‧‧ screws

Figure 1 is an exploded perspective view of a conventional light bulb.

2 is a schematic cross-sectional view of a conventional light bulb.

Figure 3-1 is an exploded view of the light-emitting diode bulb of the present invention.

Figure 3-2 is a partial enlarged view of the heat sink.

4 is a schematic view showing the assembly of the light-emitting diode bulb.

Fig. 5 is a cross-sectional view of the light emitting diode.

Figure 6 is a cross-sectional view showing another embodiment of the spacer and the assembly.

This case is a light-emitting diode bulb structure, the following will explain the technology of the case with the diagram Content. Referring to FIG. 3-1, FIG. 3-2, FIG. 4 and FIG. 5, FIG. 3-1 to FIG. 5 show a first embodiment of the present disclosure. The light bulb disclosed in the first embodiment includes a light transmission. a cover 5 and a power receiving base 6, a heat dissipating body 4 and an assembly base 2 installed between the transparent cover 5 and the power receiving base 6, and at least one light source substrate 40 housed in the transparent cover 5, and The power conversion board 3 of the light source substrate 40 and the power receiving base 6 is electrically connected. Preferably, the power conversion board 3 is a switched power supply circuit. The heat dissipating body 4 has a mounting space 41 for housing the power conversion panel 3. The light source substrate 40 has a plurality of light emitting diodes 401 thereon. The light source substrate 40 can be an aluminum substrate including a plurality of conductive paths. In the prior art, an aluminum substrate can be formed by stacking copper foil, a thermally conductive insulating material, and an aluminum plate. After the copper foil is etched into a circuit, it is coated in a heat conductive insulating material or an aluminum plate to form a light source substrate 40 including a conductive path. Since the aluminum substrate is a currently known technology, the aluminum substrate is used in the present case, but the aluminum substrate is used. The manufacturing technology and detailed structure are not the technical focus of this case, so they will not be described again. In order to provide a better positioning method of the light source substrate 40, the heat dissipating body 4 of the present invention has a surrounding combined wall surface 410 that surrounds an area for bonding the light source substrate 40. The peripheral surface of the light source substrate 40 has a bonding surface 400, and the light source substrate 40 is pressed into the region surrounded by the bonding wall surface 410, so that the bonding surface 400 is correspondingly engaged with the bonding wall surface 410. The light source substrate 40 is fixed to the heat sink 4 . More specifically, the outer diameter of the peripheral edge of the light source substrate 40 is not less than the inner diameter of the bonding wall 410. Therefore, the light source substrate 40 is pressed into the bonding wall 410 by applying a force, and the bonding wall 410 itself is slightly elastic. And the hardness will cause the bonding wall 410 to be pressed against the facing surface 400. Further, the heat sink 4 is provided below the light source substrate 40 with a support portion 412 having a thickness difference from the bonded wall surface 410 to support the light source substrate 40. The light source substrate 40 can be made by the technique of firmly bonding the light source substrate 40 to the heat sink 4 as described above. The heat sink 4 is closely attached to achieve excellent heat conduction. Further, when the temperature of the light source substrate 40 rises, the squeezing of the bonding wall surface 410 suppresses the deformation of the light source substrate 40 to increase the heat conduction effect, thereby ensuring that the heat conduction effect is not affected, and completely improves the lack of screw fixing in the prior art. .

In order to allow the bulb to pass the safety test, the assembly base 2 includes a surrounding insulating wall 21 to partition a circuit housing space 7, a shielding portion 23 and a joint portion 22 for accommodating the power conversion panel 3. The insulating wall 21 is located between the power conversion board 3 and the heat sink 4 , and the shielding portion 23 is attached to the lower edge of the heat sink 4 to close the lower end opening of the installation space 41 . The assembly base 2 is provided with a first positioning portion 211 for tightly coupling with the heat sink 4 . The inner edge of the heat dissipating body 4 has at least one second positioning portion 411 correspondingly engaged with the first positioning portion 211 on the assembly base 2, thereby restricting the relative displacement between the assembly base 2 and the heat dissipation body 4. The first positioning portion 211 can be a longitudinal flange, or a lateral flange, or a longitudinally and laterally staggered flange (as shown in Figure 3-1). In addition, in order to further enhance the insulation capability to protect the power conversion panel 3, the LED package may further include a spacer 1 including a power conversion board 3 and a heat sink 4 The partition wall 10 between the partition wall 10 and the outlet hole 10 on the partition wall 10 allow the power conversion panel 3 to be connected to the light source substrate 40. In order to pass the safety test, the spacer 1 is provided with a protrusion 13 at the periphery of the outlet hole 12 to avoid high-voltage power breakdown. In the embodiment shown in FIG. 3-1, the end of the partition wall 10 has a joint portion 11 combined with the upper end of the assembly base 2 so that the partition wall 10 surrounds the power conversion panel 3, Around the side, and closing the opening above the assembly 2. Through the engagement of the assembly 2 with the separator 1, it is ensured that the power conversion panel 3 is insulated from the circuit housing space 7.

The light source substrate 40 has a wire hole 402 communicating with the installation space 41. At least one power wire 30 connected to the power conversion board 3 can pass through the outlet hole 12 of the partition wall 10 and the wire hole 402 on the light source substrate 40 to make the power conversion board 3 and the light emitting diodes The body 401 is electrically connected. Moreover, the protruding portion 13 can be embedded in the routing hole 402.

Through the above-described technique, the power conversion panel 3 can be mounted in the light-emitting diode bulb, and the power conversion panel 3 can be isolated and protected in the circuit housing space 7 through the spacer 1 and the assembly base 2. Further, an air gap between the partition wall 10 of the separator 1 and the inner edge of the heat sink 4 ensures that the high-voltage electrical test in the safety test cannot damage the power conversion panel 3.

As shown in FIG. 3-1 to FIG. 5 , the joint portion 22 of the assembly base 2 is located outside the installation space 41 , and the joint portion 22 and a joint end 61 of a power socket 6 are coupled to each other. The socket 6 is used for connecting an external power source, and is electrically connected to the power conversion board 3 and the power receiving base 6 through at least one power lead 31, and the power guided from the external power source is sent to the power conversion board 3. Depending on the type of bulb or the application environment, a variety of different types of sockets can be used. The type quoted in Figures 3-1 to 5 is a general household bulb type, but the socket 6 is not limited. Figure 3-1 to Figure 5 shows the type.

Moreover, the heat dissipating body 4 has a positioning groove 44 on the bonding wall surface 410. The positioning groove 44 is used for fixing the transparent cover 5, and the transparent cover 5 has a neck portion 50, and the neck portion 50 can be tightly fitted. The neck portion 50 is adhered to the positioning groove 44 in the positioning groove 44 or the mechanism of the adhesive or the buckle at the same time.

Figure 6 is a cross-sectional view showing another embodiment of the light bulb, the embodiment of Figure 6 and the first embodiment The difference between an embodiment is that since the spacer 1 is optional, the embodiment of Fig. 6 is a state in which the spacer 1 is not mounted. As shown in FIG. 6 , the insulating wall 21 of the assembly 2 extends upwardly to the light source substrate 40 , and the power wire 30 of the power conversion board 3 directly passes through the opening above the assembly base 2 and the wire hole 402 . The light source substrate 40 is electrically connected. Since the insulating wall 21 still completely separates the power conversion panel 3 and the heat sink 4, it still has a good insulating ability to pass the safety test.

In the first embodiment of FIG. 3-1 to FIG. 5 and the second embodiment shown in FIG. 6 , the outer edges of the heat sink 4 are stacked with a plurality of heat dissipation fins 42 , and the heat dissipation fins 42 There is a gap between the air for circulation. Moreover, the heat dissipation fins 42 have a plurality of through holes 43 , and the plurality of through holes 43 of the plurality of heat dissipation fins 42 are arranged to penetrate through the heat dissipation body 4 to form at least one air flow passage through which the air passes longitudinally. The gaps between the fins 42 and the airflow passages allow for lateral and longitudinal airflow, and provide a large air contact area for excellent heat dissipation.

Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present invention. Anyone who is familiar with this skill and does not deviate from the spirit and scope of this case, and some of the changes and refinements should be covered in this case. Therefore, the scope of protection of this case is subject to the definition of the patent application scope attached.

In summary, this case enhances the above-mentioned effects compared with the well-known creations. It should fully comply with the statutory innovation patent requirements of novelty and progressiveness. If you apply in accordance with the law, you are requested to approve the application for this invention patent to encourage creation. Debian.

1‧‧‧Isolation

10‧‧‧ partition wall

11‧‧‧ joints

12‧‧‧Outlet hole

13‧‧‧Protruding

2‧‧‧Assembly

21‧‧‧Insulated wall

211‧‧‧First Positioning Department

22‧‧‧Combination Department

23‧‧‧Shading Department

3‧‧‧Power Conversion Board

30, 31‧‧‧Power wires

4‧‧‧ Heat sink

40‧‧‧Light source substrate

400‧‧‧Fitting surface

401‧‧‧Lighting diode

402‧‧‧Line hole

41‧‧‧Installation space

410‧‧‧ combined with wall

411‧‧‧Second Positioning Department

412‧‧‧Support

42‧‧‧Heat fins

43‧‧‧through holes

44‧‧‧ positioning slot

5‧‧‧Transparent cover

50‧‧‧ neck

6‧‧‧Electrical stand

61‧‧‧Binding end

Claims (10)

A light-emitting diode bulb structure includes a light-transmitting cover and a power-receiving base, a heat-dissipating body mounted between the light-transmitting cover and the power-receiving base, and an assembly seat, at least one of which is disposed in the light-transmitting cover a light source substrate, and a power conversion board electrically connected to the light source substrate and the power receiving base, wherein the heat dissipating body has a mounting space for accommodating the power conversion board, wherein the heat sink has a surrounding space for The light source substrate has a corresponding bonding surface and a bonding surface of the light source substrate, and the light source substrate is fixedly coupled to the heat sink body. The assembly base has an insulating wall area. a circuit accommodating space for accommodating the power conversion board, and a shielding portion is attached to the lower edge of the heat dissipating body to close the lower end opening of the installation space, wherein the insulating wall extends upward from the shielding portion to The light source substrate is in contact with the light source substrate. The light-emitting diode bulb structure according to claim 1, wherein an outer diameter of the light source substrate is not less than an inner diameter of the bonding wall. The light-emitting diode bulb structure according to claim 1, wherein the heat sink is provided with a support portion having a thickness difference from the bonding wall surface to support the light source substrate. The light-emitting diode bulb structure of claim 1, wherein the assembly base and the heat sink have at least one corresponding first positioning portion and a second positioning portion. The light-emitting diode bulb structure of claim 4, wherein the first positioning portion and the second positioning portion are correspondingly buckled notches and bumps. The light-emitting diode bulb structure according to claim 1, wherein the assembly base has a joint portion outside the installation space and combined with a power socket. The light-emitting diode structure of claim 1, wherein the light source substrate has a wire hole communicating with the installation space for at least one power wire to pass through and electrically connected to the light source substrate. The light-emitting diode bulb structure according to claim 1, wherein the light source substrate is an aluminum substrate including a plurality of conductive paths. The light-emitting diode bulb structure of claim 1, wherein the heat sink has a plurality of heat-dissipating fins stacked in a stack, and the heat-dissipating fins have a plurality of through-holes penetrating through at least one airflow passage. The light-emitting diode bulb structure according to claim 1, wherein the power conversion board is a switching power supply circuit.