KR101181763B1

KR101181763B1 - A metal core printed circuit board for light emitted diode

Info

Publication number: KR101181763B1
Application number: KR20050096482A
Authority: KR
Inventors: 권성훈
Original assignee: 엘지전자 주식회사
Priority date: 2005-10-13
Filing date: 2005-10-13
Publication date: 2012-09-12
Also published as: KR20070040918A

Abstract

The present invention relates to a metal core printed circuit board for a light emitting diode for effectively removing heat generated from a light emitting diode (LED) chip.

The present invention provides a metal core printed circuit board for a light emitting diode in which an insulating material, a copper plate and a colored layer are sequentially stacked on an aluminum plate to be in contact with an LED chip through a slug, wherein the insulating material and the copper plate, Grooves are respectively formed on the inner surface of the colored layer, and protrusions integrally formed on the inner surface of the aluminum plate penetrate the respective grooves to contact the slugs, and the grooves have a circular cross section.

Light Emitting Diode, Metal Core, Printed Circuit Board, Insulation Material, Slug

Description

A metal core printed circuit board for light emitting diodes

1 is a view showing the structure of a conventional metal core PCB,

2 is a partial cutaway cross-sectional view of the metal core PCB shown in FIG.

3 is a view showing the structure of a metal core printed circuit board for a light emitting diode according to an embodiment of the present invention;

4 is a partial cutaway cross-sectional view of the metal core PCB shown in FIG. 3.

Description of the Related Art

11 aluminum plate 12 insulator

13: copper plate 14: colored layer

15 LED chip 16: slug

11a: protrusion 12a ~ 14a: groove

The present invention relates to a metal core printed circuit board for a light emitting diode, and more particularly, to a metal core printed circuit board for a light emitting diode to effectively remove heat generated from the light emitting diode (LED) chip (chip).

In general, high-brightness LEDs are widely used in traffic lighting, general lighting, LCD back light unit (BLU) light source, automotive lighting, etc., and the marketability is very optimistic, but they are packaged in array. When used, the heat generated from the LED itself accumulates in the substrate, so the LED life is abruptly shortened and thus cannot be used.

On the other hand, due to the high integration of electronic equipment, the amount of power entering the LED chip is increasing and heat generated by the LED is increasing. LEDs are also applying a lot of power to small chips in order to have high brightness according to the needs of users.

LED's semiconductor device only generates about 20 ~ 30% of the power and emits the rest with heat. In other words, since the optical device is sensitive to temperature, it is very important to remove heat generated from the chip.

Since the amount of light of LED is still insufficient compared to lamp, it is urgent to increase the amount of light through effective cooling. In addition, the LED used as the back light does not get the desired amount of light with only one LED chip yet, so it produces enough light by making several LEDs in one package. In order to drive LEDs while meeting these conditions, an effective cooling system is desperately needed.

Conventional PCBs have been designed without the concept of heat dissipation, mainly for circuit design. Recently, as the heat problem has increased, a metal core PCB using a metal has been developed to create a cooling system that diffuses heat to a metal having a high heat transfer rate. However, currently manufactured MCPCBs cause loss in terms of efficiency by placing another material for insulation on an aluminum plate. Therefore, it is difficult to remove enough heat generated from a multi-LED chip with a conventional MCPCB.

FIG. 1 is a view illustrating a structure of a conventional metal core PCB, and FIG. 2 is a partial cutaway view of the metal core PCB shown in FIG. 1, and an insulating material 2 and a copper plate on an aluminum plate 1 are shown. A copper plate 3 and a paints layer 4 are sequentially stacked.

The electronic package in the form of a chip uses a heat sink having a high heat transfer rate such as the aluminum plate 1 to reduce heat generated. However, due to the design of the electric circuit of the chip, the insulating material 2 is designed to enter between the aluminum plate 1 and the LED chip 5, and the insulating material 2 serves to increase heat resistance. This is because the insulation rate is proportional to the thermal resistance. This leads to a low thermal conductivity, which is very disadvantageous in terms of cooling.

As shown in FIG. 2, the LED single product has a slug 6 made of aluminum under the LED chip 5, which is basically a heat source, to extract heat from the LED chip 5. . However, as described above, there is a problem that the thermal resistance is increased by the insulating material 2 placed between the aluminum plate 1 and the copper plate 3.

The present invention has been made to solve the above problems of the prior art, an object of the present invention is to reduce the thermal resistance generated in the metal core printed circuit board for light emitting diodes to increase the cooling effect, and improve the performance of the light emitting diodes. The present invention provides a metal core printed circuit board for light emitting diodes.

In the above object of the present invention, an insulating material, a copper plate, and a colored layer are sequentially stacked on an aluminum plate, and the metal core printed circuit board for light emitting diodes in contact with the LED chip through slugs. Grooves are formed on the inner surface of the insulating material, the copper plate, and the colored layer, and projections formed integrally on the inner surface of the aluminum plate penetrate the respective grooves to contact the slugs. Is achieved.

Preferably in this invention the groove is characterized in that it has a circular cross section.

Hereinafter, preferred embodiments of the metal core printed circuit board for the light emitting diode according to the present invention will be described in detail with reference to the accompanying drawings.

In general, the movement of calories is inversely proportional to the thermal resistance of an object. Therefore, the thermal resistance should be minimized for efficient heat removal. In general, the heat generated from the heat source (Heat source) is moved through a few steps of the object. Basically, an object has inherent thermal resistance and uses an interface material with high thermal resistance to join each step.

The more heat transfer with the object with high heat transfer rate, the more efficient the use of intermediates can be. In the present invention, it is possible to maximize the cooling effect by reducing the structural step of the metal core printed circuit board for the light emitting diode as much as possible.

3 is a view illustrating a structure of a metal core printed circuit board for a light emitting diode according to an exemplary embodiment of the present invention, and FIG. 4 is a partial cutaway cross-sectional view of the metal core PCB shown in FIG. 3.

Referring to this, grooves 12a, 13a, 14a are formed on the inner surface of the insulating material 12, the copper plate 13, and the colored layer 14, respectively, and the predetermined surface is formed on the inner surface of the aluminum plate 11. The protrusions 11a having a height are integrally formed so that the protrusions 11a penetrate the respective recesses 12a, 13a and 14a so as to be in direct contact with the slug 16.

At this time, the groove 12a, 13a, 14a was configured to have a circular cross section. If the lead and the slug 16 of the LED chip 15 is insulated, the lower part of the slug 16 is irrelevant to the current flow, so that the current does not flow out even when contacted with the metal. In general, the cooling system aims to spread the heat from this slug 16 widely. Therefore, the cooling effect can be enhanced by removing the insulating material 12 of the metal core printed circuit board in contact with the slug 16.

That is, the aluminum plate 11 is not in contact with the slug 16 through the insulating material 12, but the heat is moved as described above by directly contacting the slug 16 through the protrusion 11a. Reducing the heat resistance decreases the heat transfer rate, thereby increasing the cooling efficiency.

As described above, the metal core printed circuit board for the light emitting diode according to the present invention has been described with reference to the illustrated drawings. However, the present invention is not limited by the embodiments and drawings disclosed herein, and the skilled person within the technical scope of the present invention. Of course, various modifications can be made by

As described above, according to the present invention, the aluminum plate is in direct contact with the slug through the protrusion formed on the inner surface, thereby reducing the heat resistance by reducing the heat transfer step, increasing the heat transfer rate to increase the cooling efficiency of the LED chip. At the same time there is a useful effect to improve the performance of the LED.

Claims

In a metal core printed circuit board for a light emitting diode,

An insulating material having a first recess in the light emitting diode mounting portion;

A copper plate having a second recess located on the insulating material;

A colored layer having a third recess located on the copper plate;

A metal core printed circuit board for light emitting diodes, comprising: an aluminum plate positioned below the insulating material and having a protrusion portion penetrating through the first, second, and third recesses.

The method of claim 1,

The first, second, and third grooves have a circular cross-section, the metal core printed circuit board for light emitting diodes.