CN205746721U

CN205746721U - A kind of cooling type LED module

Info

Publication number: CN205746721U
Application number: CN201620451378.8U
Authority: CN
Inventors: 黄琦
Original assignee: GONGQINGCHENG CHAOQUN TECHNOLOGY Co Ltd
Current assignee: GONGQINGCHENG CHAOQUN TECHNOLOGY Co Ltd
Priority date: 2016-05-18
Filing date: 2016-05-18
Publication date: 2016-11-30
Anticipated expiration: 2026-05-18

Abstract

The utility model discloses a kind of cooling type LED module, including substrate, LED chip, installing zone, heat-conducting layer, layer of silica gel and heat sink；Being preset with installing zone on described substrate, installing zone connection arranges anelectrode paster, negative electrode paster；Described LED chip is arranged in installing zone, and LED chip is in surface；The positive pole pin of described LED chip is electrically connected with anelectrode paster, and the negative pin of LED chip is electrically connected with negative electrode paster；Described base plate bottom is laid with heat sink strip, and base plate bottom is provided with heat-conducting layer, and heat sink strip contacts setting with heat-conducting layer；Being provided with layer of silica gel below described heat-conducting layer, be provided with heat sink bottom layer of silica gel, wherein, heat-conducting layer passes through layer of silica gel setting bonding with heat sink；Between heat-conducting layer, layer of silica gel and heat sink, it is provided with radiation rib, and radiation rib is provided with thermal vias；This utility model improves radiating efficiency, luminous efficiency, improves radiating effect, increases the service life, low cost, simple in construction.

Description

A kind of cooling type LED module

Technical field

This utility model relates to LED module, specifically a kind of cooling type LED module.

Background technology

As other light source, semiconductor light emitting diode (LED) the most also can produce heat, and how much it depends on the luminous efficiency of entirety.Powering up outside under energy, the radiation recombination generation electroluminescent in electronics and hole, the light radiated near PN junction also needs semiconductor medium and encapsulation medium through chip itself just can arrive at the external world.Combination current injection efficiency, radioluminescence quantum efficiency, chip exterior light extraction efficiency etc., the input electric energy of final general only 30-40% is converted into luminous energy, and the form of the lattice vibration that the energy of remaining 60-70% mainly occurs with non-radiative recombination converts heat energy.

In general, LED work is the most stable, and quality quality is most important with lamp body heat radiation itself, the heat radiation of the high-brightness LED lamp on market, usually uses natural heat dissipation, and effect is unsatisfactory.The LED lamp that LED light source is made, by LED, radiator structure, driver, lens form, and therefore dispelling the heat also is a part and parcel, and its luminous efficiency declines along with the rising of ambient temperature, so the heat radiation of LED is extremely important；The efficiency of power supply is high, and its dissipation power is little, the least in light fixture internal heat generation amount, the most just reduces the temperature rise of light fixture, can delay the light decay of LED；If LED can not dispel the heat very well, its life-span also can be impacted.

Utility model content

The purpose of this utility model is to provide one to improve radiating efficiency, luminous efficiency, improves radiating effect, increases the service life, low cost, and the cooling type LED module of simple in construction, with the problem solving to propose in above-mentioned background technology.

For achieving the above object, the following technical scheme of this utility model offer:

A kind of cooling type LED module, including substrate, LED chip, installing zone, heat-conducting layer, layer of silica gel and heat sink；Being preset with installing zone on described substrate, installing zone connection arranges anelectrode paster, negative electrode paster；Described LED chip is arranged in installing zone, and LED chip is in surface；The positive pole pin of described LED chip is electrically connected with anelectrode paster, and the negative pin of LED chip is electrically connected with negative electrode paster；Described base plate bottom is laid with heat sink strip, and base plate bottom is provided with heat-conducting layer, and heat sink strip contacts setting with heat-conducting layer；Being provided with layer of silica gel below described heat-conducting layer, be provided with heat sink bottom layer of silica gel, wherein, heat-conducting layer passes through layer of silica gel setting bonding with heat sink；Meanwhile, being provided with radiation rib between heat-conducting layer, layer of silica gel and heat sink, wherein radiation rib level is longitudinally disposed, and between radiation rib, equidistant parallel is arranged, and radiation rib is provided with thermal vias.

Further: described anelectrode paster includes pcb board sheet, positive terminal pad, positive terminal pad is arranged on pcb board sheet, pcb board sheet and substrate bonding.

Further: described negative electrode paster includes pcb board sheet, negative terminal pad, negative terminal pad is arranged on pcb board sheet, pcb board sheet and substrate bonding.

Compared with prior art, the beneficial effects of the utility model are:

By anelectrode paster, negative electrode paster, this utility model ensures that LED chip is connected with power supply, making LED chip work luminescence, meanwhile, LED chip is set directly on substrate, the heat that LED chip work produces time luminous is directly dissipated by substrate, improves radiating efficiency, luminous efficiency；

In this utility model, the heat that substrate produces is passed to heat sink by heat sink strip by heat-conducting layer, layer of silica gel, is dispelled the heat by heat sink；Meanwhile, radiation rib significantly absorbs heat, and heat is dispelled the heat by cross-ventilation by thermal vias, thus produces disjunctor heat radiation, increases area of dissipation, improves radiating effect, increases the service life, and low cost, simple in construction.

Accompanying drawing explanation

Fig. 1 is the structural representation of cooling type LED module.

Detailed description of the invention

Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole embodiments.Based on the embodiment in this utility model, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of this utility model protection.

Referring to Fig. 1, in this utility model embodiment, a kind of cooling type LED module, including substrate 1, LED chip 4, installing zone 6, heat-conducting layer 7, layer of silica gel 8 and heat sink 9；Being preset with installing zone 6 on described substrate 1, installing zone 6 connection arranges anelectrode paster 2, negative electrode paster 3；Described LED chip 4 is arranged in installing zone 6, and LED chip 4 is positioned at above substrate 1；The positive pole pin of described LED chip 4 is electrically connected with anelectrode paster 2, and the negative pin of LED chip 4 is electrically connected with negative electrode paster 3；Wherein, anelectrode paster 2 includes pcb board sheet, positive terminal pad, and positive terminal pad is arranged on pcb board sheet, and pcb board sheet is bonding with substrate 1；Meanwhile, negative electrode paster 3 includes pcb board sheet, negative terminal pad, and negative terminal pad is arranged on pcb board sheet, and pcb board sheet is bonding with substrate 1；In work, ensure that LED chip 4 is connected with power supply by anelectrode paster 2, negative electrode paster 3, make LED chip 4 work luminescence, simultaneously, LED chip 4 is set directly on substrate 1, LED chip 4 work luminescence time the heat that produces directly dissipated by substrate 1, improve radiating efficiency；Being laid with bottom heat sink strip 5, and substrate 1 bottom described substrate 1 and be provided with heat-conducting layer 7, heat sink strip 5 contacts setting with heat-conducting layer 7, it is ensured that rate of heat transfer, improves radiating efficiency；Being provided with layer of silica gel 8 below described heat-conducting layer 7, be provided with heat sink 9 bottom layer of silica gel 8, wherein, heat-conducting layer 7 is by layer of silica gel 8 setting bonding with heat sink 9；Meanwhile, being provided with radiation rib 11 between heat-conducting layer 7, layer of silica gel 8 and heat sink 9, wherein radiation rib 11 level is longitudinally disposed, and between radiation rib 11, equidistant parallel is arranged, and radiation rib 11 is provided with thermal vias 10；In work, the heat that substrate 1 produces is passed to heat sink 9 by heat sink strip 5 by heat-conducting layer 7, layer of silica gel 8, is dispelled the heat by heat sink 9；Meanwhile, radiation rib 11 significantly absorbs heat, and heat is dispelled the heat by cross-ventilation by thermal vias 10, thus produces disjunctor heat radiation, increases area of dissipation, improves radiating effect, increases the service life, and low cost, simple in construction.

It is obvious to a person skilled in the art that this utility model is not limited to the details of above-mentioned one exemplary embodiment, and in the case of without departing substantially from spirit or essential attributes of the present utility model, it is possible to realize this utility model in other specific forms.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, scope of the present utility model is limited by claims rather than described above, it is intended that all changes fallen in the implication of equivalency and scope of claim included in this utility model.Should not be considered as limiting involved claim by any reference in claim.

In addition, it is to be understood that, although this specification is been described by according to embodiment, but the most each embodiment only comprises an independent technical scheme, this narrating mode of description is only for clarity sake, description should can also be formed, through appropriately combined, other embodiments that it will be appreciated by those skilled in the art that as an entirety, the technical scheme in each embodiment by those skilled in the art.

Claims

1. a cooling type LED module, including substrate (1), LED chip (4), installing zone (6), heat-conducting layer (7), layer of silica gel (8) and heat sink (9)；It is characterized in that, described substrate (1) is preset with installing zone (6), and installing zone (6) connection arranges anelectrode paster (2), negative electrode paster (3)；Described LED chip (4) is arranged in installing zone (6), and LED chip (4) is positioned at substrate (1) top；The positive pole pin of described LED chip (4) is electrically connected with anelectrode paster (2), and the negative pin of LED chip (4) is electrically connected with negative electrode paster (3)；Described substrate (1) bottom is laid with heat sink strip (5), and substrate (1) bottom is provided with heat-conducting layer (7), and heat sink strip (5) contacts setting with heat-conducting layer (7)；Described heat-conducting layer (7) lower section is provided with layer of silica gel (8), and layer of silica gel (8) bottom is provided with heat sink (9), and wherein, heat-conducting layer (7) passes through layer of silica gel (8) and heat sink (9) bonding setting；Simultaneously, it is provided with radiation rib (11) between heat-conducting layer (7), layer of silica gel (8) and heat sink (9), wherein radiation rib (11) level is longitudinally disposed, and between radiation rib (11), equidistant parallel is arranged, and radiation rib (11) is provided with thermal vias (10).

Cooling type LED module the most according to claim 1, it is characterised in that described anelectrode paster (2) includes pcb board sheet, positive terminal pad, and positive terminal pad is arranged on pcb board sheet, and pcb board sheet is bonding with substrate (1).

Cooling type LED module the most according to claim 1, it is characterised in that described negative electrode paster (3) includes pcb board sheet, negative terminal pad, and negative terminal pad is arranged on pcb board sheet, and pcb board sheet is bonding with substrate (1).