TW200502443A - Method of electroplating a workpiece having high-aspect ratio holes - Google Patents
Method of electroplating a workpiece having high-aspect ratio holesInfo
- Publication number
- TW200502443A TW200502443A TW093106242A TW93106242A TW200502443A TW 200502443 A TW200502443 A TW 200502443A TW 093106242 A TW093106242 A TW 093106242A TW 93106242 A TW93106242 A TW 93106242A TW 200502443 A TW200502443 A TW 200502443A
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece
- aspect ratio
- electroplating
- ratio holes
- current flow
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000009713 electroplating Methods 0.000 title 1
- 230000000694 effects Effects 0.000 abstract 1
- 239000003792 electrolyte Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10311575A DE10311575B4 (de) | 2003-03-10 | 2003-03-10 | Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200502443A true TW200502443A (en) | 2005-01-16 |
Family
ID=32892263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093106242A TW200502443A (en) | 2003-03-10 | 2004-03-09 | Method of electroplating a workpiece having high-aspect ratio holes |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060151328A1 (ja) |
EP (1) | EP1601822A1 (ja) |
JP (1) | JP2006519931A (ja) |
KR (1) | KR20050105280A (ja) |
DE (1) | DE10311575B4 (ja) |
TW (1) | TW200502443A (ja) |
WO (1) | WO2004081262A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107109677A (zh) * | 2014-12-05 | 2017-08-29 | 埃托特克德国有限公司 | 用来在衬底上电镀金属的方法及设备 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7553401B2 (en) * | 2004-03-19 | 2009-06-30 | Faraday Technology, Inc. | Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating |
US7947161B2 (en) * | 2004-03-19 | 2011-05-24 | Faraday Technology, Inc. | Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes |
DE102004045451B4 (de) * | 2004-09-20 | 2007-05-03 | Atotech Deutschland Gmbh | Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer |
US20070063521A1 (en) * | 2004-12-03 | 2007-03-22 | Lancashire Christopher L | Method and apparatus for plating automotive bumpers |
CN101416569B (zh) * | 2006-03-30 | 2011-04-06 | 埃托特克德国有限公司 | 用金属填充孔和凹处的电解方法 |
US8062496B2 (en) * | 2008-04-18 | 2011-11-22 | Integran Technologies Inc. | Electroplating method and apparatus |
JP5425440B2 (ja) * | 2008-10-20 | 2014-02-26 | 株式会社Jcu | 銅めっきにおけるウィスカーの抑制方法 |
US20100206737A1 (en) * | 2009-02-17 | 2010-08-19 | Preisser Robert F | Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) |
JP5504147B2 (ja) | 2010-12-21 | 2014-05-28 | 株式会社荏原製作所 | 電気めっき方法 |
US9816193B2 (en) | 2011-01-07 | 2017-11-14 | Novellus Systems, Inc. | Configuration and method of operation of an electrodeposition system for improved process stability and performance |
US10541140B2 (en) | 2011-01-26 | 2020-01-21 | Macdermid Enthone Inc. | Process for filling vias in the microelectronics |
CN103179806B (zh) * | 2011-12-21 | 2019-05-28 | 奥特斯有限公司 | 组合的通孔镀覆和孔填充的方法 |
US9816196B2 (en) | 2012-04-27 | 2017-11-14 | Novellus Systems, Inc. | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte |
US9435048B2 (en) * | 2013-02-27 | 2016-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Layer by layer electro chemical plating (ECP) process |
DE102013021586A1 (de) * | 2013-12-19 | 2015-06-25 | Ludy Galvanosysteme Gmbh | Verfahren und Vorrichtung zum elektrochemischen Behandeln von flachem Behandlungsgut |
US10154598B2 (en) | 2014-10-13 | 2018-12-11 | Rohm And Haas Electronic Materials Llc | Filling through-holes |
SG11202106509UA (en) * | 2018-12-28 | 2021-07-29 | Acm Res Shanghai Inc | Plating apparatus and plating method |
CN110699725A (zh) * | 2019-11-21 | 2020-01-17 | 上海江南轧辊有限公司 | 一种液中放电沉积系统及其使用方法 |
WO2021245766A1 (ja) * | 2020-06-02 | 2021-12-09 | 奥野製薬工業株式会社 | 断続的電気めっき方法 |
CN114554727A (zh) * | 2022-03-31 | 2022-05-27 | 生益电子股份有限公司 | 一种实现高纵横比通盲孔的电镀方法及pcb |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH629542A5 (de) * | 1976-09-01 | 1982-04-30 | Inoue Japax Res | Verfahren und vorrichtung zur galvanischen materialablagerung. |
DE4134632C1 (ja) * | 1991-10-19 | 1993-04-01 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
DE4225961C5 (de) * | 1992-08-06 | 2011-01-27 | Atotech Deutschland Gmbh | Vorrichtung zur Galvanisierung, insbesondere Verkupferung, flacher platten- oder bogenförmiger Gegenstände |
DE4344387C2 (de) * | 1993-12-24 | 1996-09-05 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens |
DE19547948C1 (de) * | 1995-12-21 | 1996-11-21 | Atotech Deutschland Gmbh | Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung |
DE19717512C3 (de) * | 1997-04-25 | 2003-06-18 | Atotech Deutschland Gmbh | Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen |
US6071398A (en) * | 1997-10-06 | 2000-06-06 | Learonal, Inc. | Programmed pulse electroplating process |
US6210555B1 (en) * | 1999-01-29 | 2001-04-03 | Faraday Technology Marketing Group, Llc | Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating |
DE19915146C1 (de) * | 1999-01-21 | 2000-07-06 | Atotech Deutschland Gmbh | Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen |
US6444110B2 (en) * | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
JP2001152386A (ja) * | 1999-07-12 | 2001-06-05 | Applied Materials Inc | 高アスペクト比構造のために電気パルス変調を使用する電気化学堆積方法及びシステム |
US20040045832A1 (en) * | 1999-10-14 | 2004-03-11 | Nicholas Martyak | Electrolytic copper plating solutions |
US6652727B2 (en) * | 1999-10-15 | 2003-11-25 | Faraday Technology Marketing Group, Llc | Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes |
US6881318B2 (en) * | 2001-07-26 | 2005-04-19 | Applied Materials, Inc. | Dynamic pulse plating for high aspect ratio features |
-
2003
- 2003-03-10 DE DE10311575A patent/DE10311575B4/de not_active Expired - Fee Related
-
2004
- 2004-02-04 US US10/544,252 patent/US20060151328A1/en not_active Abandoned
- 2004-02-04 KR KR1020057016921A patent/KR20050105280A/ko not_active Application Discontinuation
- 2004-02-04 EP EP04707942A patent/EP1601822A1/en not_active Withdrawn
- 2004-02-04 WO PCT/EP2004/002208 patent/WO2004081262A1/en not_active Application Discontinuation
- 2004-03-04 JP JP2006504539A patent/JP2006519931A/ja not_active Ceased
- 2004-03-09 TW TW093106242A patent/TW200502443A/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107109677A (zh) * | 2014-12-05 | 2017-08-29 | 埃托特克德国有限公司 | 用来在衬底上电镀金属的方法及设备 |
CN107109677B (zh) * | 2014-12-05 | 2019-04-09 | 埃托特克德国有限公司 | 用来在衬底上电镀金属的方法及设备 |
Also Published As
Publication number | Publication date |
---|---|
WO2004081262A1 (en) | 2004-09-23 |
DE10311575A1 (de) | 2004-09-23 |
DE10311575B4 (de) | 2007-03-22 |
JP2006519931A (ja) | 2006-08-31 |
EP1601822A1 (en) | 2005-12-07 |
US20060151328A1 (en) | 2006-07-13 |
WO2004081262A8 (en) | 2004-12-16 |
KR20050105280A (ko) | 2005-11-03 |
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