TW200500168A - Polishing device - Google Patents

Polishing device

Info

Publication number
TW200500168A
TW200500168A TW093112154A TW93112154A TW200500168A TW 200500168 A TW200500168 A TW 200500168A TW 093112154 A TW093112154 A TW 093112154A TW 93112154 A TW93112154 A TW 93112154A TW 200500168 A TW200500168 A TW 200500168A
Authority
TW
Taiwan
Prior art keywords
polish
tool
polishing device
polishing
subject
Prior art date
Application number
TW093112154A
Other languages
English (en)
Inventor
Satoshi Nagai
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW200500168A publication Critical patent/TW200500168A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW093112154A 2003-05-02 2004-04-30 Polishing device TW200500168A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003126955A JP2004330326A (ja) 2003-05-02 2003-05-02 ポリッシング装置

Publications (1)

Publication Number Publication Date
TW200500168A true TW200500168A (en) 2005-01-01

Family

ID=33410358

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093112154A TW200500168A (en) 2003-05-02 2004-04-30 Polishing device

Country Status (4)

Country Link
US (1) US20070032174A1 (zh)
JP (1) JP2004330326A (zh)
TW (1) TW200500168A (zh)
WO (1) WO2004096492A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007059661A (ja) * 2005-08-25 2007-03-08 Sony Corp 研磨方法および研磨装置
JP4680314B1 (ja) * 2010-02-04 2011-05-11 東邦エンジニアリング株式会社 研磨パッド用補助板およびそれを用いた研磨パッドの再生方法
JP5980476B2 (ja) * 2010-12-27 2016-08-31 株式会社荏原製作所 ポリッシング装置およびポリッシング方法
JP5795977B2 (ja) * 2012-03-14 2015-10-14 株式会社荏原製作所 研磨装置
JP6190286B2 (ja) * 2014-02-14 2017-08-30 株式会社荏原製作所 基板保持装置および研磨装置
JP2021174914A (ja) * 2020-04-28 2021-11-01 株式会社ディスコ ウェットエッチング方法、及び、ウェットエッチング装置
CN112792711B (zh) * 2020-12-31 2022-05-17 武汉风帆电化科技股份有限公司 一种晶硅片碱抛光装置及抛光工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3611404B2 (ja) * 1996-06-21 2005-01-19 株式会社荏原製作所 ポリッシング装置
US6602380B1 (en) * 1998-10-28 2003-08-05 Micron Technology, Inc. Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
US6244931B1 (en) * 1999-04-02 2001-06-12 Applied Materials, Inc. Buffer station on CMP system
JP2002110598A (ja) * 2000-09-26 2002-04-12 Toshiba Corp Ｃｍｐ装置
JP2002103262A (ja) * 2000-09-27 2002-04-09 Nippei Toyama Corp 半導体ウェーハの吸着装置
US6561881B2 (en) * 2001-03-15 2003-05-13 Oriol Inc. System and method for chemical mechanical polishing using multiple small polishing pads
US6641468B2 (en) * 2002-03-05 2003-11-04 Promos Technologies Inc Slurry distributor
JP2004288727A (ja) * 2003-03-19 2004-10-14 Seiko Epson Corp Ｃｍｐ装置、ｃｍｐ研磨方法、半導体装置及びその製造方法

Also Published As

Publication number Publication date
WO2004096492A1 (ja) 2004-11-11
JP2004330326A (ja) 2004-11-25
US20070032174A1 (en) 2007-02-08

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