TW200424280A - Circuit connection adhesive - Google Patents

Circuit connection adhesive Download PDF

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Publication number
TW200424280A
TW200424280A TW93112226A TW93112226A TW200424280A TW 200424280 A TW200424280 A TW 200424280A TW 93112226 A TW93112226 A TW 93112226A TW 93112226 A TW93112226 A TW 93112226A TW 200424280 A TW200424280 A TW 200424280A
Authority
TW
Taiwan
Prior art keywords
adhesive
connection
circuit
film
connection terminal
Prior art date
Application number
TW93112226A
Other languages
English (en)
Chinese (zh)
Other versions
TWI316536B (https=
Inventor
Sachihisa Hirosawa
Itsuo Watnebe
Yasushi Goto
Jun Takedatsu
Masanori Fujii
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to TW93112226A priority Critical patent/TW200424280A/zh
Publication of TW200424280A publication Critical patent/TW200424280A/zh
Application granted granted Critical
Publication of TWI316536B publication Critical patent/TWI316536B/zh

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
TW93112226A 2001-11-14 2001-11-14 Circuit connection adhesive TW200424280A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93112226A TW200424280A (en) 2001-11-14 2001-11-14 Circuit connection adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93112226A TW200424280A (en) 2001-11-14 2001-11-14 Circuit connection adhesive

Publications (2)

Publication Number Publication Date
TW200424280A true TW200424280A (en) 2004-11-16
TWI316536B TWI316536B (https=) 2009-11-01

Family

ID=45073250

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93112226A TW200424280A (en) 2001-11-14 2001-11-14 Circuit connection adhesive

Country Status (1)

Country Link
TW (1) TW200424280A (https=)

Also Published As

Publication number Publication date
TWI316536B (https=) 2009-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees