TW200423305A - Image sensor package and image pickup module using the image sensor - Google Patents

Abstract

The present invention is related to a kind of image sensor packaging structure, which is mainly packaged on a PCB circuit board to form an image sensor. At least one surface of the PCB circuit board is provided with the conducting layer and is disposed with one opening window, in which the specifications of the opening window is nearly equal to the size of sensing area of the image sensor chip. The etching process through the use of mask is conducted onto the PCB circuit board to form plural leads, which correspond to the positions of the bonding pads of one image sensor chip; and the leads are partially covered with the electrically conductive medium for bonding the chip to the PCB circuit board to form electric connection through the application of SMT process. And, the position corresponding to the chip is encapsulated with glass. For the image pickup module of the invented image sensor, the module circuit is disposed on the PCB circuit board, or the module circuit is disposed inside one SMT board where an opening hole is preserved. The specification of the opening hole is similar to the product size of the packaged image sensor. The external leads of the image sensor are fixed at the opening-hole position of the SMT board through the use of surface mounting method so as to form electric connection with the module circuit. The lens holder of one lens set is disposed to cover above the image sensor so as to form one image pickup module.

Description

200423305 V. Description of the invention (1) [Field of invention] n # ί The invention relates to an image sensor package, which becomes a cracked substrate M, co-grained chip-on-chip, and glass-on-chip by PCB circuit board I: 2. And Λ r :: provides the advantages of thin and short image capture module. L first W technology] =, the sensor (Image sensor) Ic assembly technology is currently more than r r ΡΤΓΓ; I brother 1 ◦, 1 1 plastic substrate shown in Figure 1, Shi, brother 12 C / F Plastic injection structure (KLC (:) The main common feature of some of the structure technology is the crystal implantation of the crystal seat (d "3, advance after use: wire bonding), but in the image sensing, generally consumer Under the guidance of electronic products, the restrictions on the cost of assembly and the accumulation of limbs tend to be more stringent, so the aforementioned assembly techniques meet each other's respective problems such as: (1) substrates required for ceramic assembly (CLCC) The mass production of burning technology is not easy to cause the cost of the structure is too high, usually only used in products that require high power and high reliability. (2) Figure 10 The plastic substrate structure (pLCC) needs to be injected on the pcB board (Pre -mold) side wall (80a), the substrate (80b) of the L / F plastic injection structure (KLCC) needs to be injected with the lead frame, the two assembly methods require separate injection molds, so the manufacturing process is complicated And the cost is only lower than that of the ceramic assembler, and the poor heat dissipation of the two packages can easily cause warp age and moisture problems. Poor reliability induced product. (3) mounted on a plastic substrate structure of FIG. 11 (PLCC), which mainly substrate

200423305 V. Description of the invention (2) When a PCB board with circuit wiring is glued together, another PCB board will be stacked on top of the other due to the glue, and it will be easier and hotter than the two layers. (4) Plastic substrate Structuring away. Lead frame (Leid f) and L / F plastic injection structure increase it, and the process of going south and ram) 'Although it can automate a large number of manufacturing processes Q: C density to overcome the reliability of wire bonding (5) These assembly techniques In terms of productivity efficiency, it does not = hit,: \ In addition to adding equipment requirements and eventually sealing the body: Good 2; limited by the needs of the substrate to make it necessary to print = right for the image capture module mobile phone The plr board adds the overall thickness of the module, so it poses a nuisance to mobile electronic ports such as line α A and network cameras. ^ Seat

—; The current trend of assembly technology is toward flip-chip (FliP ^ f ^ a TS. Re-soldering of circuit contacts on the substrate, but also gj will say that the top surface of the grain is facing the substrate? = RAN flip-chip has ^ Size, the application of this technology to image sensing (9 Π: known as an image sensor flip chip structure π Jiadeshan II a broken glass plate (9 1) the inner surface is etched using a photomask ^ T, (9 1 〇), so its process is quite complicated and can affect the optical characteristics or its packaging products due to the lack of anti-die filling.

V. Description of the invention (3) Reliability. Modular thinking needs ::::: The application of modules is becoming more and more widespread. However, digital products for personal use are responding to products, such as communication products or low-cost dual competition image capture functions. The volume market and volume are in line with the market's' increasing: loading f can better meet market demand. 2 and 2 heads are incorporated into the modular design, which should be [inventive content] like residuals :: ϊ ΐ The purpose is to solve the above problems and provide-a kind of image: image and circuit module, can be used ( Surface adhesive products can be installed by i% to simplify the process of mechanical equipment requirements and improve production. Product: This and the packaging volume have been significantly reduced. Road molds are used to install the supported image extraction power. In order to achieve the purpose described in Image sensor package, windowed. The base and solid specifications of ΒΛ road gauge are similar to those of an image sensor. ^ ^? ^ ^ ^ ^ ^ (Solder to prevent the dust from falling into the image sensor crystal Grain surface. — Again, the PCB circuit board surface is on the window side and is formed with a photomask. Each pin is set to include the inner pin and the outer pin. The number of image sensor grains is 1. Its solder pads are corresponding to the inner pins bonded to pcB electric 200423305

Circuit board to form an electrical connection;

Corresponds to the Rihan 粒, L 筌 · of the day and the day of the circuit substrate with a glass sealing the image capture module of the present invention, including a glass sensor of the present invention; a printed circuit, a lens group Among them: = 卩 Brush circuit presets a module circuit with parallel holes and open holes ;; the grain size is close to the aforementioned image sensor; the outer pins of the image sensor are fixed on the SMT substrate by surface adhesion. Position and is electrically connected with the module circuit; the lens group is provided with a lens holder and is arranged on the image sensor [Embodiment] The image sensor package structure of the present invention will be described with reference to FIG. 1 & gt , Which includes: t β —The PCB circuit substrate (i 〇) is opened on the surface—a window (1 1) that penetrates a corresponding surface, the size of the window is similar to the size of the sensing area of the main force TJI C Chip (2), and Window > This shield (Solder mask) or gold-plated cover and other shields to prevent falling dust from falling onto the surface of the image sensor die. 11 The PCB circuit substrate (1 〇) — the side surface is on the window 4 ® ΰ side and the majority of the pins (L ead) r 1 „p} (1 2) are formed with a photomask * etch (E tchi η g), each The LM pin (Lead) is set to include two parts of the inner pin (12 a, r, a) and the outer pin l 1 2 b); at least d R ,, / '', ee. W pin on the PCB circuit substrate (Lead) Change the solder mask (Solder mask) and then according to the image sense

200423305 V. Description of the invention (5) The inner pins are partially covered with 1 soil, including silver glue, solder paste, or conductive dielectric. The inner pins of the dielectric material form a solder joint (1 3). 〃, p method or the glue method in an image sensing chip (2) Li Li blood blood flip chip method or non-wired process bonding to the corresponding internal lead solder joints of the PCB Lei Zhenggan to knot; 1 (^ The circuit board constitutes a PCB circuit board that is electrically connected to the corresponding crystal grains of the glass. Another surface window (3) is covered; Shang m J: The crystal grains and the glass are filled with (InH.ρ, 3 " =) Gas: Material (... From the foregoing package structure (1), the image can be clearly seen from the sun and the moon. This image predicts that the circuit board replaces the plastic ejection board, and the two ~ ^ Chengli pins replace the old wire rods, so — «Generation., Φ. 21 I Therefore, the package quality is the same as the flip-chip method = t I particles have good heat dissipation and smaller package size, etc. Compared with ::: 视频 m 结构 装 技术 #, the present invention can be used Xie equipment performs chip-on-chip bonding with a chip like sensor chip and (chiP) pads corresponding to the lead soldering black (1 3) position on the PCB circuit board to form an electrical connection, and uses a chip loader or SMT device A glass (3) is used to cover the window position. Therefore, in addition to simplifying the packaging structure and reducing the packaging cost, the invention is more There are many reductions in the time course of seeking or subcontracting. Compared with ordinary flip chip technology, it does not fill the upper surface of the die to ensure product reliability. Figure 2 is an image capture module of the present invention. One of the embodiments is the application of the pre- · 1215 image sensor (1), an STM substrate (4), a lens 200423305, and a description of the invention (6) (5), wherein: As shown in FIG. 3, the SMT substrate is provided with a module circuit (4 1) and an open hole (4 2), and the module circuit reserves most pins (4 1 1) beside the open hole and One end of the SMT substrate is provided with a pin. Pin (4 1 2

), In the process of forming the image capturing module, a screen printing brush is required to locally attach the solder paste to these majority pins as connection points, so the image sensor (1) of the present invention can use its PCB circuit substrate The outer pin (1 2 b) is fixed to the open hole of the S μ T substrate by surface adhesion and is electrically connected to the module circuit. The size of the open hole of the SMT substrate is similar to the die of the image sensor (2 The lens group (5) is provided with a lens holder (51) and is arranged above the PCB circuit substrate of the image sensor. In addition, 'the image sensor sealing glass can be coated before its front operation'. AR film on one side is coated with 11? Film on the other side, which can increase the light transmittance and reduce the reflection of light paint to prevent white light from being illuminated by the strong light. It is anti-ghosting, and the setting of the filter in the lens group (5) can be omitted, so the height of the lens group can be lowered, and the overall height of the printed circuit board is greatly reduced. This is significant for improving the application of subsequent products. benefit. The image capture module described above can achieve several advantages:

(1) Based on the package structure of the image sensor of the present invention and providing on-process packaging, the assembly of the image capture module can introduce SMT assembly technology in large quantities, which is consistent with automated production. (2) The image sensor package of the present invention can ensure product reliability. Assembly structure and image capture module assembly method

Page 10 200423305 V. Description of the invention (7) (3) Compared with the conventional package, the present invention significantly reduces the overall height of the image capture module, which has significant benefits in improving subsequent application products. (4) It can effectively increase production capacity and reduce equipment demand, so product cost can be greatly reduced. Figures 4A and 4B are another two embodiments of the image sensor of the present invention. A PCB circuit substrate (6 1 1) packaged by the image sensor (6 1) is formed on one side by photomask etching (Etching). There are a plurality of inner leads (6 1 2) 'at the edge of the window. Each inner lead is electrically connected to the majority of the outer leads on the other surface of the PCB circuit substrate (〇ut (613), 4 A The inner pin and the outer pin are connected by a via (6 1 4). FIG. 5 shows another embodiment of the image capture module (6) of the present invention. The SMT substrate (6 2), the aforementioned image sensor (6 1) is adhered to the lower surface of the SMT substrate so that the image sensor glass is scattered into the SMT substrate opening (6 3), and the lens (6 4) seat f is provided on the SMT substrate On the surface, this design can greatly reduce the height of the lens mount, and can also provide future lenses directly attached to the SMT substrate to compress the space above the smt substrate to the minimum limit. Figure 6 shows a fourth embodiment of the image sensor of the present invention. The main acoustic difference is that the crystal (7 1 1) of the image sensor (7 1) is reduced, and then the periphery of the area is coated with UV glue, and the glass (7 1 2) is placed in the PCF substrate ^ °°° and directly bonded to the surface of the die. The thickness of the glass is slightly larger than that of the PCB circuit substrate to facilitate the cleaning of the glass surface, and X'1 outside the glass. Fill with 胶 V glue (7 1 4) and then cure by UV irradiation to complete the glue seal. 'This method can particularly omit the space occupied by the thickness of the glass, Figure 7 Figure 2'

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77Q 200423305 V. Description of the invention Another 6) The design of the shell 1 can have pins (7 conductive layer in Ob) directly on the surface of the 8th mouth. Set different options (7 B). Image capture packaged by this tester ( 8) An image capture is provided in which two types of A, 8 B are greatly reduced, and are bonded to the conductive layer 20 a of the crystal preparation, and the two names are on the side of the window. The ninth embodiment. Some examples are the structure and the module taking, the module taking (7 A) embodiment, the lens holder (7 1 above the PCB circuit board of the image sensor, and the height of the lens group (715). The glass shown in the figure is also The difference between the window particle surface of the PCB circuit substrate is placed on both sides of the PCB circuit substrate. One of the conductive layers is formed within the majority of the window side (730a). Each inner pin is electrically connected to the majority of the outer leads formed at another moment. Pin (7 2 0 b, 7 3 type image sensors can provide adhesive bitmaps for subsequent applications. The third type of image capture module of the present invention shows that the present invention simplifies the image sense by using a PCB circuit substrate. The design and integration of the substrate creates light, thin and short, so the invention has great industrial value.

200423305 Brief description of the drawing [Simplified drawing The first figure is the second figure and the example is. Figure 3 is 4 A, Figure 4 B, Figure 5 is true, Figure 6 is Figure 7, and Figure 8 is 8 A, Figure 8 B, Figure 9 is true, Figure 10, Figure 11 and Figure 12 Fig. 13 [Figure number (Xi side wall (8 lead frame) (The second picture is the first embodiment of the present application of the present invention. The present invention is applied to the present embodiment. The present invention is applied to the present embodiment of the present invention. Knowing is knowing, knowing is knowing, using part 〇a) 8 1 and 2 Description】 This embodiment of the image sensor of the present invention. Using the image acquisition module composed of the first image sensor group The schematic diagram of the middle SMT substrate shows the second embodiment of the image sensor. The third embodiment of the image sensor is shown. The image capture module composed of the 4 A image image sensor group is an image sensing module of the fourth and sixth images. Image acquisition module composed of sensor groups Really clear image sensor embodiment of the five image sensor embodiment sixth 8 A Figure image acquisition module composed of image sensor group plastic substrate structure ( PLCC) image sensor. Plastic substrate structure (PLCC) image sensor. C / F plastic injection structure (KLCC) image sensor. F1 ipch i p) Encapsulating the image sensor. Substrate (80b) (81b) Sensor chip structure (9)

Page 13 200423305 Schematic illustration of the glass plate (9 1) (part of the present invention) image sensor (1, 6 1) window (1 1, 7 1 3) cover (1 1 1) glass (3, 7 1 2) SMT substrate (4, 6 2) Plug pins (4 1 2) Outer arch 1 foot (1 2 b, 6 1 3 Lens group (5, 7 1 5) Image acquisition module (6, 7 A via (6 1 4) inner pin (6 1 2, 7 2 0 open hole (6 3) circuit (9 1 0) PCB circuit substrate (10, 611 image sensing die (2, 7 1 1 : Solder joint (1 3) UV glue (2 1, 3 1, 7 1 4 pins (4 1 1), 720b, 73〇b) Lens mount (5 1, 7 1 '6), 7 B) 1 , 7 3 0 a)

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Claims (1)

200423305 VI. Application Patent Scope 1. An image sensor package, including: a PCB circuit board has a window on the surface that penetrates to the other side, and the specifications of the window are similar to those of an image sensor & table size, And the window wall is covered with shields around it; μ ′, the surface of the PC Β circuit board is on the side of the window and a plurality of leads are formed by a mask silver etch (Etching), and each bow is defined as including Two parts of the pin and the pin; Another image sensor die (Ch i ρ) is connected to the deer with its pads and is connected to the PCB circuit substrate to form an electrical connection; ^ 1 PCB circuit substrate corresponding to the die The position of the window is covered with a broken glass to cover the crystal grains and the surrounding glass is filled (U nderfi 1 1) with a plastic material to be airtight. " 冓 2 · According to the image sensor package described in item 1 of the scope of the patent application, most of the pins formed by photo-etching are provided on the side surface of the PCB circuit board. 3 · According to the image sensor package described in item 1 of the scope of the patent application, most of the pins formed by photomask etching are provided on both surfaces of the PCB circuit board, and most pins on the same side are defined as inner pins (InneF lead), most pins formed on the other side are defined as external pins (〇ut 1 ead), and each internal and external pin is electrically connected. 4. An image sensor package according to item 2 or 3 of the scope of the patent application, wherein covering the periphery of the wall of the window with a covering includes applying a solder mask or gold plating. 200423305 6. Scope of patent application 6 · According to an image sensor seal described in item 5 of the scope of application for patent, t glass is coated with a R film on one side and j films on the other side, 7 8 〇 The image sensor package glass described in item 1 is glued and sealed on the grain sensing area of the image sensor. According to the fourth scope of the patent application, the image sensor is sealed and the glass is glued and sealed on the grain sensing area of the image sensor. The thickness of the glass package of the image sensor according to item 8 of the patent application scope is slightly larger than the thickness of the PCB circuit board. • An image capture module, including an image sensor, a board, and a lens group, where: / The image sensor package structure is a PCB circuit substrate, ~ image sensing die, a glass; The surface of the PCB circuit board has a window that penetrates through to the corresponding surface, and the size of the f port is similar to the size of the sensing area of the image. The PCB circuit board table / r H (Etchin ^ ea, each lead) is set to Including the inner and outer pins; the image sensing chip (chip) is connected to the pcB circuit substrate with a 1 soldering pin corresponding to the PCB circuit substrate ^ to form an electrical connection corresponding to the PCB of the image sensing chip The position of the circuit substrate window is covered with-break; the image sensing die and the glass surrounding filling / UnderfUl) plastic material to form airtightness; A SMT substrate contains a module circuit and an open hole is reserved. The specifications of the open hole are similar. The size of the grain is sensed in the aforementioned image; the outer pins of the image sensor are fixed on the surface of the image sensor by using a surface adhesive method, in which the SMT-based Page 16 ikd 200423305 VI. Scope of patent application SMT substrate open hole position and electrical connection with the module circuit ’> The lens set is provided with ~ a lens holder (Holder) travel hood above the famous image sensor. 1 1. According to the image sensor module described in Item 10 of the scope of the patent application, wherein most of the image sensors are formed by mask etching, and the feet are provided on the single-side surface of the PCB substrate. 2 The image sensor module according to item 丄 0 in the scope of the patent application, wherein the image sensor is formed by masking a plurality of pins on both surfaces of the PCB circuit substrate and a plurality of pins on the same side. It is defined as an inner pin, and most pins formed on the other side are defined as outer pins (〇ut 1 ead), and each of the inner and outer pins is electrically connected. According to the image sensor module described in item i 1 and item 12 of the scope of the patent application, covering the periphery of the window edge of the window with a cover includes applying a solder mask or gold plating. 4 According to the image sensor module described in item i 3 of the scope of the patent application, the glass is coated with an AR film on one side and the film on the other. According to the image sensor module described in Item 14 of the scope of the patent application, wherein the SMT substrate is a double-layer circuit board for module circuit wiring, the image sensor is adhered to the lower surface of the SMT substrate and the image is The sensor glass is embedded in the open hole of the SMT substrate, and the lens holder is provided on the upper surface of the SMT substrate above the image sensor. V The image sensor module according to item 15 of the scope of the patent application, wherein one end of the SMT substrate is provided with a module circuit plug bow, ° ',' & ' Page 17 200423305 6. Scope of patent application 17 · According to the image sensor module described in item 13 of the scope of patent application, the glass is glued and sealed in the grain sensing area of the image sensor. 18 · The image sensor module according to item 17 of the scope of patent application, wherein the glass is glued and sealed in the grain sensing area of the image sensor. 19 · According to the image sensor module described in item 18 of the scope of patent application, the thickness of the glass is slightly larger than the thickness of the PCB circuit substrate. Page 18