CN106657720A - Image photographing module and manufacturing method thereof - Google Patents
Image photographing module and manufacturing method thereof Download PDFInfo
- Publication number
- CN106657720A CN106657720A CN201510732423.7A CN201510732423A CN106657720A CN 106657720 A CN106657720 A CN 106657720A CN 201510732423 A CN201510732423 A CN 201510732423A CN 106657720 A CN106657720 A CN 106657720A
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- CN
- China
- Prior art keywords
- mentioned
- circuit substrate
- sensing chip
- image sensing
- photographing module
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
Abstract
The invention discloses an image photographing module and a manufacturing method thereof. The image photographing module comprises a circuit substrate, a lens mount, a lens group and an image sensing chip. The circuit substrate is provided with a light transmitting area. The lens mount is fixed on the upper surface of the circuit substrate and covers the light transmitting area. The lens group comprises at least one imaging lens. The lens group is arranged in the lens mount so that the optical axis formed by the lens group is enabled to penetrate through the light transmitting area. The image sensing chip is arranged on the lower surface of the circuit substrate and electrically connected with the circuit substrate, and the image sensing chip is arranged on the optical axis.
Description
Technical field
The present invention relates to a kind of photographing module, more particularly to a kind of small-sized image pickup module being installed in portable device.
Background technology
In the case where the demand of consumption market is led, in order that can possess more functions in portable electronic equipment, while making the man-hour of the manufacturing and cost further reduce.Then the various elements in electronic installation are applied to towards miniaturization and modular direction evolution.
Refer to Fig. 1, the figure is the schematic diagram of the first prior art camera model 101, and for convenience of description, top unification in this specification and schema is the direction towards object, and lower section unification is direction towards imaging surface and photosensory assembly element, hereinafter then principle according to this without exception if not otherwise specified.Include containing a circuit board 201 in the existing camera model 101 shown in Fig. 1, the sensitive chip 501 that the one lens assembly element 30 and for being arranged on the upper surface of circuit board 201 is installed between lens assembly element 30 and circuit board 201, the sensitive chip 501 adopts Wafer level packaging（Chip Scale Package, CSP）, first with ceramics or plastic material after the outside formation encapsulated layer 51 of sensitive chip 501, then with surface mount agent art（SMT）The sensitive chip 501 that encapsulation is finished is soldered on circuit board 201.And the lens assembly element 30 is included containing a camera lens assembly assembly 311, at least one piece filter 35 of eyeglass 331 and for being installed in the top of camera lens assembly assembly 311, the filter 35 is installed between eyeglass 331 and sensitive chip 501.
Can minimize although wishing total height h of camera model 101 in design, but because lens member 30 has been limited in optical design, therefore specific distance is preferably must be held in the distance between sensitive chip 501 h1 from the top of eyeglass 331, therefore, it is possible to determine how being approximately dependent on for total height h of camera model 101 makes the bottom of camera model 101 reach minimum apart from h2 to sensitive chip 501.And from figure, the height substantially increase after encapsulation of sensitive chip 501 of this existing camera model 101, total height h for causing camera model 101 is difficult to reduce.
Fig. 2 is referred to again, to make the bottom of camera model 101 further reduce to the distance between sensitive chip 501 h2, in the second shown prior art sensitive chip 501 is fixed with circuit board 201 in the case of video sensing chip thickness is not increased in fig. 2, and be embedded at video sensing chip in the load bearing seat 53 of one indent to replace encapsulated layer 51, because video sensing chip is embedded in from lower to upper in the load bearing seat 53 of indent by the lower surface of load bearing seat 53, therefore under comparing with the prior art phase example in Fig. 1 the bottom of camera model 101 is effectively reduced to sensitive chip 501 apart from h2.
Refer to Fig. 3, to make the bottom of camera model 101 further reduce to the distance between sensitive chip 501 h2, then further on circuit board 201 hollow part 23 is set in the 3rd prior art shown in Fig. 3, and video sensing chip is imbedded in above-mentioned hollow part 23 further to reduce total height h of camera model 101.Although however, can further reduce total height h of camera model 101 during video sensing chip to be imbedded the hollow part 23 of circuit board 201, now video sensing chip is only fixed by the gluing of surrounding, therefore is acted on down by external force and easily separating with circuit board 201.
The content of the invention
The purpose of the present invention is the defect and a kind of photographing module of not enough offer existed for prior art, and purpose is reducing photographing module whole height and improving productivity effect.
To achieve these goals, the present invention provides a kind of photographing module, including a circuit substrate, a lens mount, a lens set and an image sensing chip；The circuit substrate is provided with a transmission region；Lens mount is fixed on the upper surface of the circuit substrate and is covered in above-mentioned transmission region；Lens set includes at least one piece imaging lens, and lens set is installed in above-mentioned lens mount, makes the optical axis that lens set is formed pass through above-mentioned transmission region；Image sensing chip is arranged at the lower surface of foregoing circuit substrate and is electrically connected with circuit substrate, and the video sensing chip is located on above-mentioned optical axis.
Used as further improvement, the transmission region is a through hole.
As further improvement, a filter is provided with the transmission region.
As further improvement, the upper surface of the image sensing chip is provided with several electrode contacts, and the lower surface in foregoing circuit substrate is then provided with some conductive spacers corresponding to above-mentioned electrode contact, above-mentioned electrode contact is electrically connected with conductive spacer by conductive material.
Used as further improvement, the conductive material is anisotropic conductive.
Used as further improvement, the electrode contact is around the outer peripheral edge for being arranged at image sensing chip, and above-mentioned conductive spacer is around the outer peripheral edge for being arranged at above-mentioned transmission region.
A kind of manufacture method of photographing module, it is characterised in that：Including a circuit substrate is prepared, the circuit substrate is provided with a transmission region, and is welded with default electronic component；Prepare an image sensing chip, and make the video sensing chip be connected with foregoing circuit electrical property of substrate and align above-mentioned transmission region the lower surface that above-mentioned image sensing chip is installed in circuit substrate；And preparing a lens mount and a lens set, the lens set is installed among above-mentioned lens mount, and above-mentioned lens mount is installed in into foregoing circuit upper surface of base plate, and the optical axis for making above-mentioned lens set passes through above-mentioned transmission region.
As further improvement, it is described the step of image sensing chip is installed in into circuit substrate lower surface in it is further comprising the steps：Several conductive spacers are formed at the lower surface of foregoing circuit substrate, and anisotropy conductive material is coated with the conductive spacer；Electrode contact is formed in the upper surface of above-mentioned image sensing chip；And after above-mentioned conductive spacer is alignd with above-mentioned electrode contact foregoing circuit substrate and above-mentioned image sensing chip are pressurizeed and heated, above-mentioned anisotropy conductive material is upwardly formed with the side in foregoing circuit substrate connection face in vertical above-mentioned image sensing chip and electrically conduct.
As described above, photographing module of the present invention is by the way that circuit substrate is installed between image sensing chip and lens set, and then reach the purpose for reducing photographing module whole height.
Description of the drawings
Fig. 1 is the profile of the first prior art.
Fig. 2 is the profile of the second prior art.
Fig. 3 is the profile of the 3rd prior art.
Fig. 4 is the profile of photographing module first embodiment of the present invention.
Fig. 5 is the profile of second embodiment of the invention.
Fig. 6 is the profile of third embodiment of the invention.
Fig. 7 is the explosive view of the circuit substrate with image sensing chip of photographing module of the present invention.
Fig. 8 is the Making programme figure of photographing module of the present invention.
Fig. 9 is fit in the present invention image sensing chip and the flow chart of circuit substrate.
Each description of reference numerals is as follows in figure.
The circuit substrate 20 of photographing module 10
The transmission region 22 of conductive spacer 21
The lens set 32 of lens mount 31
The optical axis 34 of imaging lens 33
The conductive material 40 of filter 35
The electrode contact 52 of image sensing chip 50.
Specific embodiment
To describe technology contents, structural feature, the purpose realized and effect of the present invention in detail, below in conjunction with specific embodiment and accompanying drawing is coordinated to be described in detail.
Refer to Fig. 4, the manufacture method of photographing module of the present invention, including containing：Prepare a circuit substrate, photographing module 10 is included containing a circuit substrate 20 in institute's first embodiment, the circuit substrate 20 is provided with a transmission region 22；One lens mount 31, is fixed on the upper surface of the circuit substrate 20 and covers above-mentioned transmission region 22；One lens set 32, the lens set 32 includes containing at least one piece imaging lens 33, lens set 32 and is installed in above-mentioned lens mount 31, makes the optical axis 34 that lens set 32 is formed through above-mentioned transmission region 22；And an image sensing chip 50, it is arranged at the lower surface of foregoing circuit substrate 20 and is electrically connected with circuit substrate 20, and the video sensing chip 50 is located on above-mentioned optical axis 34.
It is shown that predetermined height must maintained in the case where being limited by optical design apart from h1 due to lens set 32 to video sensing chip, therefore circuit substrate 20 is arranged between lens set 32 and video sensing chip 50, can effectively make the whole height of photographing module 10 reduces.
Please continue refering to Fig. 4, transmission region 22 above-mentioned in a preferred embodiment is a through hole, and it is further provided with a filter 35 among above-mentioned lens mount 31, the filter 35 is arranged on the optical axis 34 that lens set 32 is constituted, therefore filter 35 will be first passed through by the light of lens set 32 and reaches video sensing chip 50, and and then raising image quality again.But this not limits the filter 35 and must be provided with the lens mount 31.
Fig. 5 and Fig. 6 is referred to, is the second embodiment of photographing module of the present invention 10 in Fig. 5, above-mentioned filter 35 is attached at the upper surface of foregoing circuit substrate 20, enable to pass through filter 35 by the light of lens set 32.And in Fig. 6 is the 3rd embodiment shown in photographing module of the present invention 10, a filter 35 is provided with above-mentioned transmission region its transmission region 22, therefore filter 35 can equally be passed through by the light of lens set 32.And no matter in the embodiment shown in Fig. 5 or Fig. 6, the installation position of filter 35 may be contained within the accommodation space that lens mount 31 is formed with circuit substrate 20, therefore will not additionally increase the whole height of photographing module 10.
Refer to Fig. 7, in the embodiment shown in fig. 7, to make image sensing chip 50 be electrically connected with circuit substrate 20, the upper surface of above-mentioned image sensing chip 50 is provided with several electrode contacts 52, and the lower surface in foregoing circuit substrate 20 is then provided with conductive spacer 21 corresponding to above-mentioned electrode contact 52, above-mentioned electrode contact 52 is electrically connected with conductive spacer 21 by conductive material 40, and then image sensing chip 50 is electrically connected with circuit substrate 20.And in this embodiment, above-mentioned electrode contact 52 is around the outer peripheral edge for being arranged at image sensing chip 50, and above-mentioned conductive spacer 21 is around the outer peripheral edge for being arranged at above-mentioned transmission region 22.
Fig. 8 is referred to, is now illustrated with first embodiment, the making step of photographing module of the present invention 10 is as follows：
Prepare a circuit substrate 20, the circuit substrate 20 is provided with a transmission region 22, and is welded with default electronic component；Prepare an image sensing chip 50, and make the video sensing chip be electrically connected with foregoing circuit substrate 20 and align above-mentioned transmission region 22 lower surface that above-mentioned image sensing chip 50 is installed in circuit substrate 20；And preparing a lens mount 31 and a lens set 32, the lens set 32 is installed among above-mentioned lens mount 31, and above-mentioned lens mount 31 is installed in into the upper surface of foregoing circuit substrate 20, and the optical axis 34 for making above-mentioned lens set 32 passes through above-mentioned transmission region 22.
Refer to Fig. 7 and Fig. 9, it is above-mentioned the step of image sensing chip 50 is installed in into 20 lower surface of circuit substrate in it is further comprising the steps：
Several conductive spacers 21, and the applying conductive material 40 on the conductive spacer 21 are formed at the lower surface of foregoing circuit substrate 20, the conductive material 40 can be anisotropic conductive in the present embodiment（Anisotropic Conductive Paste, ACP）；Electrode contact 52 is formed in the upper surface of above-mentioned image sensing chip 50；And after above-mentioned conductive spacer 21 is alignd with above-mentioned electrode contact 52 foregoing circuit substrate 20 and above-mentioned image sensing chip 50 are pressurizeed and heated, above-mentioned anisotropic conductive is upwardly formed with the side of the joint face of foregoing circuit substrate 20 in vertical above-mentioned image sensing chip 50 and electrically conduct.
In sum, the present invention is by the way that circuit substrate 20 is installed between image sensing chip 50 and lens set 32, and then reaches the purpose for reducing the whole height of photographing module 10.
Claims (8)
1. a kind of photographing module, it is characterised in that：The photographing module includes a circuit substrate, a lens mount, a lens set and an image sensing chip；The circuit substrate is provided with a transmission region；Lens mount is fixed on the upper surface of the circuit substrate and is covered in above-mentioned transmission region；Lens set includes at least one piece imaging lens, and lens set is installed in above-mentioned lens mount, makes the optical axis that lens set is formed pass through above-mentioned transmission region；Image sensing chip is arranged at the lower surface of foregoing circuit substrate and is electrically connected with circuit substrate, and the video sensing chip is located on above-mentioned optical axis.
2. photographing module as claimed in claim 1, it is characterised in that：The transmission region is a through hole.
3. photographing module as claimed in claim 1, it is characterised in that：A filter is provided with the transmission region.
4. photographing module as claimed in claim 1, it is characterised in that：The upper surface of the image sensing chip is provided with several electrode contacts, and the lower surface in foregoing circuit substrate is then provided with some conductive spacers corresponding to above-mentioned electrode contact, and above-mentioned electrode contact is electrically connected with conductive spacer by conductive material.
5. photographing module as claimed in claim 4, it is characterised in that：The conductive material is anisotropic conductive.
6. photographing module as claimed in claim 4, it is characterised in that：The electrode contact is around the outer peripheral edge for being arranged at image sensing chip, and above-mentioned conductive spacer is around the outer peripheral edge for being arranged at above-mentioned transmission region.
7. a kind of manufacture method of photographing module, it is characterised in that：Including a circuit substrate is prepared, the circuit substrate is provided with a transmission region, and is welded with default electronic component；Prepare an image sensing chip, and make the video sensing chip be connected with foregoing circuit electrical property of substrate and align above-mentioned transmission region the lower surface that above-mentioned image sensing chip is installed in circuit substrate；And preparing a lens mount and a lens set, the lens set is installed among above-mentioned lens mount, and above-mentioned lens mount is installed in into foregoing circuit upper surface of base plate, and the optical axis for making above-mentioned lens set passes through above-mentioned transmission region.
8. the manufacture method of photographing module as claimed in claim 7, it is characterised in that：It is wherein described the step of image sensing chip is installed in into circuit substrate lower surface in it is further comprising the steps：Several conductive spacers are formed at the lower surface of foregoing circuit substrate, and anisotropy conductive material is coated with the conductive spacer；Electrode contact is formed in the upper surface of above-mentioned image sensing chip；And after above-mentioned conductive spacer is alignd with above-mentioned electrode contact foregoing circuit substrate and above-mentioned image sensing chip are pressurizeed and heated, above-mentioned anisotropy conductive material is upwardly formed with the side in foregoing circuit substrate connection face in vertical above-mentioned image sensing chip and electrically conduct.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510732423.7A CN106657720A (en) | 2015-10-30 | 2015-10-30 | Image photographing module and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510732423.7A CN106657720A (en) | 2015-10-30 | 2015-10-30 | Image photographing module and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106657720A true CN106657720A (en) | 2017-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510732423.7A Pending CN106657720A (en) | 2015-10-30 | 2015-10-30 | Image photographing module and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110611753A (en) * | 2018-06-15 | 2019-12-24 | 三赢科技（深圳）有限公司 | Lens module and assembling method thereof |
Citations (5)
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|---|---|---|---|---|
| JP2002010116A (en) * | 2000-06-21 | 2002-01-11 | Sharp Corp | Image pickup device and image pickup sensor for use therein |
| TWI221324B (en) * | 2003-04-16 | 2004-09-21 | Hung-Ren Wang | Image sensor package and image pickup module using the image sensor |
| CN1574379A (en) * | 2003-06-18 | 2005-02-02 | 三星电子株式会社 | Solid-state imaging method and apparatus |
| CN101937923A (en) * | 2009-06-30 | 2011-01-05 | 三星泰科威株式会社 | Camera module |
| CN204089956U (en) * | 2014-06-03 | 2015-01-07 | 广东欧珀移动通信有限公司 | There is camera module and the mobile phone of refrigerating function |
-
2015
- 2015-10-30 CN CN201510732423.7A patent/CN106657720A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002010116A (en) * | 2000-06-21 | 2002-01-11 | Sharp Corp | Image pickup device and image pickup sensor for use therein |
| TWI221324B (en) * | 2003-04-16 | 2004-09-21 | Hung-Ren Wang | Image sensor package and image pickup module using the image sensor |
| CN1574379A (en) * | 2003-06-18 | 2005-02-02 | 三星电子株式会社 | Solid-state imaging method and apparatus |
| CN101937923A (en) * | 2009-06-30 | 2011-01-05 | 三星泰科威株式会社 | Camera module |
| CN204089956U (en) * | 2014-06-03 | 2015-01-07 | 广东欧珀移动通信有限公司 | There is camera module and the mobile phone of refrigerating function |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110611753A (en) * | 2018-06-15 | 2019-12-24 | 三赢科技（深圳）有限公司 | Lens module and assembling method thereof |
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Application publication date: 20170510 |
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