CN104241300A - Image sensor packaging and manufacturing method - Google Patents
Image sensor packaging and manufacturing method Download PDFInfo
- Publication number
- CN104241300A CN104241300A CN201310346865.9A CN201310346865A CN104241300A CN 104241300 A CN104241300 A CN 104241300A CN 201310346865 A CN201310346865 A CN 201310346865A CN 104241300 A CN104241300 A CN 104241300A
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- CN
- China
- Prior art keywords
- image sensor
- sensor package
- imageing sensor
- package according
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 title abstract description 5
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 238000003475 lamination Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 17
- 238000013007 heat curing Methods 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- 239000007767 bonding agent Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 16
- 238000000465 moulding Methods 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
- 230000006870 function Effects 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 7
- 238000010276 construction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000005549 size reduction Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
Abstract
The invention relates to image sensor packaging and a manufacturing method. An image senor and a device are formed by lamination structures. Then packaging is carried out by utilization of thermosetting resins through molding. The area of the device can be increased easily. In addition, a substrate used in precious image senor packaging manufacturing process can be removed easily and therefore the miniaturization requirement in a mobile device can be met.
Description
Technical field
The present invention relates to image sensor package and manufacture method thereof.
Background technology
About the encapsulation (Packaging) of the device (Device) adopted in mobile (Mobile) equipment such as smart mobile phone or panel computer, require that it is miniaturized, high performance always.In addition, carrying out by make encapsulation miniaturized thus in identical space additional more function or increase the effort of battery (Battery) capacity in remaining space as much as possible.
Particularly, for the parts with additional function not being critical piece, more strong to the requirement of miniaturization, the competitiveness of manufacturer is sometimes also judged with it.On the other hand, along with the trend toward miniaturization of such mobile device, require that size reduces (Size reduction) too all the time about image sensor package.
At this, as well-known, general image sensor package manufactures in chip on board encapsulation (the Chip on board:COB) mode utilizing wire-bonded (Wire bonding) technology after adhere to imageing sensor (Image Sensor) on substrate (Substrate) and carry out being electrically connected (Interconnection), therefore, the miniaturization required in a mobile device cannot be met.
Therefore, as the ring solving the effort that this problem is done, Patent Document 1 discloses following technology: namely, substrate forms groove, then imageing sensor is placed in described groove, carries out wire-bonded to install with described substrate, make image sensor package miniaturized thus.
But, according to patent documentation 1, described substrate is the structure of following general circuitry substrate, that is, be cut into quadrangle tabular, central authorities are formed with the groove of prescribed depth at its upper end, in its side to be formed with multiple pad at equal intervals, when carrying out wire-bonded to be electrically connected after such substrate lays imageing sensor, although can small form factor requirements be met, its structure exists and must guarantee the thickness of described substrate and carry out the problem in the space needed for wire-bonded.
And then, when except described imageing sensor also add comprise device (Device) of electronic unit (Image signal process), memory (Memory) or the driver IC (Driver IC) with additional function, area for accommodating them can increase, therefore, it is limited for meeting the miniaturization required in a mobile device.
Prior art document
Patent documentation
Patent documentation 1:KR2008-0019883A
Summary of the invention
The problem that invention will solve
Therefore, the object of the invention is to solve the problem that the prior art comprising patent documentation 1 can not meet the structural miniaturization required in a mobile device.
The object of the invention is to, provide a kind of by removing substrate, encapsulate with stepped construction imageing sensor and the device with additional function thus easily can meet the image sensor package of the miniaturization required in a mobile device.
Another object of the present invention is, provide a kind of by improving operation to boost productivity, can the manufacture method of image sensor package of easily cost saving.
For the scheme of dealing with problems
In order to reach described object, the image sensor package of the embodiment of the present invention comprises: imageing sensor; Lamination adhesive is at the device of the one side of described imageing sensor; With the basal part that heat-curing resin carries out die package to described imageing sensor and device and forms; Be formed in the one side of described basal part, the circuit layer be electrically connected with imageing sensor; Be formed in the outside terminal of the another side of described basal part; And to the through hole that described outside terminal and circuit layer are electrically connected.
In addition, in the image sensor package of the embodiment of the present invention, described device can comprise image signal processing apparatus, memory or driver IC.
In addition, in the image sensor package of the embodiment of the present invention, described outside terminal can be soldered ball or metal gasket.
In addition, in the image sensor package of the embodiment of the present invention, the infrared filter being bonded in described circuit layer, overlay image transducer can also be comprised.
In addition, in the image sensor package of embodiments of the invention, described infrared filter can be made up of glass.
On the other hand, in order to realize another object of the present invention, the manufacture method of the image sensor package of the embodiment of the present invention comprises: imageing sensor is bonded in the step of jointing tape by (a); B device is bonded on described imageing sensor and carries out stacked step by (); C () carries out the step of die package to described imageing sensor and device with heat-curing resin; D () removes the step of described jointing tape; E heat-curing resin described in () plating is with the step forming circuit, be electrically connected with imageing sensor described circuit; F () forms the step of the through hole be electrically connected with circuit at described heat-curing resin; And (g) forms the step of outside terminal respectively at described through hole and device bottom.
In addition, in the manufacture method of the image sensor package of the embodiment of the present invention, described (a) step can carry out operation with Spherulite.
In addition, in the manufacture method of the image sensor package of the embodiment of the present invention, described (d) step can be carried out under the state of the reversing of position that imageing sensor and device turned over.
In addition, in the manufacture method of the image sensor package of the embodiment of the present invention, described (f) step can be carried out with metal-plated, metal Solder-Paste Printing or attaching Metal Ball mode.
In addition, in the manufacture method of the image sensor package of the embodiment of the present invention, the method can also comprise: (h) attaches the step of bonding agent at described circuit; And the step of infrared filter is (i) formed at described bonding agent adhering glass.
According to the following detailed description of carrying out invention with reference to accompanying drawing, such solution will become clearly.
Before this, the term used in this specification and claims book or word can not be explained with the meaning on common dictionary, based on inventor in order to illustrate that my invention suitably can define the principle of the concept of term in the best way, the meaning and the concept of technological thought according to the invention should be interpreted as.
Invention effect
According to embodiments of the invention, heat-curing resin is used to replace substrate, with stepped construction composing images transducer and the device with additional function, then encapsulate in die package mode with described resin, thus the size carrying out meeting the miniaturization required in a mobile device reduces (Size reduction).
In addition, owing to finally can reduce the camera module adopting it, thus space established by the grillage that can reduce mobile device.Therefore, there is the effect strengthened about the competitiveness of image sensor package.
On the other hand, according to the manufacture method of the embodiment of the present invention, carry out with Spherulite by improving operation, thus energy wafer application control mode, thus, there is the effect of productivity ratio raising and cost saving (Cost reduction).
Accompanying drawing explanation
Fig. 1 is the sectional view of the image sensor package that the embodiment of the present invention is shown.
Fig. 2 is the sectional view of the camera module that the image sensor package utilizing the embodiment of the present invention is shown.
Fig. 3, Fig. 6 to Figure 13 are the sectional views of the manufacture method of the image sensor package that the embodiment of the present invention is shown.
Fig. 4 to Fig. 5 is the plane graph of the manufacture method of the image sensor package that the embodiment of the present invention is shown in the plane.
Description of reference numerals
10: jointing tape
100: image sensor package
110: imageing sensor
120: device
130: basal part
130a: via
131: circuit layer
132: outside terminal
133: through hole
140: infrared filter
141: adhesive linkage
150: lens fixture
151: lens.
Embodiment
According to the following concrete content be associated with accompanying drawing and embodiment, feature of the present invention, specific technical characteristic will become clearly.It should be noted that in this manual, when the inscape mark Reference numeral to each accompanying drawing, be limited to identical inscape, even if be shown in different accompanying drawings, be also labeled as identical Reference numeral as far as possible.In addition, the term such as " first ", " second ", " simultaneously ", " another side " uses to an inscape and other inscape be carried out distinguishing, inscape not limit by described term.When the present invention will be described, omission unnecessarily can obscure the detailed description of the relevant known technology of main idea of the present invention.
The image sensor package (Image Sensor Package) of the embodiment of the present invention is for moving the camera module (Camera module) that adopts in (Mobile) equipment, eliminate substrate (Substrate), in addition, by with stacked (Stack) Structure composing imageing sensor (Image Sensor IC) and the device (Device) with additional function, thus the area that can reduce shared by such device, can easily meet the miniaturization required in a mobile device.
That is, image sensor package of the present invention uses heat-curing resin to replace generally for installation diagram image-position sensor and the substrate that uses, and the imageing sensor of stepped construction and device are carried out to die package (Mold Encapsulation) and form.
At this, as the example of device (Device) with described additional function, image signal processing apparatus (Image Signal Process:ISP), memory (Memory) or driver IC (Driver IC) can be comprised, also can continue in addition to add.
Therefore, camera module is formed by combining in such image sensor package the lens fixture (Lens Holder) comprising lens (Lens), thus finally realize the miniaturization of described camera module, easily can reduce and adopt the grillage of the mobile device of this camera module to establish (Board mount) space, thus, more function can be added in identical space.
On the other hand, the image sensor package manufacturing process of the embodiment of the present invention utilizes heat-curing resin to carry out die package (Mold Encapsulation) to the imageing sensor of stepped construction and device and manufactures image sensor package, as an example, operation can be carried out with wafer (Wafer) form, in this case, wafer application can control (Wafer Handling) mode, from but a kind ofly to boost productivity and the structure of cost saving.
Below, with reference to the accompanying drawings embodiments of the invention are described in detail.
As shown in Figure 1 to Figure 2, any one in bottom (Backside) the bonding image signal processing apparatus (Image Signal Process:ISP) of imageing sensor 110, memory (Memory) or driver IC (Driver IC) of the image sensor package 100 of the embodiment of the present invention, carries out stacked (Stack) as the device 120 with additional function.Then, with heat-curing resin, die package (Mold Encapsulation) is carried out to them, form basal part 130.
At this, the circuit face of described imageing sensor 110 and device 120 is to configure towards mutual rightabout mode.That is, to make the circuit face of described imageing sensor 110 towards top, to make the circuit face of device 120 be configured towards the mode of bottom.
Described basal part 130 is the structures of the substrate (Base) being equivalent to image sensor package 100, supports imageing sensor 110 and device 120, and can form the circuit and terminal that are electrically connected with them.Namely, by carrying out plating operation etc. at described basal part 130, thus the circuit layer 131 being electrically connected (Interconnection) with imageing sensor 110 can be formed on the top of basal part 130, in addition, the outside terminal 132 be electrically connected with described device 120 can be formed in bottom.
Now, described outside terminal 132 can be made up of common soldered ball (Solder ball) or metal gasket (Metal pad), shows described soldered ball for outside terminal 132 in the present embodiment.
In addition, described basal part 130 is formed with through hole (Through Via) in inside, is electrically connected with the described outside terminal 132 being formed in bottom the described circuit layer 131 being formed in top.In the present embodiment, although show with metal-plated (Metal Plating), metal Solder-Paste Printing (Metal Paste Printing) or attach the Metal Ball mode such as (Metal Ball Attach) and carry out filling (Filling) and the example that forms such through hole 133, but, in addition, can also after plating be carried out to the surface of via (Through hole), fill metal (Metal) and be formed.
On the other hand, infrared filter (IR Filter) is possessed on the top of circuit layer 131, as an example, adhesive linkage 141 is formed on the top of described circuit layer 131, described adhesive linkage 141 adhering glass (Glass Lid), make the image-region (Image area) of overlay image transducer 110, thus, it can be used as described infrared filter 140 to use.Possess the lens fixture 150 comprising lens 151 on the top of such infrared filter 140, form camera module.
Below, with reference to the accompanying drawings the embodiment of manufacture method of the present invention is described in detail.
As shown in Figure 3 to Figure 4, the manufacture method of the image sensor package 100 of the embodiment of the present invention is first at the bonding imageing sensor 110 of heat resistant adhesive adhesive tape 10.Now, described jointing tape 10 possesses on wafer (Wafer), can encapsulate multiple imageing sensor 110 simultaneously, after this, finally carries out cutting list (Singulation) operation, provides with single image sensor package 100 form.
As shown in Figures 5 to 7, any one in the bonding image signal processing apparatus in top (Image Signal Process:ISP) of described imageing sensor 110, memory (Memory) or driver IC (Driver IC), carries out stacked (Stack) as the device 120 with additional function.Then, with heat-curing resin, die package (Mold Encapsulation) is carried out to them, form the basal part 130 suitable with the substrate of image sensor package (100).
At this, the circuit face of described imageing sensor 110 and device 120 is to configure towards mutual rightabout mode.That is, with make the circuit face of described imageing sensor 110 towards bottom, the circuit face of device 120 is configured towards the mode on top state under carry out bonding carry out stacked.
As shown in Fig. 8 to Figure 13, after the described basal part 130 of formation, removing (Detach) jointing tape 10, now, imageing sensor 110 and device 120 are turned over, implements under the state carried out exchanging in its position, make easily to remove described jointing tape 10.
After this, carry out heat-curing resin described in plating to form the operation of circuit, circuit layer 131 is formed on the top of basal part 130, thus imageing sensor 110 is electrically connected with described circuit layer 131, in addition, the through hole (Through via) by being formed in the inside of basal part 130 is connected with outside terminal 132.As an example, described outside terminal 132 can be made up of soldered ball (Solder Ball) or metal gasket (Metal Pad).
At this, as additional process, attach bonding agent (Adhesive) on the top of described circuit layer 131 and form adhesive linkage 141, then to carry out glass (Glass Lid) bonding (Attach), in the operation of described adhesive linkage 141 as infrared filter 140, making the top of described infrared filter 140 overlay image transducer 110.But this is selectable operation, is omitted or in camera module manufacturing process, carried out that also it doesn't matter.
As shown in Figure 11 to Figure 13, about described through hole 133, after basal part 130 forms via 130a, undertaken filling (Filling) to be electrically connected by modes such as metal-plated (Metal Plating), metal Solder-Paste Printing (Metal Paste Printing), attachings Metal Ball (Metal Ball Attach).As other method, fill metal to be electrically connected after also can carrying out plating to the surface of described via 130a.
In the bottom of the through hole 133 formed by said method and device 120, be formed with soldered ball (Solder Ball) or metal gasket (Metal Pad) respectively as outside terminal 132.
On the other hand, for to form the image sensor package 100 that outside terminal 132 has manufactured for finishing operation respectively at described through hole 133 and device 120, when carrying out operation with wafer (Wafer) form, carry out cutting list (Singulation) operation, be supplied to the camera module manufacturing process as subsequent handling using single image sensor package 100 form, carry out the operation attaching lens fixture (Lens holder) etc.
Above, by embodiment, the present invention is illustrated in detail, but, this is just in order to specifically describe the present invention, image sensor package of the present invention and manufacture method thereof are not limited thereto, obviously, can be undertaken being out of shape or improveing by the technical staff with general knowledge known in this field in technological thought of the present invention.
The distortion that the present invention is simple or change all should belong to scope of the present invention, and concrete protection range of the present invention determined by the claims added.
Claims (10)
1. an image sensor package, is characterized in that, this image sensor package comprises:
Imageing sensor;
Lamination adhesive is at the device of the one side of described imageing sensor;
With the basal part that heat-curing resin carries out die package to described imageing sensor and described device and forms;
The circuit layer be formed in the one side of described basal part, being electrically connected with described imageing sensor;
Be formed in the outside terminal of the another side of described basal part; And
To the through hole that described outside terminal and described circuit layer are electrically connected.
2. image sensor package according to claim 1, is characterized in that, described device comprises: image signal processing apparatus, memory or driver IC.
3. image sensor package according to claim 1, is characterized in that, described outside terminal is soldered ball or metal gasket.
4. image sensor package according to claim 1, is characterized in that, this image sensor package also comprises the infrared filter being bonded in described circuit layer, covering described imageing sensor.
5. image sensor package according to claim 4, is characterized in that, described infrared filter is made up of glass.
6. a manufacture method for image sensor package, the method comprises:
A imageing sensor is bonded in the step of jointing tape by ();
B device is bonded on described imageing sensor and carries out stacked step by ();
C () carries out the step of die package to described imageing sensor and described device with heat-curing resin;
D () removes the step of described jointing tape;
E heat-curing resin described in () plating is with the step forming circuit, be electrically connected described circuit and described imageing sensor;
F () forms the step of the through hole be electrically connected with circuit at described heat-curing resin; And
G () forms the step of outside terminal respectively at described through hole and device bottom.
7. the manufacture method of image sensor package according to claim 6, is characterized in that, described (a) step carries out operation with Spherulite.
8. the manufacture method of image sensor package according to claim 6, is characterized in that, described (d) step is carried out under the state of the reversing of position that described imageing sensor and described device turned over.
9. the manufacture method of image sensor package according to claim 6, is characterized in that, described (f) step is carried out with metal-plated, metal Solder-Paste Printing or attaching Metal Ball mode.
10. the manufacture method of image sensor package according to claim 6, is characterized in that, the method also comprises:
H () attaches the step of bonding agent at described circuit; And
(i) the step of infrared filter is formed at described bonding agent adhering glass.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0071610 | 2013-06-21 | ||
| KR20130071610A KR20140148112A (en) | 2013-06-21 | 2013-06-21 | Image sensor package and the method of manufacturing thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104241300A true CN104241300A (en) | 2014-12-24 |
| CN104241300B CN104241300B (en) | 2018-08-03 |
Family
ID=52229088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310346865.9A Active CN104241300B (en) | 2013-06-21 | 2013-08-09 | Image sensor package and its manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20140148112A (en) |
| CN (1) | CN104241300B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106646808A (en) * | 2015-11-03 | 2017-05-10 | 三星电机株式会社 | Camera module |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10714454B2 (en) * | 2018-08-14 | 2020-07-14 | Semiconductor Components Industries, Llc | Stack packaging structure for an image sensor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030178716A1 (en) * | 2002-03-19 | 2003-09-25 | Takehiko Maeda | Light thin stacked package semiconductor device and process for fabrication thereof |
| CN1604310A (en) * | 2003-09-30 | 2005-04-06 | 精工爱普生株式会社 | Semiconductor device and method for manufacturing same |
| CN101165894A (en) * | 2006-10-19 | 2008-04-23 | 三星Techwin株式会社 | Chip package for image sensor and method of manufacturing the same |
| CN102646658A (en) * | 2011-02-15 | 2012-08-22 | 海力士半导体有限公司 | Semiconductor package and method for manufacturing the same |
-
2013
- 2013-06-21 KR KR20130071610A patent/KR20140148112A/en not_active Application Discontinuation
- 2013-08-09 CN CN201310346865.9A patent/CN104241300B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030178716A1 (en) * | 2002-03-19 | 2003-09-25 | Takehiko Maeda | Light thin stacked package semiconductor device and process for fabrication thereof |
| CN1604310A (en) * | 2003-09-30 | 2005-04-06 | 精工爱普生株式会社 | Semiconductor device and method for manufacturing same |
| CN101165894A (en) * | 2006-10-19 | 2008-04-23 | 三星Techwin株式会社 | Chip package for image sensor and method of manufacturing the same |
| CN102646658A (en) * | 2011-02-15 | 2012-08-22 | 海力士半导体有限公司 | Semiconductor package and method for manufacturing the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106646808A (en) * | 2015-11-03 | 2017-05-10 | 三星电机株式会社 | Camera module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104241300B (en) | 2018-08-03 |
| KR20140148112A (en) | 2014-12-31 |
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