TW200419272A - Driver mounting method using hysteresis loss, substrate and anisotropic conductive film - Google Patents
Driver mounting method using hysteresis loss, substrate and anisotropic conductive film Download PDFInfo
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200419272200419272
向異 驅動 一、【發明所屬之技術領域 ——本發明係有關於使用各 板之電極之方法及具有安裳 性導電膜。 性導電膜將驅動器裝在基 器之構造之基板與各向異 二、【先前技術】 在衣入液晶模組等之基板安裝驅動器 =稱,Anis〇troplc C0nductive Filffl)之各二生 膜安I之方法。各向異性導電膜如圖8a所示,係將 里之導電粒子104隨機的分散於厚度2〇〜3〇 之膠帶狀之 黏接劑1 0 2之高密度電極之連接材料。微量之導電粒子丨 係導電性之殼包覆樹脂製之核心而形成。此外,將膠 之膠合劑1 〇 2稱為膠合劑。 以下,以液晶模組之組立為例,說明使用各向異性導 電膜100之零件之安裝。又,在各圖共用之符號使用相 之符號。 將陣列基板11 0和彩色濾光器基板相向,藉著在陣列 基板11 0和彩色濾、光器基板之間隙將液晶密封之液晶單 元’再安裝背光或驅動器等,組成液晶模組。 在液晶模組之組立,將TCP(Tape Carrier Package輪 送膠帶封裝體)和液晶單元之電極連接。TCP1 06係將 LSI(Large Scale Integration,大型積體電路)晶片放在 薄型之膠卷狀印刷電路之LSI封裝。TCP1 06也稱為 TAB-IC (Tape Automated Bond ingIC,帶狀自動接合式Anisotropic driving 1. [Technical field to which the invention belongs-the present invention relates to a method of using electrodes of each plate and an electrically conductive film having a safety property. The conductive film mounts the driver on the substrate and the substrate is anisotropic. [Prior technology] Installing the driver on a substrate with a liquid crystal module installed, etc. = Anisotroplc C0nductive Filffl) Method. As shown in Fig. 8a, the anisotropic conductive film is a high-density electrode connection material in which conductive particles 104 are randomly dispersed in a tape-shaped adhesive 102 having a thickness of 20 to 30. A small amount of conductive particles are formed by covering a core made of resin with a conductive shell. In addition, the cement 102 is called a cement. In the following, the assembly of the liquid crystal module is taken as an example to describe the mounting of the parts using the anisotropic conductive film 100. It should be noted that the symbols common to the drawings use relative symbols. The array substrate 110 and the color filter substrate are opposed to each other, and a liquid crystal unit that seals the liquid crystal in the gap between the array substrate 110 and the color filter and the optical filter substrate is installed with a backlight or a driver to form a liquid crystal module. In the assembly of the LCD module, connect the TCP (Tape Carrier Package) with the electrode of the LCD cell. In TCP1 06, an LSI (Large Scale Integration, large-scale integrated circuit) chip is placed in an LSI package of a thin film-like printed circuit. TCP1 06 is also called TAB-IC (Tape Automated Bonding IC)
第10頁 200419272 五、發明說明(2) I C )。在T C P1 0 6包含液晶模組之驅動器。 如圖8 b所示’用T C P 1 0 6和液晶單元之陣列基板丨夾 住各向異性導電膜1〇〇後’如圖所示,加壓•加熱。各 向異性導電膜1 〇 〇之膠合劑1 〇 2液化,藉著液化之膠合劑 102冷卻後硬化,可連接陣列基板丨〗〇和Tcpi 〇6。用導電粒 子104連接TCP1 06之電極和陣列基板丨1()之電極。因此, TCP 106之電路和陣列基板U 0在電性上連接,藉以驅動液 晶模組。 因將各向異性導電膜丨0 〇加熱所產生之熱會向陣列基 板110之電極周邊傳導,能將液晶單元之 卻。因此,在液晶單元之構件發生膨服·收牛缩力。',因二 之熱膨脹率不同,發生膨脹·收縮所引起之應力但若為了 抑制應力而降低加熱溫度,則無法確實的連接〇6,而 成接觸不良。。 * • 电/·工⑼™久丨千乃丞槪之電極間隔變 :日守,導電粒子104會令電極間短路之機會升高。因此, 粒子1(34確實的㈣TmG6之電極和陣列基板 =4間。可是,只是加壓·加熱,無法決定導電 =4之位置。因導電粒子1〇4所引起之電極間短路^ 液日日核組之製造良率降低。 【發明内容】 決之課題 本發 明之目的在於提供一種使用各向里 性導電膜之安Page 10 200419272 V. Description of Invention (2) I C). The driver of the LCD module is included in T C P106. As shown in FIG. 8b, ‘after sandwiching the anisotropic conductive film 100 with T C P 106 and the array substrate of the liquid crystal cell’, as shown in the figure, pressurize and heat. The anisotropic conductive film 100 has a liquefied adhesive 102 that is liquefied. The liquefied adhesive 102 cools and hardens after cooling, and can be connected to the array substrate 丨〗 and Tcpi 〇6. The conductive particles 104 are used to connect the electrodes of TCP 106 and the electrodes of the array substrate 1 (). Therefore, the circuit of TCP 106 and the array substrate U 0 are electrically connected to drive the liquid crystal module. The heat generated by heating the anisotropic conductive film 丨 0 will be conducted to the periphery of the electrodes of the array substrate 110, and the liquid crystal cell can be stopped. Therefore, the expansion and contraction of the liquid crystal cell occurs. Due to the different thermal expansion coefficients, stress due to expansion and contraction occurs. However, if the heating temperature is lowered to suppress the stress, the connection cannot be reliably performed, resulting in poor contact. . * • Electricity / Electro-Mechanics ™ long-term electrode spacing of Chino-chan: Sun guard, conductive particles 104 will increase the chance of short circuit between electrodes. Therefore, particle 1 (34), the electrode of TmG6 and the array substrate = 4. However, the position of conductivity = 4 cannot be determined only by pressing and heating. The short circuit between the electrodes caused by the conductive particle 104 is ^ liquid day after day The manufacturing yield of the core group is reduced. [SUMMARY OF THE INVENTION] The object of the present invention is to provide a security method using an anisotropic conductive film.
200419272200419272
裝方法’在對使用各向異性導電膜之基板連接零件時,抑 1對基板之各構件之傳熱,而且電極間不會產生短路。本 發明之另一目的在於提供一種基板,具有連接Tcp等安裝 對象零件之構造。此外,本發明之另外的目的在於提供一 種各向異性導電膜,用於TCP等之安裝方式。 題之 .驅動裝方法,使用各向異性導電膜將 JU ^ 土 匕3以下之步驟·以該基板和驅動器 向異性導電膜;對該各向異性導電 該;使!電粒:產生渦電流及磁滞損失= a兮I & s Γ電,双及磁滯損失而產生之導電粒子之埶, 之樹脂液化之步驟4令液:之 極。 乂 v電粒子連接基板之電極和驅動器之電 可包含利用該磁場梯度 驅動器之電極之間之步Mounting method 'When connecting parts to a substrate using an anisotropic conductive film, the heat transfer of each member of the substrate is suppressed, and a short circuit does not occur between the electrodes. Another object of the present invention is to provide a substrate having a structure for connecting components to be mounted such as Tcp. In addition, another object of the present invention is to provide an anisotropic conductive film for mounting methods such as TCP. The problem. Driving method, using an anisotropic conductive film, the following steps of Ju ^ soil 3 with the substrate and the driver anisotropic conductive film; conductive to the anisotropy; make! Electron particle: Generate eddy current and hysteresis loss = a. I & s Γ electricity, double and hysteresis loss of the conductive particles generated by the, step 4 of the resin liquefaction liquid: pole.乂 v Electro-particle connection between the electrodes of the substrate and the driver may include a step between the electrodes of the driver using the magnetic field gradient
本"号务明之^其 I 所形成之絕緣二^ ’在驅動15裝載部將導體、在該導體上 連接之電極疊;後及二j 2在該絕緣層上所形成之驅動器 上產生磁場。灸,耩者使電流流向該導體,可在該電極 本發明之其4 成用 形 可 以和驅_ 2,,在内部形成導體,在驅動器裝載部 矛駆動裔連接之電極,藉著使電流流向該導體,p 200419272 五、發明說明(4) 在該電極上產生磁場 本發明之基板,該導體之形狀亦可為蛇行形狀。 本發明之各向異性導電膜,包含導電粒子和膠合劊, 該導電粒子可包含鐵磁性體的構成。 四、【實施方式】 發明之實施例 使用圖面說明本發明之驅動器的安裝方法及基板之實 施例。在此,在驅動器包含晶片或Tcp等之安裝對象零 件。又’在基板包含作為液晶單元之基板之玻璃或 PCBCPfinted Circuit B〇ard,印刷電路板)等安裝基板。 如圖1所示,用以將驅動器1 2裝在基板1 4之壓著頭1 〇 (b〇nding fead)對驅動器12 ' ACF(各向異性導電膜)5〇以 及基板14施加壓力,而且施加磁場。驅動器12之電極丨5例 如係反磁性體之金或銅。基板1 4之電極15例如係順磁性體 之鋁。 乂 f圖3&表示埋入壓著頭10之導體基板16。導體基板16 係將=體17黏在導體17用之基板18後和交流電源連接而形 成。導體1 7係蛇行形狀,交互重複線狀之部分和折回部2 0 而形成。以下’在本專利說明書,在圖3b將導體17之線狀 之部分17a和經由折回部20a相鄰之導體17之線狀之部分 1 7b之中心線稱為間距線22。 如以下之說明所示,在圖3b彼此相鄰之間距線22a和 22b之間隔和安裝之基板1 4及驅動器1 2之電極1 5間之間隔This & No. ^ its insulation formed by I ^ 'in the drive 15 loading section to the conductor, the electrode stack connected to the conductor; the rear and two j 2 on the driver formed on the insulation layer to generate a magnetic field . Moxibustion, the person who makes the current flow to the conductor can use the electrode of the invention to form a conductor in the inner part of the electrode, and form a conductor in the interior of the driver, and then move the electrode connected to the driver loading part to allow the current to flow. The conductor, p 200419272 V. Description of the invention (4) The substrate of the present invention that generates a magnetic field on the electrode, the shape of the conductor may also be a meandering shape. The anisotropic conductive film of the present invention includes conductive particles and cemented fluorene, and the conductive particles may include a ferromagnetic body. 4. [Embodiments] Examples of the invention An example of the method for mounting the driver and the substrate of the present invention will be described with reference to the drawings. Here, the driver contains components to be mounted such as wafers and Tcp. In addition, the substrate includes a mounting substrate such as glass or PCBCPfinted Circuit Board (printed circuit board) as a substrate of the liquid crystal cell. As shown in FIG. 1, a crimping head 1 〇 (bonding fead) for mounting the driver 12 on the substrate 14 applies pressure to the driver 12 ′ ACF (anisotropic conductive film) 50 and the substrate 14, and Apply a magnetic field. The electrodes 5 of the driver 12 are, for example, gold or copper of a diamagnetic body. The electrode 15 of the substrate 14 is, for example, paramagnetic aluminum. Fig. 3 & shows the conductor substrate 16 embedded in the crimping head 10. The conductor substrate 16 is formed by bonding the body 17 to the substrate 18 for the conductor 17 and connecting it to an AC power source. The conductor 17 is formed in a meandering shape, and the linear portion and the folded-back portion 20 are alternately repeated. Hereinafter, in this patent specification, the center line of the linear portion 17a of the conductor 17 and the linear portion 17b of the conductor 17 adjacent to each other via the folded-back portion 20a is referred to as a pitch line 22 in FIG. 3b. As shown in the following description, the interval between the lines 22a and 22b and the distance between the mounted substrate 14 and the electrode 15 of the driver 12 are adjacent to each other in FIG. 3b.
第13頁 200419272 五、發明說明(5) 相等。換言之,和應安裝之基板14及驅動器12之電極15間 之間距對應的決定間距線22之間隔,將導體17形成蛇行形 狀。導體基板16用於使施加磁場之電流流向各 膜50。 w八r王命4 ^在圖2表示各向異性導電膜5 0之構造。各向異性導電 膜50由用樹脂等形成之膠合劑52和混入膠合劑52/之導電粒 子54構成。膠合劑52係周知之黏接材料,藉著加熱至高溫 時液化’然後利用冷卻硬化。 本發明之導電粒子54和以往之導電粒子不同,包含鐵 磁性體。例如如圖2所示,由球形之核心56、包覆核心56 之鐵磁性層58以及包覆鐵磁性層58之殼60構成。核心5 6如 以往般係樹脂性核心,對於壓力具有柔軟性。鐵磁性層58 如以下之說明所示,用鐵磁性且對於磁場之磁滯損失大之 材料形成。例如鐵磁性層58用^、C〇、Fe等形成。殼6〇係 對鐵磁性層5 8例如鍛金的。 '、 導電粒子5 4所含之鐵磁性層5 8受到交流磁場作用時產 生渦電流,持久的發熱。又,鐵磁性層58受到交流磁場作 用時因磁滯損失而週期性的發熱。 在圖4表示鐵磁性體在磁場中之磁滯。藉著自外部供 給鐵磁性層58交流磁場,以CDEFGC包圍之面積之功作為磁 滞損失所引起之發熱,用於安裝。 ' 使用圖5說明將驅動器1 2裝在基板1 4之方法。將各向 異性導電膜50黏在基板丨4或驅動器1 2。將基板1 4之電極! 5 和驅動器1 2之電極1 5之位置對準後,使得在其中間夾住各Page 13 200419272 V. Description of Invention (5) Equal. In other words, the conductors 17 are formed in a meandering shape at intervals from the corresponding pitch line 22 between the substrate 14 to be mounted and the electrodes 15 of the driver 12. The conductor substrate 16 is used to cause a current applied with a magnetic field to flow to each of the films 50. w 八 r 王命 4 ^ The structure of the anisotropic conductive film 50 is shown in FIG. 2. The anisotropic conductive film 50 is composed of a binder 52 formed of a resin or the like and conductive particles 54 mixed with the binder 52 /. The adhesive 52 is a well-known adhesive material, which is liquefied when heated to a high temperature, and then hardened by cooling. The conductive particles 54 of the present invention are different from conventional conductive particles and include a ferromagnetic body. For example, as shown in FIG. 2, it is composed of a spherical core 56, a ferromagnetic layer 58 covering the core 56, and a case 60 covering the ferromagnetic layer 58. The core 5 6 is a resinous core as in the past, and is soft against pressure. The ferromagnetic layer 58 is formed of a material that is ferromagnetic and has a large hysteresis loss with respect to a magnetic field, as described below. For example, the ferromagnetic layer 58 is formed of Zn, Co, Fe, or the like. The case 60 is a pair of ferromagnetic layers 58 such as wrought gold. ', The ferromagnetic layer 5 8 contained in the conductive particles 5 4 generates an eddy current when subjected to an AC magnetic field, and generates persistent heat. When the ferromagnetic layer 58 receives an AC magnetic field, it periodically generates heat due to hysteresis loss. Fig. 4 shows the hysteresis of a ferromagnetic body in a magnetic field. By supplying the ferromagnetic layer 58 with an AC magnetic field from the outside, the work caused by hysteresis loss is used as the heat generated in the area surrounded by the CDEFGC for installation. '' A method for mounting the driver 12 on the substrate 14 will be described using FIG. 5. An anisotropic conductive film 50 is adhered to the substrate 4 or the driver 12. Place the electrodes on the substrate 1 4! After aligning the positions of electrode 5 and driver 1 2 of driver 5 with each other, clamp each
第14頁 200419272 五、發明說明(6) ' 向異性導電膜5 0。 其次,將壓著頭10、基板14以及驅動器12之電極15 位置對準。如上述所示,在壓著頭1 〇埋入形成了蛇行妒狀 之導體17之導體基板16。首先,將壓著頭1〇所含之道二# 〜等體基 板16之導體1 7之位置對準,使其被夾入到基板14和驅動器 1 2之電極1 5間。又,如後述所示,將壓著頭1 〇和電極1 5之 位置對準,使得在導體17之間距線22上產生之磁場相加 強,間距線2 2和電極1 5之中心線大致重疊。Page 14 200419272 V. Description of the invention (6) 'Anisotropic conductive film 50. Next, the pressure head 10, the substrate 14, and the electrode 15 of the driver 12 are aligned. As described above, the conductor substrate 16 on which the meandering conductor 17 is formed is buried in the crimping head 10. First, the positions of the conductors 17 and 17 of the base substrate 16 included in the pressing head 10 are aligned so that they are sandwiched between the substrate 14 and the electrodes 15 of the driver 12. As will be described later, the positions of the crimping head 10 and the electrode 15 are aligned so that the magnetic field generated on the distance line 22 between the conductors 17 is strengthened, and the center line of the distance line 22 and the electrode 15 approximately overlaps. .
位置對準完了後,用壓著頭1 0對驅動器1 2施加壓力, 用基板1 4及驅動器1 2夾入各向異性導電膜5 0。可是,照這 樣原封不動時因膠合劑5 2熔解及未凝固,依然未安裝驅動 器12 ° 接著,使交流電流流向在壓著頭1 〇所埋入之導體基板 1 6上之導體1 7。結果,導體基板1 6產生動態磁場。該磁場 具有與基板1 4及驅動器1 2垂直之磁力線。該交流磁場之磁 力線受到包含鐵磁性層5 8之導電粒子5 4強力束缚,如上述 所示,導電粒子5 4因渦電流及磁滞損失而發熱。After the alignment is completed, a pressure is applied to the driver 12 using the crimping head 10, and the anisotropic conductive film 50 is sandwiched between the substrate 14 and the driver 12. However, when the adhesive 5 2 was melted and not solidified, the driver was not installed 12 °. Then, an alternating current was flowed to the conductor 17 on the conductor substrate 16 embedded in the pressing head 10. As a result, the conductive substrate 16 generates a dynamic magnetic field. The magnetic field has magnetic lines of force perpendicular to the substrate 14 and the driver 12. The magnetic field lines of this AC magnetic field are strongly restrained by the conductive particles 54 containing the ferromagnetic layer 58. As described above, the conductive particles 54 generate heat due to eddy current and hysteresis loss.
在此,將作用於導電粒子5 4之磁場調整為供給鐵磁性 體之飽和磁化之強度,使得磁滯損失所引起之發熱變成最 大。設供給飽和磁化之外部磁化強度為H s時,在外部磁場 上施加H = H s X SI Ν ( ω t)。在此,t表示時間。關於頻率 ω,考慮自鐵磁性體之粒子密度所計算之應供給之能量, 調整最佳值。由於溫度上升,飽和磁化量減少,磁滯循環 所引起之發熱量減少,但是例如在使用鎳之情況,因居里Here, the magnetic field acting on the conductive particles 54 is adjusted to the intensity of the saturation magnetization supplied to the ferromagnetic body, so that the heat generation due to the hysteresis loss is maximized. When the external magnetization supplied with saturation magnetization is H s, H = H s X SI N (ω t) is applied to the external magnetic field. Here, t represents time. Regarding the frequency ω, the optimal value is adjusted by considering the energy to be supplied calculated from the particle density of the ferromagnetic body. As the temperature rises, the amount of saturation magnetization decreases and the amount of heat generated by the hysteresis cycle decreases. However, for example, in the case of nickel, Curie
第15頁 200419272 五、發明說明(7) 溫度(Curie temperature)係385 °C,對於實際之安裝充分 發揮效力。 於是因利用導電粒子54之發熱,能以導電粒子54為中 心局部的對膠合劑52加熱,利用該導電粒子54之磁場所引 起之發熱將熱傳給膠合劑5 2,膠合劑5 2液化。 利用膠合劑52液化後至硬化之期間,例如約1秒鐘, 令在電極1 5上排列導電粒子。導體基板丨6如上述所示,因 將導體17配線成蛇行形狀,在各間距線22產生磁場強之部 分。如圖5所示,將導體1 7配線使得預先在應連接之電極 15之部分產生磁場強之部分時,在導體17上方磁場變弱, 作用於膠合劑52之磁場具有圖6所示之磁場梯度。結果, 在電極15之部分產生朝導電粒子54集中之方向之力。 該力之原理係供給外部磁場時,導磁率大之物質( 電粒子54)被導磁率小之物質吸引。因引力和磁場之平方 成正比,稍微的磁場差異可產生大的引力 時,導電粒子54變成易動,易集中於磁場強之電極15 = 分。 隹ί Ϊ J :托1〒可使知在電極1 5附近導電粒子54密 集,在相郴之電極1 5間導電粒子54疏, 更確實。X,因導電粒子54集中於各 連接甏侍 粒子54所引起之電極間之短路。 ° ’可防止導電 在圖7表示時間、磁場以及壓 法利用溫升完成壓接時,首先使作 糸。在上 作用壓力後,完成安裝。依據需要,心力失退J者除去Page 15 200419272 V. Description of the invention (7) The temperature (Curie temperature) is 385 ° C, which is effective for the actual installation. Because of the heat generated by the conductive particles 54, the adhesive 52 can be locally heated with the conductive particles 54 as the center, and the heat generated by the magnetic field of the conductive particles 54 can be used to transfer heat to the adhesive 5 2 and the adhesive 5 2 to liquefy. Between the time when the adhesive 52 is liquefied and the time when it hardens, for example, about 1 second, the conductive particles are arranged on the electrode 15. As described above, the conductor substrate 6 has the conductor 17 wired in a meandering shape, so that each of the pitch lines 22 generates a strong magnetic field. As shown in FIG. 5, the conductor 17 is wired so that when a strong magnetic field is generated in the part of the electrode 15 to be connected in advance, the magnetic field above the conductor 17 becomes weak, and the magnetic field acting on the adhesive 52 has the magnetic field shown in FIG. gradient. As a result, a force is generated in the direction of the concentration of the conductive particles 54 in the portion of the electrode 15. The principle of this force is that when a magnetic field is supplied, a substance having a large magnetic permeability (electric particles 54) is attracted by a substance having a small magnetic permeability. Since the gravitational force is proportional to the square of the magnetic field, when a small magnetic field difference can produce a large gravitational force, the conductive particles 54 become easy to move, and it is easy to concentrate on the strong magnetic field electrode 15 = minutes. Ϊί Ϊ J: 托 1〒 can make it known that the conductive particles 54 are densely arranged near the electrodes 15 and that the conductive particles 54 are denser between the corresponding electrodes 15 and 15, which is more reliable. X, a short circuit between the electrodes caused by the concentration of the conductive particles 54 in each of the connecting particles 54. ° 'prevents conduction. When the time, magnetic field, and pressure method are used to complete the crimping using temperature rise as shown in Fig. 7, first make 作. After applying pressure, the installation is completed. According to need, the heart failure J is removed
200419272 五、發明說明(8) 在上述之實施例, 亦可將導體基板16裝入 1 4之驅動器1 2裝載部分 在絕緣層上形成電極。 板14之驅動器12裝載部 在基板1 4上所形成 1 7之蛇行形狀係,在絕 和電極1 5之中心線大致 將基板1 4之電極1 5和驅 在其中間夾住各向異性 在本實施例,也令 動器1 2之間後,用壓著 在基板1 4之機構和上述 實施例不同,在基板1 4 不需要如上述之實施例 器12之電極15之精密之 或者亦可將導體1 7 例,因基板1 4係絕緣體 14形成導體基板16 ’使 和電極1 5之中心線大致 一樣,可將驅動器1 2安 在本發明,在驅動 對象零件。又,在基板 基板。又,導電粒子54 將導體基板16埋入壓著頭10,但是 基板14 ’將導體基板16放置於基板 後,用絕緣層包覆導體基板丨6上, 或者’亦可將導體17直接配置於基 分。 之導體1 7之形狀係蛇行形狀。導體 緣層上形成電極15,使得間距線2 2 重璺。又,和上述之實施例一樣, 動器1 2之電極1 5之位置對準,使得 導電膜50。 各向異性導電膜50介於基板14及驅 頭1 0施加壓力。又,將驅動器1 2裝 之實施例的一樣。可是,和上述之 上形成之導體17產生磁場。又,也 所示之壓著頭1 〇、基板丨4以及驅動 位置對準。 直接配線於基板1 4中。在本實施 ’不必新形成絕緣層。只要在基板 得係蛇行形狀之導體1 7之間距線2 2 重豐即可。以後和剛才之該實施例 裝於基板1 4。 器可包含晶元或TCP等全部之安裝 包含玻璃基板或PCB等全部之安裝 只要包含鐵磁性體的形成,成分、200419272 V. Description of the invention (8) In the above-mentioned embodiment, the conductor substrate 16 may also be mounted on the driver 12 of the 14 and the mounting portion of the conductor may be formed on the insulating layer. The mounting portion of the driver 12 of the plate 14 forms a zigzag shape system of 17 on the substrate 14. The center line of the insulation electrode 15 roughly drives the electrode 15 of the substrate 14 and the anisotropy between them. In this embodiment, the mechanism for pressing the substrate 14 between the actuators 12 and 12 is different from the above embodiment. The substrate 14 does not need the precision or the same as the electrode 15 of the embodiment 12 described above. The conductor 17 can be exemplified. The conductor substrate 16 ′ can be formed by the substrate 14 and the system-based insulator 14 so that the centerline of the electrode 15 is approximately the same as that of the electrode 15. The driver 12 can be installed in the present invention to drive a target part. The substrate is a substrate. In addition, the conductive particles 54 embed the conductor substrate 16 into the crimp head 10, but the substrate 14 'places the conductor substrate 16 on the substrate, and then covers the conductor substrate 6 with an insulating layer, or' the conductor 17 may be directly disposed on Base points. The shape of the conductor 17 is a meandering shape. An electrode 15 is formed on the conductor edge layer so that the pitch line 2 2 is heavy. Also, as in the above embodiment, the positions of the electrodes 15 of the actuator 12 are aligned so that the conductive film 50 is formed. The anisotropic conductive film 50 applies pressure between the substrate 14 and the head 10. The same applies to the embodiment in which the driver 12 is mounted. However, a magnetic field is generated with the conductor 17 formed above. Also, the crimping head 10, the substrate 4 and the driving position shown are aligned. It is directly wired in the substrate 14. In this embodiment, it is not necessary to newly form an insulating layer. As long as the substrate is in a meandering shape, the conductors 17 and 2 are separated from each other. The embodiment described later and just now is mounted on the substrate 14. The device can include all installations such as wafers or TCP, including all installations such as glass substrates or PCBs.
第17頁 200419272 五、發明說明(9) # 材料、構造等未特別限定。此外,導體1 7之形成形狀未限 定為蛇行形狀’包含使電流流動後產生之磁場局部的發生 強弱之全部之形狀。 此外’本發明在未超出其主旨之範圍内,能以依照該 業者之知識進行各種改良、修正、變更之形態實施。 I明之 士、上斤示’因利用磁場將包含鐵磁性體之導電粒子 加熱’ f生t熱係局部性的。因&,不會將不需要基板之 位置:二ί卻:可防止熱所引起之應力發生。 導電粒子集中於::^:;電:上排列導電粒子,可將 更確只。而,在相鄰之電極电往门冬運接變成 導電粒子之相鄰之電極間之短導電粒子疏,可防止經由 利用如上述之局部性之加埶 實現驅動器之超高密度及高可二子之局部化,可Page 17 200419272 V. Description of Invention (9) # Materials, structures, etc. are not particularly limited. The shape of the conductor 17 is not limited to a meandering shape. The shape includes all the shapes of the local magnetic field that is generated after the current flows. In addition, the present invention can be implemented in the form of various improvements, corrections, and changes in accordance with the knowledge of the practitioner without departing from the scope of the invention. A person of the Ming dynasty and Shang Jin said that the heat generation is local because the conductive particles containing a ferromagnetic body are heated by a magnetic field. Because of &, the position where the substrate is not needed will not be: Second, it can prevent the stress caused by heat from occurring. The conductive particles are concentrated in :: ^ :; electricity: The conductive particles are arranged on the top, which can be more accurate. However, the short conductive particles between adjacent electrodes that are electrically connected to Astronomy can become conductive particles, which can prevent the ultra-high density and high-secondary of the driver from being achieved by using the local addition as described above. Localized
第18頁 200419272 圖式簡單說明 五、【圖式簡單說明】 圖1係表示本發明之安裝 > 圖2係本發明之ACF(各:思圖。 導電粒子之剖面圖。 '異欧導電膜)、導電粒子以及 圖3(a)係本發明之導體基板之平面图。 = 3(=)係本發明之導體基板之導體;分之放大圖。 係之^帶 磁性體在磁場中之磁場和磁通密度之關 圖5係表示本發明之容奘方法夕_ 不意圖之放大圖。 圖6係在本發明之安裝方法表 電粒子之力之示意圖。 磁%梯度和作用於導 場之Ξ7Λ表^在本發明之安裝方法之時間和壓力以及磁 %之關係之關係圖。 ^ 圖8 ( a)係各向異性導電膜之剖面圖。 狀況經由各向異性導電膜將Tcp裝在陣列基板之 之狀由各向異性導電膜令TCP和陣列基板連接 元件符號說明: 10壓著頭 12 驅動器 14 基板 15 電極Page 18 200419272 Brief description of the drawings V. [Simplified description of the drawings] Fig. 1 shows the installation of the present invention > Fig. 2 shows the ACF of the present invention (each: imaginary. Cross-section view of conductive particles. ), Conductive particles and FIG. 3 (a) are plan views of the conductive substrate of the present invention. = 3 (=) is the conductor of the conductor substrate of the present invention; The relationship between the magnetic field and the magnetic flux density of a magnetic body in a magnetic field. Figure 5 is an enlarged view of the method of the present invention. FIG. 6 is a schematic diagram of the force of the electric particles in the installation method of the present invention. The relationship diagram of the magnetic% gradient and the time and pressure and magnetic% in the installation method of the present invention. ^ Figure 8 (a) is a cross-sectional view of an anisotropic conductive film. Condition: Tcp is mounted on the array substrate via an anisotropic conductive film. TCP and the array substrate are connected by an anisotropic conductive film. Symbol description: 10 crimping head 12 driver 14 substrate 15 electrode
200419272 圖式簡單說明 1 6導體基板 1Y導體 1 8 將導體配線之基板 20 折回部 2 2 間距線 5 0 本發明之各向異性導電膜 5 2 膠合劑 54 導電粒子 56 核心200419272 Brief description of the drawing 1 6 Conductor substrate 1Y conductor 1 8 Substrate for conductor wiring 20 Folded part 2 2 Pitch line 5 0 Anisotropic conductive film of the present invention 5 2 Adhesive 54 Conductive particles 56 Core
5 8 鐵磁性層 60 殼5 8 ferromagnetic layer 60 shells
1 〇 〇 各向異性導電膜 102 膠合劑 1 0 4 導電粒子 106 TCP I 0 8 電極 II 0 陣列基板1 〇 〇 Anisotropic conductive film 102 Adhesive 1 0 4 Conductive particles 106 TCP I 0 8 Electrode II 0 Array substrate
第20頁Page 20
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CN112698523A (en) * | 2019-10-07 | 2021-04-23 | 三星显示有限公司 | Method of manufacturing display module |
CN118367432A (en) * | 2024-06-20 | 2024-07-19 | 武汉钧恒科技有限公司 | High-power light source COC for silicon optical module, silicon optical module and eutectic method |
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JP5890614B2 (en) * | 2011-05-27 | 2016-03-22 | デクセリアルズ株式会社 | Connection method, connection structure, and manufacturing method of connection structure |
CN107479274A (en) * | 2017-07-11 | 2017-12-15 | 武汉华星光电半导体显示技术有限公司 | The bonding method and display device of display panel and external circuitses |
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2003
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112698523A (en) * | 2019-10-07 | 2021-04-23 | 三星显示有限公司 | Method of manufacturing display module |
CN118367432A (en) * | 2024-06-20 | 2024-07-19 | 武汉钧恒科技有限公司 | High-power light source COC for silicon optical module, silicon optical module and eutectic method |
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JP4321849B2 (en) | 2009-08-26 |
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