TW200419272A - Driver mounting method using hysteresis loss, substrate and anisotropic conductive film - Google Patents

Abstract

The present invention provides a mounting method using an anisotropic conductive film without short circuit between electrodes and also preventing heat convection to each member of a substrate that uses the anisotropic conductive film during connecting components to the substrate. The mounting method using an anisotropic conductive film of the present invention is for mounting a driver on a substrate using an anisotropic conductive film and includes: a step for pinching an anisotropic conductive film between the substrate and the driver; a step for applying a magnetic field to conductive particles in the anisotropic conductive film to generate eddy current and hysteresis loss of the conductive particles; a step for liquefying resin included in the anisotropic conductive film by the heat generated from the eddy current and hysteresis loss of the conductive particles; and a step for curing the liquefied resin and connecting the electrodes of the substrate and the driver to each other by the conductive particles.

Description

200419272

Anisotropic driving 1. [Technical field to which the invention belongs-the present invention relates to a method of using electrodes of each plate and an electrically conductive film having a safety property. The conductive film mounts the driver on the substrate and the substrate is anisotropic. [Prior technology] Installing the driver on a substrate with a liquid crystal module installed, etc. = Anisotroplc C0nductive Filffl) Method. As shown in Fig. 8a, the anisotropic conductive film is a high-density electrode connection material in which conductive particles 104 are randomly dispersed in a tape-shaped adhesive 102 having a thickness of 20 to 30. A small amount of conductive particles are formed by covering a core made of resin with a conductive shell. In addition, the cement 102 is called a cement. In the following, the assembly of the liquid crystal module is taken as an example to describe the mounting of the parts using the anisotropic conductive film 100. It should be noted that the symbols common to the drawings use relative symbols. The array substrate 110 and the color filter substrate are opposed to each other, and a liquid crystal unit that seals the liquid crystal in the gap between the array substrate 110 and the color filter and the optical filter substrate is installed with a backlight or a driver to form a liquid crystal module. In the assembly of the LCD module, connect the TCP (Tape Carrier Package) with the electrode of the LCD cell. In TCP1 06, an LSI (Large Scale Integration, large-scale integrated circuit) chip is placed in an LSI package of a thin film-like printed circuit. TCP1 06 is also called TAB-IC (Tape Automated Bonding IC)

Page 10 200419272 V. Description of Invention (2) I C). The driver of the LCD module is included in T C P106. As shown in FIG. 8b, ‘after sandwiching the anisotropic conductive film 100 with T C P 106 and the array substrate of the liquid crystal cell’, as shown in the figure, pressurize and heat. The anisotropic conductive film 100 has a liquefied adhesive 102 that is liquefied. The liquefied adhesive 102 cools and hardens after cooling, and can be connected to the array substrate 丨〗 and Tcpi 〇6. The conductive particles 104 are used to connect the electrodes of TCP 106 and the electrodes of the array substrate 1 (). Therefore, the circuit of TCP 106 and the array substrate U 0 are electrically connected to drive the liquid crystal module. The heat generated by heating the anisotropic conductive film 丨 0 will be conducted to the periphery of the electrodes of the array substrate 110, and the liquid crystal cell can be stopped. Therefore, the expansion and contraction of the liquid crystal cell occurs. Due to the different thermal expansion coefficients, stress due to expansion and contraction occurs. However, if the heating temperature is lowered to suppress the stress, the connection cannot be reliably performed, resulting in poor contact. . * • Electricity / Electro-Mechanics ™ long-term electrode spacing of Chino-chan: Sun guard, conductive particles 104 will increase the chance of short circuit between electrodes. Therefore, particle 1 (34), the electrode of TmG6 and the array substrate = 4. However, the position of conductivity = 4 cannot be determined only by pressing and heating. The short circuit between the electrodes caused by the conductive particle 104 is ^ liquid day after day The manufacturing yield of the core group is reduced. [SUMMARY OF THE INVENTION] The object of the present invention is to provide a security method using an anisotropic conductive film.

200419272

Mounting method 'When connecting parts to a substrate using an anisotropic conductive film, the heat transfer of each member of the substrate is suppressed, and a short circuit does not occur between the electrodes. Another object of the present invention is to provide a substrate having a structure for connecting components to be mounted such as Tcp. In addition, another object of the present invention is to provide an anisotropic conductive film for mounting methods such as TCP. The problem. Driving method, using an anisotropic conductive film, the following steps of Ju ^ soil 3 with the substrate and the driver anisotropic conductive film; conductive to the anisotropy; make! Electron particle: Generate eddy current and hysteresis loss = a. I & s Γ electricity, double and hysteresis loss of the conductive particles generated by the, step 4 of the resin liquefaction liquid: pole.乂 v Electro-particle connection between the electrodes of the substrate and the driver may include a step between the electrodes of the driver using the magnetic field gradient

This & No. ^ its insulation formed by I ^ 'in the drive 15 loading section to the conductor, the electrode stack connected to the conductor; the rear and two j 2 on the driver formed on the insulation layer to generate a magnetic field . Moxibustion, the person who makes the current flow to the conductor can use the electrode of the invention to form a conductor in the inner part of the electrode, and form a conductor in the interior of the driver, and then move the electrode connected to the driver loading part to allow the current to flow. The conductor, p 200419272 V. Description of the invention (4) The substrate of the present invention that generates a magnetic field on the electrode, the shape of the conductor may also be a meandering shape. The anisotropic conductive film of the present invention includes conductive particles and cemented fluorene, and the conductive particles may include a ferromagnetic body. 4. [Embodiments] Examples of the invention An example of the method for mounting the driver and the substrate of the present invention will be described with reference to the drawings. Here, the driver contains components to be mounted such as wafers and Tcp. In addition, the substrate includes a mounting substrate such as glass or PCBCPfinted Circuit Board (printed circuit board) as a substrate of the liquid crystal cell. As shown in FIG. 1, a crimping head 1 〇 (bonding fead) for mounting the driver 12 on the substrate 14 applies pressure to the driver 12 ′ ACF (anisotropic conductive film) 50 and the substrate 14, and Apply a magnetic field. The electrodes 5 of the driver 12 are, for example, gold or copper of a diamagnetic body. The electrode 15 of the substrate 14 is, for example, paramagnetic aluminum. Fig. 3 & shows the conductor substrate 16 embedded in the crimping head 10. The conductor substrate 16 is formed by bonding the body 17 to the substrate 18 for the conductor 17 and connecting it to an AC power source. The conductor 17 is formed in a meandering shape, and the linear portion and the folded-back portion 20 are alternately repeated. Hereinafter, in this patent specification, the center line of the linear portion 17a of the conductor 17 and the linear portion 17b of the conductor 17 adjacent to each other via the folded-back portion 20a is referred to as a pitch line 22 in FIG. 3b. As shown in the following description, the interval between the lines 22a and 22b and the distance between the mounted substrate 14 and the electrode 15 of the driver 12 are adjacent to each other in FIG. 3b.

Page 13 200419272 V. Description of Invention (5) Equal. In other words, the conductors 17 are formed in a meandering shape at intervals from the corresponding pitch line 22 between the substrate 14 to be mounted and the electrodes 15 of the driver 12. The conductor substrate 16 is used to cause a current applied with a magnetic field to flow to each of the films 50. w 八 r 王命 4 ^ The structure of the anisotropic conductive film 50 is shown in FIG. 2. The anisotropic conductive film 50 is composed of a binder 52 formed of a resin or the like and conductive particles 54 mixed with the binder 52 /. The adhesive 52 is a well-known adhesive material, which is liquefied when heated to a high temperature, and then hardened by cooling. The conductive particles 54 of the present invention are different from conventional conductive particles and include a ferromagnetic body. For example, as shown in FIG. 2, it is composed of a spherical core 56, a ferromagnetic layer 58 covering the core 56, and a case 60 covering the ferromagnetic layer 58. The core 5 6 is a resinous core as in the past, and is soft against pressure. The ferromagnetic layer 58 is formed of a material that is ferromagnetic and has a large hysteresis loss with respect to a magnetic field, as described below. For example, the ferromagnetic layer 58 is formed of Zn, Co, Fe, or the like. The case 60 is a pair of ferromagnetic layers 58 such as wrought gold. ', The ferromagnetic layer 5 8 contained in the conductive particles 5 4 generates an eddy current when subjected to an AC magnetic field, and generates persistent heat. When the ferromagnetic layer 58 receives an AC magnetic field, it periodically generates heat due to hysteresis loss. Fig. 4 shows the hysteresis of a ferromagnetic body in a magnetic field. By supplying the ferromagnetic layer 58 with an AC magnetic field from the outside, the work caused by hysteresis loss is used as the heat generated in the area surrounded by the CDEFGC for installation. '' A method for mounting the driver 12 on the substrate 14 will be described using FIG. 5. An anisotropic conductive film 50 is adhered to the substrate 4 or the driver 12. Place the electrodes on the substrate 1 4! After aligning the positions of electrode 5 and driver 1 2 of driver 5 with each other, clamp each

Page 14 200419272 V. Description of the invention (6) 'Anisotropic conductive film 50. Next, the pressure head 10, the substrate 14, and the electrode 15 of the driver 12 are aligned. As described above, the conductor substrate 16 on which the meandering conductor 17 is formed is buried in the crimping head 10. First, the positions of the conductors 17 and 17 of the base substrate 16 included in the pressing head 10 are aligned so that they are sandwiched between the substrate 14 and the electrodes 15 of the driver 12. As will be described later, the positions of the crimping head 10 and the electrode 15 are aligned so that the magnetic field generated on the distance line 22 between the conductors 17 is strengthened, and the center line of the distance line 22 and the electrode 15 approximately overlaps. .

After the alignment is completed, a pressure is applied to the driver 12 using the crimping head 10, and the anisotropic conductive film 50 is sandwiched between the substrate 14 and the driver 12. However, when the adhesive 5 2 was melted and not solidified, the driver was not installed 12 °. Then, an alternating current was flowed to the conductor 17 on the conductor substrate 16 embedded in the pressing head 10. As a result, the conductive substrate 16 generates a dynamic magnetic field. The magnetic field has magnetic lines of force perpendicular to the substrate 14 and the driver 12. The magnetic field lines of this AC magnetic field are strongly restrained by the conductive particles 54 containing the ferromagnetic layer 58. As described above, the conductive particles 54 generate heat due to eddy current and hysteresis loss.

Here, the magnetic field acting on the conductive particles 54 is adjusted to the intensity of the saturation magnetization supplied to the ferromagnetic body, so that the heat generation due to the hysteresis loss is maximized. When the external magnetization supplied with saturation magnetization is H s, H = H s X SI N (ω t) is applied to the external magnetic field. Here, t represents time. Regarding the frequency ω, the optimal value is adjusted by considering the energy to be supplied calculated from the particle density of the ferromagnetic body. As the temperature rises, the amount of saturation magnetization decreases and the amount of heat generated by the hysteresis cycle decreases. However, for example, in the case of nickel, Curie

Page 15 200419272 V. Description of the invention (7) The temperature (Curie temperature) is 385 ° C, which is effective for the actual installation. Because of the heat generated by the conductive particles 54, the adhesive 52 can be locally heated with the conductive particles 54 as the center, and the heat generated by the magnetic field of the conductive particles 54 can be used to transfer heat to the adhesive 5 2 and the adhesive 5 2 to liquefy. Between the time when the adhesive 52 is liquefied and the time when it hardens, for example, about 1 second, the conductive particles are arranged on the electrode 15. As described above, the conductor substrate 6 has the conductor 17 wired in a meandering shape, so that each of the pitch lines 22 generates a strong magnetic field. As shown in FIG. 5, the conductor 17 is wired so that when a strong magnetic field is generated in the part of the electrode 15 to be connected in advance, the magnetic field above the conductor 17 becomes weak, and the magnetic field acting on the adhesive 52 has the magnetic field shown in FIG. gradient. As a result, a force is generated in the direction of the concentration of the conductive particles 54 in the portion of the electrode 15. The principle of this force is that when a magnetic field is supplied, a substance having a large magnetic permeability (electric particles 54) is attracted by a substance having a small magnetic permeability. Since the gravitational force is proportional to the square of the magnetic field, when a small magnetic field difference can produce a large gravitational force, the conductive particles 54 become easy to move, and it is easy to concentrate on the strong magnetic field electrode 15 = minutes. Ϊί Ϊ J: 托 1〒 can make it known that the conductive particles 54 are densely arranged near the electrodes 15 and that the conductive particles 54 are denser between the corresponding electrodes 15 and 15, which is more reliable. X, a short circuit between the electrodes caused by the concentration of the conductive particles 54 in each of the connecting particles 54. ° 'prevents conduction. When the time, magnetic field, and pressure method are used to complete the crimping using temperature rise as shown in Fig. 7, first make 作. After applying pressure, the installation is completed. According to need, the heart failure J is removed

200419272 V. Description of the invention (8) In the above-mentioned embodiment, the conductor substrate 16 may also be mounted on the driver 12 of the 14 and the mounting portion of the conductor may be formed on the insulating layer. The mounting portion of the driver 12 of the plate 14 forms a zigzag shape system of 17 on the substrate 14. The center line of the insulation electrode 15 roughly drives the electrode 15 of the substrate 14 and the anisotropy between them. In this embodiment, the mechanism for pressing the substrate 14 between the actuators 12 and 12 is different from the above embodiment. The substrate 14 does not need the precision or the same as the electrode 15 of the embodiment 12 described above. The conductor 17 can be exemplified. The conductor substrate 16 ′ can be formed by the substrate 14 and the system-based insulator 14 so that the centerline of the electrode 15 is approximately the same as that of the electrode 15. The driver 12 can be installed in the present invention to drive a target part. The substrate is a substrate. In addition, the conductive particles 54 embed the conductor substrate 16 into the crimp head 10, but the substrate 14 'places the conductor substrate 16 on the substrate, and then covers the conductor substrate 6 with an insulating layer, or' the conductor 17 may be directly disposed on Base points. The shape of the conductor 17 is a meandering shape. An electrode 15 is formed on the conductor edge layer so that the pitch line 2 2 is heavy. Also, as in the above embodiment, the positions of the electrodes 15 of the actuator 12 are aligned so that the conductive film 50 is formed. The anisotropic conductive film 50 applies pressure between the substrate 14 and the head 10. The same applies to the embodiment in which the driver 12 is mounted. However, a magnetic field is generated with the conductor 17 formed above. Also, the crimping head 10, the substrate 4 and the driving position shown are aligned. It is directly wired in the substrate 14. In this embodiment, it is not necessary to newly form an insulating layer. As long as the substrate is in a meandering shape, the conductors 17 and 2 are separated from each other. The embodiment described later and just now is mounted on the substrate 14. The device can include all installations such as wafers or TCP, including all installations such as glass substrates or PCBs.

Page 17 200419272 V. Description of Invention (9) # Materials, structures, etc. are not particularly limited. The shape of the conductor 17 is not limited to a meandering shape. The shape includes all the shapes of the local magnetic field that is generated after the current flows. In addition, the present invention can be implemented in the form of various improvements, corrections, and changes in accordance with the knowledge of the practitioner without departing from the scope of the invention. A person of the Ming dynasty and Shang Jin said that the heat generation is local because the conductive particles containing a ferromagnetic body are heated by a magnetic field. Because of &, the position where the substrate is not needed will not be: Second, it can prevent the stress caused by heat from occurring. The conductive particles are concentrated in :: ^ :; electricity: The conductive particles are arranged on the top, which can be more accurate. However, the short conductive particles between adjacent electrodes that are electrically connected to Astronomy can become conductive particles, which can prevent the ultra-high density and high-secondary of the driver from being achieved by using the local addition as described above. Localized

Page 18 200419272 Brief description of the drawings V. [Simplified description of the drawings] Fig. 1 shows the installation of the present invention > Fig. 2 shows the ACF of the present invention (each: imaginary. Cross-section view of conductive particles. ), Conductive particles and FIG. 3 (a) are plan views of the conductive substrate of the present invention. = 3 (=) is the conductor of the conductor substrate of the present invention; The relationship between the magnetic field and the magnetic flux density of a magnetic body in a magnetic field. Figure 5 is an enlarged view of the method of the present invention. FIG. 6 is a schematic diagram of the force of the electric particles in the installation method of the present invention. The relationship diagram of the magnetic% gradient and the time and pressure and magnetic% in the installation method of the present invention. ^ Figure 8 (a) is a cross-sectional view of an anisotropic conductive film. Condition: Tcp is mounted on the array substrate via an anisotropic conductive film. TCP and the array substrate are connected by an anisotropic conductive film. Symbol description: 10 crimping head 12 driver 14 substrate 15 electrode

200419272 Brief description of the drawing 1 6 Conductor substrate 1Y conductor 1 8 Substrate for conductor wiring 20 Folded part 2 2 Pitch line 5 0 Anisotropic conductive film of the present invention 5 2 Adhesive 54 Conductive particles 56 Core

5 8 ferromagnetic layer 60 shells

1 〇 〇 Anisotropic conductive film 102 Adhesive 1 0 4 Conductive particles 106 TCP I 0 8 Electrode II 0 Array substrate

Page 20

Claims (1)

200419272 The film will drive the field; the heat of the son, the electrode of the board, where the electrode and the driving electrode formed on the conductor generate a driver installation method. The device is mounted on the substrate and includes the following steps: anisotropic conduction to The substrate and the driver sandwich an anisotropic dominant step in the anisotropic conductive film. The step V electric particles generate eddy current and hysteresis loss. The magnetic force is applied due to the eddy current and hysteresis loss. The anisotropy # fg Μ ^, the step of liquefying the resin contained in the raw conductive particles ν electric film is a step for the liquefaction of the resin to harden, and the steps of the electrode and the driver. ¥ Electrode connection base 2 · The driver of the item i in the patent claim includes the step of using the magnetic field to suspect the knee # 道 衣 方法 Driving the crying thunder 2 The conductive particles are collected between the substrate and the moving electrode. 3. A substrate is provided with a r-edge layer on the driver loading portion, and is used on the insulating layer :: 5 poles of the shape to the electromagnetic field by passing a current to the conductor. 4. A substrate having a conductor formed in its interior, and an electrode connected to the driver in the driver loading portion, and a magnetic field is generated on the electrode by causing a current to flow to the conductor. Shou 5 · If the substrate of the scope of patent application No. 3 or 4, the shape of the conductor is meandering. > and 6 · An anisotropic conductive film including conductive particles and a binder, and 3 'the electric particles include a ferromagnetic body.