TWI251108B - Driver mounting method using hysteresis loss, and substrate and anisotropic conductive film - Google Patents

Abstract

The present invention provides a mounting method using an anisotropic conductive film without short circuit between electrodes and also preventing heat convection to each member of a substrate that uses the anisotropic conductive film during connecting components to the substrate. The mounting method using an anisotropic conductive film of the present invention is for mounting a driver on a substrate using an anisotropic conductive film and includes: a step for pinching an anisotropic conductive film between the substrate and the driver; a step for applying a magnetic field to conductive particles in the anisotropic conductive film to generate eddy current and hysteresis loss of the conductive particles; a step for liquefying resin included in the anisotropic conductive film by the heat generated from the eddy current and hysteresis loss of the conductive particles; and a step for curing the liquefied resin and connecting the electrodes of the substrate and the driver to each other by the conductive particles.

Description

1251108 V. INSTRUCTION OF THE INVENTION (1)---- 1. TECHNICAL FIELD The present invention relates to a method of mounting an actuator on an electrode of a substrate using an anisotropic conductive film, and a substrate having a structure in which a driver is mounted Conductive film. VIII. [Prior Art] When mounting a component such as a driver on a substrate such as a liquid crystal module, an anisotropic conductive film called ACF (An is 〇tr 〇 pic C on uc tive F i 1 m) is used. The method. As shown in Fig. 88, the anisotropic conductive film is obtained by randomly dispersing a small amount of conductive particles 104 in a bonding material of a high-density electrode of a tape-like adhesive of thickness 2 〇 〜 3 〇 # m. A trace amount of conductive particles 丨〇 4 is formed by forming a core made of a resin. Further, the tape-like glue 102 is referred to as a glue. " The following is an example of the assembly of an anisotropic conductive film 100 using the assembly of a liquid crystal module. Further, the same symbols are used for the symbols shared by the respective drawings. The array substrate 110 and the color filter substrate are opposed to each other, and a liquid crystal module is formed by re-installing a backlight or a driver or the like on the liquid crystal cell sealed by the liquid crystal cell in the gap between the array substrate 110 and the color filter substrate. In the assembly of the liquid crystal module, TCP (Tape Carrier package) is connected to the electrodes of the liquid crystal cell. The TCp丨〇 6 system places Ljl (Large Scale Integration) wafers in a LSi package of a thin film-like printed circuit. Tcpi〇6 is also called TAB-IC (Tape Automated BondingIC).

Page 10 1251108 V. Description of the invention (2) 1C). The driver of the LCD module is included in TCP1 06. After the anisotropic conductive film 1 〇 is sandwiched between Tcp 1 〇β and the array substrate 11 of the liquid crystal cell as shown in Fig. 8b, as shown in Fig. 8C, pressurization and heating are performed. The anisotropic conductive film 10 〇 glue 〇 2 is liquefied, cooled by the liquefied glue σ 1 〇 2 and hardened, and the array substrate 〇 and Tcpi 〇 6 can be connected. The electrodes of the TCP 106 and the electrodes of the array substrate are connected by conductive particles 104. Therefore, the circuit of TCP 106 and the array substrate 11 are electrically connected to drive the liquid crystal module. The heat generated by heating the anisotropic conductive film i 〇 0 is conducted to the periphery of the electrode of the array substrate 110, and the members of the liquid crystal cell can be heated and cooled by four parts. Therefore, the components of the liquid crystal cell expand and contract. Since the thermal expansion coefficient of each member is different, the stress caused by expansion and contraction occurs. However, if the heating temperature is lowered for the purpose of force, it is impossible to reliably connect the contact with the Tcpi〇6. . * The electrode spacing of the 1f106 and the electrode spacing of the array substrate 110 are changed: the second electric particles 104 increase the chance of short circuit between the electrodes. Therefore, no between the electrodes. However, it is only the position of pressurization and heating, ^=104. Due to the short circuit between the electrodes caused by the conductive particles 104, the manufacturing yield of the liquid Japanese yen group is lowered. c. [Inventive content] The object of the invention is to use an anisotropic conductive film for the purpose of the invention. It is provided! 2511〇8

= 时 When the substrate is connected using an anisotropic conductive film, the heat transfer of the device is prevented, and no short circuit occurs between the electrodes. The purpose of this is to provide a substrate having a structure in which a TCP or the like is connected. Further, another object of the present invention is an anisotropic conductive film for use in a mounting manner of TCP or the like. The method of mounting the driver of the present invention, using anisotropic conduction, and mounting on the substrate, comprises the steps of: anisotropic conductive film with the substrate and the driving mechanism; and the anisotropic conductive film The conductive particles contained in the film apply a magnetic field, and the conductive particles generate eddy currents and hysteresis, and the heat of the conductive particles generated by the eddy current and the hysteresis loss is used to make the anisotropic conductive film a step of liquefying the resin; and curing the resin of the liquid helium, and connecting the electrode of the substrate and the driver electrode with the conductive particles. 00冤 The mounting method of the driver of the present invention may include using the magnetic field to produce the conductive particle Collecting between the electrode of the substrate and the electrode of the driver. v The substrate of the present invention, the conductor, the insulating layer formed on the conductor, and the sound formed on the insulating layer at the driver loading portion After the electrode stack of the crying connection is connected, a magnetic field can be generated on the electrode by causing a current to flow to the conductor. The substrate of the present invention forms a conductor inside and is mounted on the driver. And electrode portions for driving into Christine # of connected, so that the current flows to the fine conductor 4

Page 12 l25ll〇8

A magnetic field is generated on the electrode. The substrate of the present invention may also have a serpentine shape. The anisotropic conductive film of the present invention comprises conductive particles and a binder. The conductive particles may comprise a ferromagnetic material. Fourth, [Implementation] Feng Jg implementation of you 1

The mounting method of the driver of the present invention and the actual example of the substrate will be described using the drawings. Here, the driver includes a mounting object such as a wafer or a TCp. Further, a mounting substrate such as a glass or a PCBCPrinted Circuit Board printed circuit board as a substrate of the liquid crystal cell is included in the substrate. As shown in Fig. 1, a bonding head for mounting the driver 12 on the substrate 14 applies pressure to the driver 12, the ACF (anisotropic conductive film) 5, and the substrate 14, and a magnetic field is applied. The electrode 丨 of the driver 丨 2 is, for example, gold or copper of a diamagnetic body. The electrode crucible 5 of the substrate 4 is, for example, aluminum of a paramagnetic body.

The conductor substrate 16 of the crimping head 1 is not embedded in Fig. 3a. The conductor substrate 16 is formed by adhering the conductor 17 to the substrate 丨 8 for the conductor 丨 7 and then connecting it to an alternating current power source. The conductor 17 is a serpentine shape, and is formed by alternately repeating a linear portion and a folded portion 2 〇. In the present specification, the center line of the linear portion 17a of the conductor 17 and the linear portion 17b of the conductor 17 adjacent to the folded portion 2〇a is referred to as a pitch line 2 2 in Fig. 3b. As shown in the following description, the interval between the adjacent lines 22a and 22b and the interval between the mounted substrate 14 and the electrode 15 of the driver 12 are adjacent to each other in Fig. 3b.

Page 13 1251108 V. Description of invention (5) —^ Equal. In other words, the conductor 17 is formed into a serpentine shape at a distance from the corresponding pitch line 22 between the substrate 14 to be mounted and the electrode 5 of the driver 12. The conductor substrate 16 is for flowing a current applying a magnetic field to the anisotropic film 50. The structure of the anisotropic conductive film 5 表示 is shown in Fig. 2 . The anisotropic conductive film 50 is composed of a binder 5 2 formed of a resin or the like and conductive particles 54 mixed with a binder 5 2 . The adhesive 52 is a well-known adhesive material which is liquefied by heating to a high temperature and then hardened by cooling. The conductive particles 504 of the present invention, unlike conventional conductive particles, comprise a ferromagnetic body. For example, as shown in FIG. 2, the spherical core 56, the ferromagnetic layer 58 covering the core 56, and the shell 6 包覆 covering the ferromagnetic layer 58 are formed. The core 5 β is a resinous core as in the past and is soft to pressure. The ferromagnetic layer 58 is formed of a material having ferromagnetism and a large hysteresis loss to a magnetic field as shown in the following description. For example, the ferromagnetic layer 58 is formed using ^^, c〇, Fe, or the like. The shell 6 is a pair of ferromagnetic layers 58 such as wrought gold. The ferromagnetic layer 53 contained in the conductive particles 54 generates an eddy current when subjected to an alternating magnetic field, and generates a long-lasting heat. Further, when the ferromagnetic layer 58 is subjected to an alternating magnetic field, it periodically generates heat due to hysteresis loss. The hysteresis of the ferromagnetic body in the magnetic field is shown in FIG. The external magnetic field of the ferromagnetic layer 58 is supplied from the outside, and the work of the area surrounded by the CDEFGC is used as heat generated by the z hysteresis loss for mounting. A method of mounting the driver 丨 2 on the substrate 14 will be described using FIG. The anisotropic conductive film 50 is adhered to the substrate 14 or the driver 12. Aligning the electrodes 15 of the substrate 14 with the electrodes 15 of the driver 12, so that each of them is sandwiched therebetween

1251108

Aligning the opposite polarity conductive film 5 for a long time 'aligns the head 1 〇, the substrate 14 and the electrode 15 of the driver 1 2 . As described above, the conductor substrate 16 of the V body 17 in which the meandering shape is formed is embedded in the pressing head. First, the position of the conductor 17 of the conductor substrate 16 included in the crimping head is aligned so as to be sandwiched between the substrate 14 and the electrode 15 of the driver 12. Further, as will be described later, the positions of the crimping head 1 and the electrode 15 are aligned such that the magnetic field generated between the conductors 17 from the line 22 is strongly increased. The pitch line 2 2 substantially overlaps the center line of the electrode 15. After the alignment is completed, pressure is applied to the actuator 丨2 by the pressing head 1 ,, and the opposite-direction conductive 臈 5 夹 is sandwiched between the substrate 14 and the driver 12. However, when the f is intact, the adhesive 52 is melted and not solidified, and the dynamics of the horse zone is still not installed. Then, the alternating current flows to the conductor 1 of the conductor substrate embedded in the crimping head 1 〇. 7. As a result, the conductor substrate 16 generates a dynamic magnetic field. The magnetic field has magnetic lines perpendicular to the substrate 14 and the driver 12. The magnetic field of the alternating magnetic field is strongly bound by the conductive particles 54 including the ferromagnetic layer 58, and can be heated as a result of eddy current and hysteresis loss. In the body, the magnetic field acting on the conductive particles 54 is adjusted to the intensity of the saturation magnetization of the ferromagnetic material, so that the heat generated by the hysteresis loss becomes old. The external magnetization for supplying the saturation magnetization is H s . At the time of the outside, she adds H = Hs X SI Ν( ω t). Here, t represents time. Regarding the frequency 'considered from the particle density of the ferromagnetic body, the energy optimum value should be supplied. As the temperature rises, the amount of saturation magnetization decreases, and the amount of heat generated by the cans is reduced, but for example, in the case of using nickel, / t is in a bad prison.

1251108 V. INSTRUCTIONS (7) Temperature (Curie temperature) is 385 t:, which is effective for practical use. "The exhibition is sufficient to heat the adhesive 52 by using the conductive particles 5 4, and the heat is transferred to the heat of the adhesive 5 2 ', and the conductive particles 54 can be used as the magnetic field of the conductive particles 54 The liquid crystal is liquefied by the binder 52. After the liquefaction with the binder 52 is liquefied, for example, for about i seconds, the conductive particles are arranged on the electrode 15. The conductor substrate 16 is wired as shown above. The shape generates a neighboring point of the magnetic field strength at each of the pitch lines 22. As shown in Fig. 5, when the conductor 17 is wired so that a portion of the electrode 15 to be connected is generated in advance, the magnetic field becomes weaker above the conductor 17, and the effect is weak. The magnetic field of the binder 52 has a magnetic field gradient as shown in Fig. 6. As a result, a force is generated in a portion of the electrode 15 toward the direction in which the conductive particles 54 are concentrated. The principle of the force is a substance having a large magnetic permeability when an external magnetic field is supplied ( The conductive particles 54) are attracted by a substance having a small magnetic permeability. Because the square of the gravitational force and the magnetic field is proportional to the magnetic field difference of the judging, a large gravitational force can be generated. The gluing is liquefied, the conductive particles 54 become easy to move, and are easily concentrated in the magnetic field. As shown above, the electrode 5 is as shown above, and the conductive particles 54 are in contact near the electrode 15 because of the etchable surface. The electrode of the J phase is 5, the conductive particles 5 4 are thin, and the electrodes are connected. It is also possible to prevent the short circuit between the electrodes caused by the conductive particles 54 because the conductive particles 54 are concentrated on the respective electrodes 15. The relationship between time, magnetic resonance, magnetic poorness, and pressure is shown in Fig. 7. When the temperature rise is used to complete the crimping, the soil, m ^ ^ _ a , and the special 100 first make the working magnetic field disappear, and then remove the working pressure and then 'yuan installation. You save +, according to the product, with low magnetic annealing.

!2511〇8 儿明(8) ---- In the above embodiment, the conductor substrate 16 is buried in the pressing head i〇, but = the guide, the base = 16 is placed in the substrate 14, and the conductor substrate 16 is placed. After the portion of the driver 12 of the substrate is loaded, the conductor substrate 16 is covered with an insulating layer, and an electrode is formed on the insulating layer. Alternatively, the conductor turns 7 may be disposed directly on the load portion of the driver 12 of the base 14. The shape of the conductor 17 formed on the substrate 14 is a serpentine shape. The serpentine shape of the conductor is such that the electrode 15 is formed on the insulating layer such that the pitch line 22 and the center line of the electrode 15 substantially overlap. Further, as in the above-described embodiment, the positions of the electrode 15 of the substrate 14 and the electrode 15 of the driver 12 are aligned so that the anisotropic conductive film 5 Q is sandwiched therebetween. In the present embodiment, the anisotropic conductive film 5 is also interposed between the substrate 丨4 and the actuator 12, and the pressure is applied by the pressing head 1. Further, the mechanism for mounting the driver 12 and the substrate 14 is the same as that of the above embodiment. However, unlike the above-described embodiments, the conductor 17 formed on the substrate 14 generates a magnetic field. Further, it is also necessary to precisely position the pressing head 1 〇, the substrate 丨 4, and the electrode 15 of the driver 12 as shown in the above embodiment. Alternatively, the conductors 17 may be directly wired in the substrate 14. In the present embodiment, it is not necessary to newly form an insulating layer due to the substrate 14-based insulator. As long as the conductor substrate 16 is formed on the substrate 14, the conductors 17 of the serpentine shape are substantially overlapped from the center line of the line 22 and the electrode 15. The driver 12 can be mounted on the substrate stack 4 in the same manner as this embodiment. In the present invention, all of the mounting object parts such as a wafer or a TCP may be included in the driver. Further, the substrate includes all of the mounting substrates such as a glass substrate or a PCB. Further, the conductive particles 54 include a ferromagnetic body, a composition, and

Page 17 1251108 V. INSTRUCTIONS (9) Materials, structures, etc. are not particularly limited. Further, the shape of the conductor 17 is not limited to a meandering shape, and includes a shape in which all of the magnetic field generated by the current flow is generated. In addition, the present invention can be implemented in various modifications, corrections, and changes in accordance with the knowledge of the subject matter within the scope of the invention. Advantageous Effects of Invention As described above, the conductive particles containing the ferromagnetic material are heated by the magnetic field, and the heat generated locally is localized. Therefore, the position of the substrate is not required to be heated and cooled, and the stress caused by heat can be prevented. Further, by using a magnetic field gradient, conductive particles can be arranged on the electrodes, and the conductive particles can be concentrated between the connected electrodes. Therefore, the connection between the electrodes becomes more certain. Further, since the conductive particles are sparse between the adjacent electrodes, the short circuit between the adjacent electrodes passing through the conductive particles can be prevented. The localized heating as described above and the localization of the conductive particles enable ultra-high density and high reliability mounting of the driver.

1251108 Brief description of the drawings V. [Simple description of the drawings] Fig. 1 is a schematic view showing the mounting method of the present invention. Fig. 2 is a cross-sectional view showing an ACF (anisotropic conductive film), conductive particles, and conductive particles of the present invention. Figure 3 (a) is a plan view of a conductor substrate of the present invention. Fig. 3 (b) is an enlarged view of a conductor portion of the conductor substrate of the present invention. Fig. 4 is a graph showing the hysteresis of the relationship between the magnetic field of the ferromagnetic body in the magnetic field and the magnetic flux density.

Fig. 5 is an enlarged view showing an unintentional installation method of the present invention. Fig. 6 is a schematic view showing the magnetic field gradient and the force acting on the conductive particles in the mounting method of the present invention. Fig. 7 is a graph showing the relationship between time and pressure and magnetic field in the mounting method of the present invention. Fig. 8(a) is a cross-sectional view showing an anisotropic conductive film. Fig. 8(b) is a view showing a state in which TCP is mounted on a matrix and a J substrate via an anisotropic conductive film. Fig. 8(c) is a view showing a state in which TCP and an array substrate are connected via an anisotropic conductive film.

Component symbol description: 10 pressing head 12 driver 14 substrate 15 electrode

Page 19 1251108 Schematic description of 16 conductor substrate 17 conductor 1 8 Conductor wiring substrate 20 0 folded back portion 2 2 pitch line 50 Anisotropic conductive film of the present invention 胶 Glue 54 Conductive particles 56 Core 5 8 Ferromagnetic layer 60 shell 100 anisotropic conductive film 102 adhesive 104 conductive particles

106 TCP 108 electrode 11 0 array substrate

Page 20

Claims (1)

1251108 The electric film will drive the sixth. Patent application 1 1. A driver mounting method is mounted on a substrate, and includes the following steps: a step of sandwiching the anisotropic conductive film with the substrate and the driver · Conducting the anisotropic conductive film a step of applying a magnetic field i to the particles to generate eddy current and hysteresis loss; and a step of liquefying the resin contained in the anisotropic conductive film by using conductive particles generated by the thirst current and hysteresis loss; and... , 'The step of hardening the liquefied resin and connecting the electrodes with the conductive particles and/or the driver. 2. The driver mounting method of claim 1, wherein the step of collecting the conductive particles between the electrodes of the substrate and the electrodes of the driver by using the gradient of the magnetic field. 3. A substrate on which a conductor is stacked, an insulating layer formed on the conductor, and an electrode connected to a driver formed on the insulating layer, by causing a current to flow to the conductor. A magnetic field is generated on the electrode. And a substrate in which a conductor is formed, and an electrode for connecting to the driver is formed at the driver loading portion, and a magnetic field is generated on the electrode by causing a current to flow to the conductor. 5, as claimed in claim 3 or 4 The substrate of the item, wherein the shape of the conductor is a serpentine shape. An anisotropic conductive film comprising conductive particles and a binder, and the conductive particles comprise a ferromagnetic body.