200408341 五、發明說明（1) 1 .本技術適用領域 本技術適用於積體電路晶片之散熱元件。 2 ·背景說明 習知技術如圖1所示’積體電路元件 』甘以 15上面，積體電路元件1G上面安置件有^置在電路板基材 包含：實心金屬板Hi及安ί = ”件’散熱元件 汉女置金屬板11的金屬底座12。 這種純金屬散熱機構的缺點是散妖 散熱效果的中央處理單元晶；：n父差’對於需要高 夠。究其原因，乃是因為金屬的力就顯然不足 ^速度不夠快。近年來，液態熱以：雖好，但是熱傳 咼熱傳導，本技術便結合液體材 二的興起，可以提 …者的優點，達到快以，可以 材料的熱傳導能力，取決 ，而且熱傳導材料的傳熱铲’、吸熱與散熱面積 :與外部所供給的熱量：b接=全依賴材料本 非金屬導熱材料相：較，4J材：此，與其 熱夏，其有效導熱係數碑—& I、傳導材料不存在固 接近音速的傳遞迷产思者此夏、表面積的多少而 達相 得您返度，使得熱傳導材而 =相同表面積銀材料的7()()()夕拉守柯枓的最向導熱 數(仏· Κ)供比較的：：倍：下述幾種材料之 从及無機熱傳導材 奴鋼49.8、銅4〇1、 1寻导材枓2，9 2 6，0 0 〇。 熱傳導 之大小 身，而 丨他金屬 :定的導 改變。 係數可 導熱係 銀4 1 8 200408341 五、發明說明（2) 3 ·本技術之摘要說明 本技術之目的之一為開發一種高效率散熱元件。 = 二為開發-種以金屬結合熱傳導材料之高 的之三為開發一種以中空腔體金屬内含金屬超 熱傳導材料之高效率散熱元件。 屬超 4 ·較佳實施例 圖2 ·本技術實施例一 圖不揭露一種積體電路散2〇之散熱機構，包含：庙 用以接觸耦合於安置於雷越^ 一 文罝於電路板基材2 5上面的積體電路2〇; 以及政熱片21具有中空金屬212,安置於前述之散熱底座 2 2上，中空金屬21内含導熱液體，提供快速導熱效果金 屬散熱片2 1的表面提供散熱效果。 、’ 圖3 ·本技術實施例二 與刖一圖示不同點是本技術的散熱底座22，内部設計為中 空，用以容納導熱液體，更加提高熱傳導效率。11 σ ” 圖4 ·本技術實施例三 本設計與前述技術不同的是本技術只使用中空腔體金屬管 312,安置於基材32上面，基材32接觸耦合至^體電路2〇 上面提供散熱效果。基材32可以是實心：金屬，也可以設計200408341 V. Description of the invention (1) 1. Fields of application of this technology This technology is suitable for heat dissipation components of integrated circuit chips. 2 · Background Description The conventional technology is shown in Figure 1 'Integrated Circuit Components' above 15 and the integrated components on the integrated circuit components 1G are placed on the substrate of the circuit board including: solid metal plate Hi and Ann = ” Pieces of heat dissipation element Han girl set metal base 11 metal base 12. The shortcoming of this pure metal heat dissipation mechanism is the central processing unit crystal of the heat dissipation effect of the demon ;: n father difference is high enough for the need. The reason is Because the metal's force is obviously insufficient ^ speed is not fast enough. In recent years, liquid heat: Although good, but heat transfer and heat conduction, this technology combines the rise of liquid material two, which can provide the advantages of ... The thermal conductivity of the material depends on the heat transfer shovel of the thermally conductive material, the area of heat absorption and heat dissipation: the heat supplied from the outside: b connection = totally dependent on the material. Non-metallic thermally conductive material: Compared to 4J material: this, its heat Xia, its effective thermal conductivity tablet-& I, there is no conductive material that is close to the speed of sound. This summer, the amount of surface area can reach you, so that the heat conductive material = the same surface area The 7 () () () materials of Xila Shou Ke 枓 's most direct heat number (仏 · Κ) are for comparison: times: the following materials and inorganic heat transfer materials: slave steel 49.8, copper 4〇1 ， 1 Seek guide material 枓 2,9 2 6,0 0 〇. The size of heat conduction, and other metals: fixed conductance change. The coefficient of thermal conductivity is silver 4 1 8 200408341 V. Description of the invention (2) 3 · This The summary of technology explains that one of the purposes of this technology is to develop a high-efficiency heat-dissipating element. = The second is to develop-a type of metal-bonded thermally conductive material. The third is to develop a high-temperature metal-containing metal superheat-conductive material Efficient heat dissipation element. It belongs to super 4. Figure 2 of the preferred embodiment. The figure of the first embodiment of the technology does not disclose a heat dissipation mechanism of integrated circuit, which includes: a temple for contact coupling and placement in Lei Yue. The integrated circuit 20 on the circuit board substrate 2 5; and the thermal sheet 21 has a hollow metal 212, which is disposed on the aforementioned heat sink base 2 2 and the hollow metal 21 contains a thermally conductive liquid to provide a rapid thermal conductivity. The surface of 1 provides a cooling effect. Figure 3 · This The difference between the second embodiment and the first embodiment is the heat sink base 22 of the present technology, which is designed to be hollow inside to accommodate a heat-conducting liquid and further improve the heat conduction efficiency. 11 σ ”Figure 4 The difference in technology is that this technology only uses the hollow cavity metal tube 312, which is placed on the substrate 32, and the substrate 32 is contact-coupled to the body circuit 20 to provide a heat dissipation effect. The substrate 32 can be solid: metal, or can be designed
第5頁 200408341 五、發明說明（3) 成為具有空間3 2 2的空心金屬，空間3 2 2用以容納導熱液 體，更加提高熱傳導效率。 圖5 ·本技術實施例四 本設計與前述技術不同的是本技術使用中空金屬板412’ 安置於基材42上面’基材42接觸耦合至積體電路2 0上面提 供散熱效果。基材4 2可以是實心金屬，也可以設計成為具 有空間4 2 2的空心金屬，空間4 2 2用以容納導熱液體，更加 提高熱傳導效率。 · 彎設金也 狀的空， 管上中術 、座以技 折底是等 彎在要均 狀置只之 片安，術。 用管·等技圍 採旋計本範 如螺設為利 h用板均權 q採折，之 h是彎計護 表 未或、設保 中，列熱欲 圖計排散所 C設向之人 計之橫體利 設化用液權 化變改熱之 變單是導術 的簡或含技 他等、内本 其折計屬是 =述，述揭示了本技術之較佳實施例以及設計圖式，惟， 車乂佳貫；^例以及設計圖式僅是舉例說明，並非用於限制本 f術=利範圍於此，凡是以均等之技術手段實施本技術 u疋以下述之「申請專利範圍」戶斤涵蓋之權利範圍而 貫施者，均不脫離本發明之精神而為申請人之權利範圍。Page 5 200408341 V. Description of the invention (3) It becomes a hollow metal with a space 3 2 2 which is used to contain a heat-conducting liquid and to further improve the heat conduction efficiency. Figure 5 · Fourth embodiment of the technology The difference between this design and the previous technology is that the technology uses a hollow metal plate 412 'placed on the substrate 42' and the substrate 42 is contact-coupled to the integrated circuit 20 to provide a heat dissipation effect. The substrate 4 2 may be a solid metal or may be designed as a hollow metal with a space 4 2 2. The space 4 2 2 is used to contain a heat-conducting liquid to further improve the heat conduction efficiency. · Bending set gold is also empty, the tube is used for surgery, and the bottom of the seat is to be bent. The bend is placed on the piece to be uniform. Use the pipe and other technology to collect the rotation meter. This model is set to profit h. Use the plate equal weight q to take the discount, where h is the curve meter protection table is not set or under warranty. The trick of using the right to change the liquid power to change the heat is to use the simple or inductive technique of the guide, and the discount is included. The description reveals a preferred embodiment of the technology. And design drawings, but the car is good; examples and design drawings are only examples, not to limit the scope of this technique = benefits, wherever the technology is implemented by equal technical means u Those who implement the scope of rights covered by the "application scope of patents" do not depart from the spirit of the present invention and are the scope of rights of the applicant.
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V 200408341 圖式簡單說明 5. 圖式的簡單說明 圖1.習知技術 圖2.本技術實施例一 圖3.本技術實施例二 圖4.本技術實施例三 圖5 ·本技術實施例四 6. 元件編號表 積體電路10. 20. 實心金屬板1 1. 散熱元件之基座1 2 . 2 2. 3 2. 4 2. 電路板1 5 . 2 5 . 具有空心管的散熱板2 1. 内含導熱液體的散熱管212. 312. 内含導熱液體的散熱板412. 容納導熱液體的空間322.422.414.V 200408341 Simple illustration of the diagram 5. Simple illustration of the diagram Figure 1. Known technology Figure 2. First embodiment of the present technology Figure 3. Second embodiment of the present technology Figure 4. Third embodiment of the present technology Figure 5 · This embodiment of the present technology 4. 6. Component numbering table Integrated circuit 10. 20. Solid metal plate 1 1. Base of heat sink 1 2. 2 2. 3 2. 4 2. Circuit board 1 5. 2 5. Heat sink with hollow tube 2 1. Radiating tube containing thermally conductive liquid 212. 312. Radiating plate containing thermally conductive liquid 412. Space for containing thermally conductive liquid 322.422.414.
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