TR201818900T4 - Birbirleriyle ara bağlantı telleriyle bağlantılı en az iki ayrı bileşen içeren bir düzenin gerçekleştirilmesi yöntemi ve elde edilen düzenek. - Google Patents

Birbirleriyle ara bağlantı telleriyle bağlantılı en az iki ayrı bileşen içeren bir düzenin gerçekleştirilmesi yöntemi ve elde edilen düzenek. Download PDF

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Publication number
TR201818900T4
TR201818900T4 TR2018/18900T TR201818900T TR201818900T4 TR 201818900 T4 TR201818900 T4 TR 201818900T4 TR 2018/18900 T TR2018/18900 T TR 2018/18900T TR 201818900 T TR201818900 T TR 201818900T TR 201818900 T4 TR201818900 T4 TR 201818900T4
Authority
TR
Turkey
Prior art keywords
separate components
realizing
interconnecting wires
components connected
arrangement
Prior art date
Application number
TR2018/18900T
Other languages
English (en)
Inventor
Seban Frédérick
Fidalgo Jean-Christophe
Original Assignee
Gemalto Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemalto Sa filed Critical Gemalto Sa
Publication of TR201818900T4 publication Critical patent/TR201818900T4/tr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/027—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Abstract

Kendi aralarında ara bağlantı telleriyle bağlantılı en az iki ayrı bileşen içeren bir düzeneğin gerçekleştirilme yöntemi ve elde edilen düzenek. Buluş, bir dayanak üzerinde, en az bir ara bağlantı yeliyle birbirine bağlanan en az iki ayrı bileşen içeren bir düzeneğin gerçekleştirilmesi için bir yöntemle ilgilidir. Yöntem, aşağıdaki evreleri içermesiyle farklılaşmaktadır: dayanak (2, 2f, 2b) üzerine, önceden belirlenmiş bir ara bağlantı motifine uygun şekilde, bir bireysel tel yerleştirilmesiyle bir ara bağlantı teli (3) uygulanması, sözü geçen telin, dayanak üzerinde açıkta duran en az bir bağlantı terminal kısmı (7, 8) içermesi; bileşenlerden birinin (C1, C3) en az bir kontağının (5, 6) terminal kısmının (7b, 8b) ve bu kontağın bu terminal kısmına bağlanması. Buluş, aynı zamanda, elde edilen düzenek ve bileşenin çok bileşenli bir ürünüyle ilgilidir.
TR2018/18900T 2007-12-13 2008-12-04 Birbirleriyle ara bağlantı telleriyle bağlantılı en az iki ayrı bileşen içeren bir düzenin gerçekleştirilmesi yöntemi ve elde edilen düzenek. TR201818900T4 (tr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07301673A EP2071906A1 (fr) 2007-12-13 2007-12-13 Procédé de réalisation d'un dispositif comportant au moins deux composants distincts interconnectés par des fils d'interconnexion et dispositif obtenu

Publications (1)

Publication Number Publication Date
TR201818900T4 true TR201818900T4 (tr) 2019-01-21

Family

ID=39365644

Family Applications (1)

Application Number Title Priority Date Filing Date
TR2018/18900T TR201818900T4 (tr) 2007-12-13 2008-12-04 Birbirleriyle ara bağlantı telleriyle bağlantılı en az iki ayrı bileşen içeren bir düzenin gerçekleştirilmesi yöntemi ve elde edilen düzenek.

Country Status (8)

Country Link
US (1) US9699913B2 (tr)
EP (2) EP2071906A1 (tr)
CN (1) CN101946566B (tr)
BR (1) BRPI0820752B1 (tr)
ES (1) ES2711957T3 (tr)
PL (1) PL2232963T3 (tr)
TR (1) TR201818900T4 (tr)
WO (1) WO2009077347A1 (tr)

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US9338915B1 (en) * 2013-12-09 2016-05-10 Flextronics Ap, Llc Method of attaching electronic module on fabrics by stitching plated through holes
BR112016027213B1 (pt) * 2014-05-22 2022-11-01 Composecure, Llc Cartões de id e transação que têm textura e coloração selecionadas e método para produção do mesmo
US10783422B2 (en) 2014-11-03 2020-09-22 Composecure, Llc Ceramic-containing and ceramic composite transaction cards
EP3159832B1 (en) * 2015-10-23 2020-08-05 Nxp B.V. Authentication token
JP6799817B2 (ja) * 2016-11-28 2020-12-16 パナソニックＩｐマネジメント株式会社 フレキシブル配線基板、電子機器、繊維製品
US10892588B2 (en) 2016-12-01 2021-01-12 Dupont Electronics, Inc. Electrical connections for wearables and other articles
JP6780535B2 (ja) * 2017-02-22 2020-11-04 株式会社オートネットワーク技術研究所 ワイヤハーネス
EP3651068A1 (fr) 2018-11-12 2020-05-13 Thales Dis France SA Procédé de réalisation d'un insert électronique pour support portable multi-composants et insert obtenu
FR3117072B1 (fr) * 2020-12-04 2024-04-26 Faurecia Interieur Ind Pièce comprenant une couche conductrice et procédé de fabrication d’une telle pièce
FR3137196A1 (fr) * 2022-06-22 2023-12-29 Idemia The Netherlands B.V. Fabrication d’une carte a puce sans contact hybride avec composants cms et antenne nfc incrustee

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Also Published As

Publication number Publication date
BRPI0820752B1 (pt) 2019-01-22
CN101946566B (zh) 2016-09-07
WO2009077347A1 (fr) 2009-06-25
US20100276497A1 (en) 2010-11-04
US9699913B2 (en) 2017-07-04
PL2232963T3 (pl) 2019-03-29
CN101946566A (zh) 2011-01-12
EP2232963A1 (fr) 2010-09-29
EP2232963B1 (fr) 2018-09-19
EP2071906A1 (fr) 2009-06-17
BRPI0820752A2 (pt) 2015-06-16
ES2711957T3 (es) 2019-05-08

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