SU959644A3 - Подложка дл печатных плат - Google Patents
Подложка дл печатных плат Download PDFInfo
- Publication number
- SU959644A3 SU959644A3 SU752097873A SU2097873A SU959644A3 SU 959644 A3 SU959644 A3 SU 959644A3 SU 752097873 A SU752097873 A SU 752097873A SU 2097873 A SU2097873 A SU 2097873A SU 959644 A3 SU959644 A3 SU 959644A3
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- fibers
- binder
- per cent
- film
- fibres
- Prior art date
Links
- 239000011230 binding agent Substances 0.000 claims abstract 12
- 239000004760 aramid Substances 0.000 claims abstract 5
- 229920003235 aromatic polyamide Polymers 0.000 claims abstract 5
- 239000011888 foil Substances 0.000 claims abstract 5
- 239000004952 Polyamide Substances 0.000 claims abstract 3
- 239000000463 material Substances 0.000 claims abstract 3
- 229920002647 polyamide Polymers 0.000 claims abstract 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract 2
- 229920006397 acrylic thermoplastic Polymers 0.000 claims abstract 2
- 229910052782 aluminium Inorganic materials 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims abstract 2
- 229910052737 gold Inorganic materials 0.000 claims abstract 2
- 229910052759 nickel Inorganic materials 0.000 claims abstract 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims abstract 2
- 229920000642 polymer Polymers 0.000 claims abstract 2
- 229910052709 silver Inorganic materials 0.000 claims abstract 2
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000000835 fiber Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 9
- -1 polyethylene terephthalate Polymers 0.000 claims description 7
- 229920005596 polymer binder Polymers 0.000 claims description 6
- 239000002491 polymer binding agent Substances 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000000126 substance Substances 0.000 claims 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 239000004698 Polyethylene Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 229920000573 polyethylene Polymers 0.000 claims 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims 1
- 229920013683 Celanese Polymers 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims 1
- 229920000784 Nomex Polymers 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229920001617 Vinyon Polymers 0.000 claims 1
- 238000004026 adhesive bonding Methods 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 230000015556 catabolic process Effects 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000006731 degradation reaction Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000004763 nomex Substances 0.000 claims 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims 1
- 229920000915 polyvinyl chloride Polymers 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 230000008961 swelling Effects 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 210000001170 unmyelinated nerve fiber Anatomy 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract 3
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 229920000728 polyester Polymers 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- IWAUBDFERSAJJF-UHFFFAOYSA-N 2-(7-azabicyclo[4.1.0]hepta-1,3,5-triene-7-carbonyl)benzamide Chemical class NC(=O)C1=CC=CC=C1C(=O)N1C2=CC=CC=C21 IWAUBDFERSAJJF-UHFFFAOYSA-N 0.000 abstract 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 abstract 1
- 238000005253 cladding Methods 0.000 abstract 1
- 238000003618 dip coating Methods 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 239000000839 emulsion Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000005065 mining Methods 0.000 abstract 1
- 229920002239 polyacrylonitrile Polymers 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
- D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/58—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives
- D04H1/64—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives the bonding agent being applied in wet state, e.g. chemical agents in dispersions or solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/08—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer the fibres or filaments of a layer being of different substances, e.g. conjugate fibres, mixture of different fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
- B32B2262/0269—Aromatic polyamide fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0276—Polyester fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
- Nonwoven Fabrics (AREA)
- Organic Insulating Materials (AREA)
- Insulating Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43139274A | 1974-01-07 | 1974-01-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU959644A3 true SU959644A3 (ru) | 1982-09-15 |
Family
ID=23711742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU752097873A SU959644A3 (ru) | 1974-01-07 | 1975-01-07 | Подложка дл печатных плат |
Country Status (11)
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0050855B1 (en) * | 1980-10-27 | 1984-12-19 | Hitachi Chemical Co., Ltd. | Laminates |
| FR2543780B1 (fr) * | 1983-03-31 | 1990-02-23 | Rogers Corp | Circuit electrique flexible conservant sa forme et procede de fabrication de ce circuit |
| EP0209391A3 (en) * | 1985-07-17 | 1988-08-31 | Sumitomo Chemical Company, Limited | Resin composition and circuit board moulded from the same |
| CN1034161C (zh) * | 1992-01-28 | 1997-03-05 | 中国科学院金属研究所 | 一种金属-非金属层合复合材料 |
| JPH10131017A (ja) * | 1996-02-21 | 1998-05-19 | Shin Kobe Electric Mach Co Ltd | 積層板用基材及びその製造法ならびにプリプレグ及び積層板 |
| US7335276B2 (en) | 2002-10-01 | 2008-02-26 | E.I. Du Pont De Nemours And Company | Formation of aramid paper laminate |
| US20150239205A1 (en) * | 2014-02-25 | 2015-08-27 | GM Global Technology Operations LLC | Composite material and methods of making and using the same |
| KR102844879B1 (ko) * | 2020-01-30 | 2025-08-11 | 주식회사 엘지에너지솔루션 | 리튬 이차전지용 양극 활물질의 제조 방법 및 상기 방법에 의해 제조된 리튬 이차전지용 양극 활물질 |
-
1974
- 1974-11-11 SE SE7414113A patent/SE415318B/xx unknown
- 1974-12-12 CA CA215,859A patent/CA1019460A/en not_active Expired
- 1974-12-27 YU YU03477/74A patent/YU347774A/xx unknown
- 1974-12-27 NO NO744708A patent/NO140032C/no unknown
- 1974-12-27 NL NL7416906A patent/NL7416906A/xx not_active Application Discontinuation
-
1975
- 1975-01-06 GB GB455/75A patent/GB1486372A/en not_active Expired
- 1975-01-06 DE DE2500445A patent/DE2500445C3/de not_active Expired
- 1975-01-06 JP JP435775A patent/JPS561792B2/ja not_active Expired
- 1975-01-06 FR FR7500192A patent/FR2256831B1/fr not_active Expired
- 1975-01-06 BR BR72/75A patent/BR7500072A/pt unknown
- 1975-01-07 SU SU752097873A patent/SU959644A3/ru active
Also Published As
| Publication number | Publication date |
|---|---|
| DE2500445A1 (de) | 1975-07-10 |
| NO140032C (no) | 1979-06-20 |
| JPS561792B2 (enrdf_load_stackoverflow) | 1981-01-16 |
| FR2256831B1 (enrdf_load_stackoverflow) | 1977-07-01 |
| SE415318B (sv) | 1980-09-22 |
| DE2500445B2 (de) | 1978-02-16 |
| NO140032B (no) | 1979-03-12 |
| NL7416906A (nl) | 1975-07-09 |
| CA1019460A (en) | 1977-10-18 |
| JPS50116951A (enrdf_load_stackoverflow) | 1975-09-12 |
| YU347774A (en) | 1982-06-30 |
| AU7689474A (en) | 1976-07-01 |
| NO744708L (enrdf_load_stackoverflow) | 1975-08-04 |
| BR7500072A (pt) | 1975-11-04 |
| DE2500445C3 (de) | 1978-10-19 |
| FR2256831A1 (enrdf_load_stackoverflow) | 1975-08-01 |
| GB1486372A (en) | 1977-09-21 |
| SE7414113L (enrdf_load_stackoverflow) | 1975-07-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5049435A (en) | Flexible sheet reinforced with poly(aromatic amide) non-woven fabric and use thereof | |
| SU959644A3 (ru) | Подложка дл печатных плат | |
| US6040252A (en) | Laminate base material, a method of producing the same, a prepreg and a laminate | |
| US4035694A (en) | Metal-clad dielectric sheeting | |
| US5160783A (en) | Epoxy resin-impregnated glass cloth sheet having adhesive layer | |
| JP3520604B2 (ja) | コンポジット積層板 | |
| EP0930393A1 (en) | Heat-resistant fiber paper | |
| JPH0513557B2 (enrdf_load_stackoverflow) | ||
| JP4200250B2 (ja) | エポキシ樹脂組成物、プリプレグ、樹脂付き金属箔及び積層板 | |
| JPS5855675B2 (ja) | プリント配線板用基材 | |
| JP3869559B2 (ja) | 電気絶縁用不織布ならびにプリプレグ及び積層板 | |
| DE2134668A1 (enrdf_load_stackoverflow) | ||
| CA2030145A1 (en) | Flame retardant adhesive composition and laminates | |
| JP2003166162A (ja) | ガラス不織布及び積層板 | |
| JPH11100767A (ja) | 積層板用基材及びその製造法ならびにプリプレグ及び積層板 | |
| JP3171360B2 (ja) | プリプレグ | |
| JPH0146639B2 (enrdf_load_stackoverflow) | ||
| JPH0457794B2 (enrdf_load_stackoverflow) | ||
| JPH0977886A (ja) | 積層板用ガラス不織布及び積層板 | |
| JPS61177242A (ja) | 樹脂シ−ト | |
| JPH07115444B2 (ja) | 銅張積層板 | |
| JPH0147303B2 (enrdf_load_stackoverflow) | ||
| JPH08158289A (ja) | 積層板および積層板基材用芳香族ポリアミド繊維紙 | |
| JPH07100360B2 (ja) | 銅張積層板 | |
| JPS60263497A (ja) | プリント回路板の製法 |