SU959644A3 - Support for printed circuit boards - Google Patents
Support for printed circuit boards Download PDFInfo
- Publication number
- SU959644A3 SU959644A3 SU752097873A SU2097873A SU959644A3 SU 959644 A3 SU959644 A3 SU 959644A3 SU 752097873 A SU752097873 A SU 752097873A SU 2097873 A SU2097873 A SU 2097873A SU 959644 A3 SU959644 A3 SU 959644A3
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- fibers
- binder
- per cent
- film
- fibres
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
- D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/58—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives
- D04H1/64—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives the bonding agent being applied in wet state, e.g. chemical agents in dispersions or solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/08—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer the fibres or filaments of a layer being of different substances, e.g. conjugate fibres, mixture of different fibres
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
- B32B2262/0269—Aromatic polyamide fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0276—Polyester fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
- Insulating Bodies (AREA)
- Organic Insulating Materials (AREA)
- Nonwoven Fabrics (AREA)
Abstract
Description
(5) ПОДЛОЖКА ДЛЯ ПЕЧАТНЫХ ПЛАТ(5) Substrate for PCB
Изобретение относитс к металлизированной нетканой волокнистой подложке дл печатных плат и может быть использовано в радиоэлектронной аппаратуре.The invention relates to metallized non-woven fiber substrate for printed circuit boards and can be used in electronic equipment.
Известна подложка дл печатных плат, содержаща электропровод щий слой и диэлектрический слой, включающий волокна полиэтилентерефталата , скрепленные пленкообразующим полимерным св зующим Cl .A known substrate for printed circuit boards containing an electrically conductive layer and a dielectric layer comprising polyethylene terephthalate fibers bonded with a film-forming polymer binder Cl.
Нетканое волокнистое полотно в этой металлизированной пластине состоит из волокон, которые разм гчаютс при нагревании в процессе изготовлени полотна.The nonwoven fibrous web in this metallized plate is composed of fibers that soften when heated during the manufacture of the web.
Однако эта подложка при травлении получает усадку.However, this substrate shrinks during etching.
Цель изобретени - повышение стабильности размеров.The purpose of the invention is to increase the dimensional stability.
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US43139274A | 1974-01-07 | 1974-01-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
SU959644A3 true SU959644A3 (en) | 1982-09-15 |
Family
ID=23711742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU752097873A SU959644A3 (en) | 1974-01-07 | 1975-01-07 | Support for printed circuit boards |
Country Status (11)
Country | Link |
---|---|
JP (1) | JPS561792B2 (en) |
BR (1) | BR7500072A (en) |
CA (1) | CA1019460A (en) |
DE (1) | DE2500445C3 (en) |
FR (1) | FR2256831B1 (en) |
GB (1) | GB1486372A (en) |
NL (1) | NL7416906A (en) |
NO (1) | NO140032C (en) |
SE (1) | SE415318B (en) |
SU (1) | SU959644A3 (en) |
YU (1) | YU347774A (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4446191A (en) * | 1980-10-27 | 1984-05-01 | Hitachi Chemical Company, Ltd. | Laminates comprising prepregs metal clad |
FR2543780B1 (en) * | 1983-03-31 | 1990-02-23 | Rogers Corp | FLEXIBLE ELECTRIC CIRCUIT RETAINING ITS SHAPE AND MANUFACTURING METHOD THEREOF |
EP0209391A3 (en) * | 1985-07-17 | 1988-08-31 | Sumitomo Chemical Company, Limited | Resin composition and circuit board moulded from the same |
CN1034161C (en) * | 1992-01-28 | 1997-03-05 | 中国科学院金属研究所 | Super-miscellaneous vegetable fibre reinforced Al alloy composite |
JPH10131017A (en) * | 1996-02-21 | 1998-05-19 | Shin Kobe Electric Mach Co Ltd | Substrate for laminated board, its production, prepreg and laminated board |
US7335276B2 (en) | 2002-10-01 | 2008-02-26 | E.I. Du Pont De Nemours And Company | Formation of aramid paper laminate |
US20150239205A1 (en) * | 2014-02-25 | 2015-08-27 | GM Global Technology Operations LLC | Composite material and methods of making and using the same |
-
1974
- 1974-11-11 SE SE7414113A patent/SE415318B/en unknown
- 1974-12-12 CA CA215,859A patent/CA1019460A/en not_active Expired
- 1974-12-27 NL NL7416906A patent/NL7416906A/en not_active Application Discontinuation
- 1974-12-27 NO NO744708A patent/NO140032C/en unknown
- 1974-12-27 YU YU03477/74A patent/YU347774A/en unknown
-
1975
- 1975-01-06 DE DE2500445A patent/DE2500445C3/en not_active Expired
- 1975-01-06 BR BR72/75A patent/BR7500072A/en unknown
- 1975-01-06 GB GB455/75A patent/GB1486372A/en not_active Expired
- 1975-01-06 FR FR7500192A patent/FR2256831B1/fr not_active Expired
- 1975-01-06 JP JP435775A patent/JPS561792B2/ja not_active Expired
- 1975-01-07 SU SU752097873A patent/SU959644A3/en active
Also Published As
Publication number | Publication date |
---|---|
SE415318B (en) | 1980-09-22 |
FR2256831B1 (en) | 1977-07-01 |
NO140032C (en) | 1979-06-20 |
NL7416906A (en) | 1975-07-09 |
NO140032B (en) | 1979-03-12 |
JPS561792B2 (en) | 1981-01-16 |
JPS50116951A (en) | 1975-09-12 |
BR7500072A (en) | 1975-11-04 |
GB1486372A (en) | 1977-09-21 |
DE2500445A1 (en) | 1975-07-10 |
AU7689474A (en) | 1976-07-01 |
NO744708L (en) | 1975-08-04 |
FR2256831A1 (en) | 1975-08-01 |
SE7414113L (en) | 1975-07-08 |
YU347774A (en) | 1982-06-30 |
CA1019460A (en) | 1977-10-18 |
DE2500445B2 (en) | 1978-02-16 |
DE2500445C3 (en) | 1978-10-19 |
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