SU407691A1 - About p and s aN of INVENTION 407691 - Google Patents
About p and s aN of INVENTION 407691Info
- Publication number
- SU407691A1 SU407691A1 SU1770570A SU1770570A SU407691A1 SU 407691 A1 SU407691 A1 SU 407691A1 SU 1770570 A SU1770570 A SU 1770570A SU 1770570 A SU1770570 A SU 1770570A SU 407691 A1 SU407691 A1 SU 407691A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solder
- metal
- composition
- nickel
- copper
- Prior art date
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
1one
Изобретение относитс к области пайки, в частности к составу припо дл пайки металла с металлом и металла с керамикой.The invention relates to the field of soldering, in particular to the composition of solder for soldering metal with metal and metal with ceramics.
Известен припой дл пайки нержавеющих сталей следующего состава, %: медь 0,93- 1,25; никель 0,7-0,94; цинк 13,5-15,0 серебро - остальное.Known solder for brazing stainless steels of the following composition,%: copper 0.93-1.25; Nickel 0.7-0.94; Zinc 13.5-15.0 Silver - the rest.
Дл иовыщени прочно1сти и термостойкости па ных соединений в его состав введен молибден в количестве 0,1-1 %, а остальные компоненты вз ты в следующем соотношении, % : медь 25-30; никель 0,1-1; серебро - остальное .In order to increase the strength and heat resistance of solder compounds, molybdenum is introduced into its composition in an amount of 0.1-1%, and the remaining components are taken in the following ratio,%: copper 25-30; nickel 0.1-1; silver - the rest.
Использование припо .предложенного состава позвол ет повысить прочность и термостойкость соединений в сравнении с соединени ми, ла нными из1вестным припоем, на 20%.The use of the soldered composition makes it possible to increase the strength and heat resistance of the joints in comparison with the joints made by known solder by 20%.
В па нных соединени х, выполненных предлагаемым припоем, отсутствует пористость. Дл составлени щихты используют чистые материалы Ag, Си, Ni, Mo, содержащие минимальное количество примесей. Плавление шихты Производ т в важууме мм рт. ст. Полученный припой пластичен.In the solder joints made by the proposed solder, there is no porosity. For the preparation of pure materials, pure Ag, Cu, Ni, Mo materials containing the minimum amount of impurities are used. Smelting of the charge Produced in a vein mm hg. Art. The solder obtained is plastic.
Предмет изобретени Subject invention
Припой дл пайки металла с металлом и металла с керамикой, содержащий серебро, медь, никель, отличающийс тем, что, с целью повыщени прочности и термостойкости па ных соединений в его состав введен молибден в количестве 0,1 - 1%, а остальные компоненты вз ты в следующем соотнощен-ии, % медь 25-30; никель 0,1-1; серебро - остальное.Solder for soldering metal with metal and metal with ceramics, containing silver, copper, nickel, characterized in that, in order to increase the strength and heat resistance of soldered joints, molybdenum is introduced into its composition in an amount of 0.1-1%, and the remaining components you are in the following ratio,% copper 25-30; nickel 0.1-1; silver - the rest.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1770570A SU407691A1 (en) | 1972-04-07 | 1972-04-07 | About p and s aN of INVENTION 407691 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1770570A SU407691A1 (en) | 1972-04-07 | 1972-04-07 | About p and s aN of INVENTION 407691 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU407691A1 true SU407691A1 (en) | 1973-12-10 |
Family
ID=20509967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU1770570A SU407691A1 (en) | 1972-04-07 | 1972-04-07 | About p and s aN of INVENTION 407691 |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU407691A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109414777A (en) * | 2016-07-08 | 2019-03-01 | Abb瑞士股份有限公司 | Alloy is as the purposes of the hard soldering alloy for electric switch hard-welded joint, electric switch hard-welded joint, electric switch and the method for manufacturing electric switch hard-welded joint |
-
1972
- 1972-04-07 SU SU1770570A patent/SU407691A1/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109414777A (en) * | 2016-07-08 | 2019-03-01 | Abb瑞士股份有限公司 | Alloy is as the purposes of the hard soldering alloy for electric switch hard-welded joint, electric switch hard-welded joint, electric switch and the method for manufacturing electric switch hard-welded joint |
| US11052492B2 (en) | 2016-07-08 | 2021-07-06 | Abb Schweiz Ag | Use of an alloy as a brazing alloy for an electric switch braze joint, an electric switch braze joint, an electric switch and a method of producing an electric switch braze joint |
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