JPS57121897A - Palladium alloy solder for dental use - Google Patents
Palladium alloy solder for dental useInfo
- Publication number
- JPS57121897A JPS57121897A JP740581A JP740581A JPS57121897A JP S57121897 A JPS57121897 A JP S57121897A JP 740581 A JP740581 A JP 740581A JP 740581 A JP740581 A JP 740581A JP S57121897 A JPS57121897 A JP S57121897A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- solder
- dental
- lowers
- firing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/322—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C a Pt-group metal as principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dental Preparations (AREA)
Abstract
PURPOSE:To produce an alloy solder for dental use which permits sufficient clinical use after firing of dental porcelain without causing deformation and has good soldering characteristic by adding Au, Ag, In, Al, etc. to a P-Ni alloy of a specific composition range. CONSTITUTION:A P alloy which consists of <=12% Au, <=12% Ag, 25-40% Ni, 0.3-3% In, <=2% Al, and the balance impurities and Pd, and is suited as a presoldering hard solder for an Ni-Cr alloy for firing of dental porcelain is produced. This alloy is of the composition area of about 5.5:4.5-7.0:3.0 Pd:Ni, to which other elements are added to improve the characteristics of the solder. The Au lowers the m.p. but at >=12%, it lowers the m.p. too much. The Ag controls fluidity but at >=12%, it affords discoloration. The In has the effective range where it provides wettability but no defects. With addition of a small amt., the Al decreases the occlusion of H2, O2 considerably.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP740581A JPS57121897A (en) | 1981-01-21 | 1981-01-21 | Palladium alloy solder for dental use |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP740581A JPS57121897A (en) | 1981-01-21 | 1981-01-21 | Palladium alloy solder for dental use |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57121897A true JPS57121897A (en) | 1982-07-29 |
| JPS5754240B2 JPS5754240B2 (en) | 1982-11-17 |
Family
ID=11664958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP740581A Granted JPS57121897A (en) | 1981-01-21 | 1981-01-21 | Palladium alloy solder for dental use |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57121897A (en) |
-
1981
- 1981-01-21 JP JP740581A patent/JPS57121897A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5754240B2 (en) | 1982-11-17 |
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