SU238328A1 - VACUUM DENSITY - Google Patents
VACUUM DENSITYInfo
- Publication number
- SU238328A1 SU238328A1 SU1165664A SU1165664A SU238328A1 SU 238328 A1 SU238328 A1 SU 238328A1 SU 1165664 A SU1165664 A SU 1165664A SU 1165664 A SU1165664 A SU 1165664A SU 238328 A1 SU238328 A1 SU 238328A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- vacuum
- solder
- vacuum density
- silver
- density
- Prior art date
Links
Landscapes
- Ceramic Products (AREA)
Description
Известен припой дл вакуумноллотной пайки, содержащий 40-62% серебра и 35- 60% галли .Solder is known for vacuum soldering, containing 40–62% silver and 35–60% gallium.
Дл повышени вакуумной плотности па йота соединени при, высокой температуре предла-гаетс в его состав вводить тройную эвтектику галлий - индий - олово в количестве , серебро - ОСтальное.To increase the vacuum density of an iota of the compound at high temperatures, it is proposed to introduce into its composition a triple eutectic of gallium - indium - tin in quantity, silver - ostal.
Предложеплый припой о.бразует качественное па ное соединеиие в интервале темпераТур 500-1000°С и позвол ет многократпно нагревать па ный узел до 800°С без нарушейий вакууМ.ной плотности.The proposed solder wire forms a high-quality solder joint in the temperature range of 500–1000 ° C and allows multiple-heating of the drift node to 800 ° C without disturbing the vacuum density.
Кроме ТОГО , такое соединение после мноГократ1ных нагревов до 800°С не только не тер ет вакуумные свойства, но и приобретает даполнителыную механическую прочность.In addition to this, such a compound, after multiple heating to 800 ° C, not only does not lose its vacuum properties, but also gains extra mechanical strength.
Предложенный припой в виде пасты легко .наноситс на па емые узлы при 20°С, па ютThe proposed solder in the form of a paste is easily applied onto the soldered nodes at 20 ° C, it falls
без применени какого-либо флюса в защитной среде или вакууме.without the use of any flux in a protective environment or vacuum.
Припой готовитс путем смешивани серебр ного порош ка с тройным эвтектическимSolder is prepared by mixing silver powder with a triple eutectic
сплавом галли , инди и олова соответственно 60,4, 27,6, 12 вес. % при комнатной температуре .alloy of gallium, indium and tin, respectively, 60.4, 27.6, 12 wt. % at room temperature.
Предложенный припой - может использо,ватьс дл вакуумно-плотной пайки меди сThe proposed solder can be used for vacuum-tight brazing of copper with
медью, .молибденом, вольфрамом, никелем, коваром, нержавеющей сталью и керамикой.copper, molybdenum, tungsten, nickel, covarom, stainless steel and ceramics.
Предмет изобретени Subject invention
Припой дл вакуумнОПлотной пайки, содержащий серебро, отличающийс тем, что, с целью повышени вакуумной плотности па ного соединени при высокой температуре, в его состав введена тройна эвтектика галлий- индий - олово в количестве 30-90%, серебро - остальное.Solder for vacuum soldering, containing silver, characterized in that, in order to increase the vacuum density of the solder compound at high temperature, a triple eutectic gallium-indium - tin in the amount of 30-90% is introduced into its composition, silver - the rest.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1165664A SU238328A1 (en) | 1967-06-19 | 1967-06-19 | VACUUM DENSITY |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1165664A SU238328A1 (en) | 1967-06-19 | 1967-06-19 | VACUUM DENSITY |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU238328A1 true SU238328A1 (en) | 1969-02-20 |
Family
ID=39970858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU1165664A SU238328A1 (en) | 1967-06-19 | 1967-06-19 | VACUUM DENSITY |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU238328A1 (en) |
-
1967
- 1967-06-19 SU SU1165664A patent/SU238328A1/en active
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