SG98047A1 - Semiconductor package having substrate with multi-layer metal bumps - Google Patents

Semiconductor package having substrate with multi-layer metal bumps

Info

Publication number
SG98047A1
SG98047A1 SG200107905A SG200107905A SG98047A1 SG 98047 A1 SG98047 A1 SG 98047A1 SG 200107905 A SG200107905 A SG 200107905A SG 200107905 A SG200107905 A SG 200107905A SG 98047 A1 SG98047 A1 SG 98047A1
Authority
SG
Singapore
Prior art keywords
substrate
semiconductor package
layer metal
metal bumps
bumps
Prior art date
Application number
SG200107905A
Inventor
Tan Cher Khng Victor
Kian Chai Lee
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG200107905A priority Critical patent/SG98047A1/en
Publication of SG98047A1 publication Critical patent/SG98047A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
SG200107905A 2001-12-14 2001-12-14 Semiconductor package having substrate with multi-layer metal bumps SG98047A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200107905A SG98047A1 (en) 2001-12-14 2001-12-14 Semiconductor package having substrate with multi-layer metal bumps

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200107905A SG98047A1 (en) 2001-12-14 2001-12-14 Semiconductor package having substrate with multi-layer metal bumps

Publications (1)

Publication Number Publication Date
SG98047A1 true SG98047A1 (en) 2003-08-20

Family

ID=29707998

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200107905A SG98047A1 (en) 2001-12-14 2001-12-14 Semiconductor package having substrate with multi-layer metal bumps

Country Status (1)

Country Link
SG (1) SG98047A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4494688A (en) * 1981-03-16 1985-01-22 Matsushita Electric Industrial Co., Ltd. Method of connecting metal leads with electrodes of semiconductor device and metal lead therefore
US6281106B1 (en) * 1999-11-25 2001-08-28 Delphi Technologies, Inc. Method of solder bumping a circuit component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4494688A (en) * 1981-03-16 1985-01-22 Matsushita Electric Industrial Co., Ltd. Method of connecting metal leads with electrodes of semiconductor device and metal lead therefore
US6281106B1 (en) * 1999-11-25 2001-08-28 Delphi Technologies, Inc. Method of solder bumping a circuit component

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