SG105519A1 - Substrate level 3d package for semiconductor devices - Google Patents
Substrate level 3d package for semiconductor devicesInfo
- Publication number
- SG105519A1 SG105519A1 SG200107339A SG200107339A SG105519A1 SG 105519 A1 SG105519 A1 SG 105519A1 SG 200107339 A SG200107339 A SG 200107339A SG 200107339 A SG200107339 A SG 200107339A SG 105519 A1 SG105519 A1 SG 105519A1
- Authority
- SG
- Singapore
- Prior art keywords
- package
- semiconductor devices
- substrate level
- substrate
- level
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200107339A SG105519A1 (en) | 2001-11-28 | 2001-11-28 | Substrate level 3d package for semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200107339A SG105519A1 (en) | 2001-11-28 | 2001-11-28 | Substrate level 3d package for semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
SG105519A1 true SG105519A1 (en) | 2004-08-27 |
Family
ID=33448793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200107339A SG105519A1 (en) | 2001-11-28 | 2001-11-28 | Substrate level 3d package for semiconductor devices |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG105519A1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6013948A (en) * | 1995-11-27 | 2000-01-11 | Micron Technology, Inc. | Stackable chip scale semiconductor package with mating contacts on opposed surfaces |
US6291892B1 (en) * | 1998-04-02 | 2001-09-18 | Oki Electric Industry Co., Ltd | Semiconductor package that includes a shallow metal basin surrounded by an insulator frame |
-
2001
- 2001-11-28 SG SG200107339A patent/SG105519A1/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6013948A (en) * | 1995-11-27 | 2000-01-11 | Micron Technology, Inc. | Stackable chip scale semiconductor package with mating contacts on opposed surfaces |
US6291892B1 (en) * | 1998-04-02 | 2001-09-18 | Oki Electric Industry Co., Ltd | Semiconductor package that includes a shallow metal basin surrounded by an insulator frame |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2003277266A8 (en) | Semiconductor device package | |
SG91352A1 (en) | Semiconductor package | |
EP1523077A4 (en) | Package for optical semiconductor | |
EP1378007A4 (en) | Plastic semiconductor package | |
EP1353385A4 (en) | Semiconductor device | |
EP1355362A4 (en) | Semiconductor device | |
GB2370693B (en) | Wiring method for semiconductor package | |
SG120073A1 (en) | Multiple chip semiconductor packages | |
EP1291925A4 (en) | Semiconductor device | |
TW540823U (en) | Flip-chip package substrate | |
AU2002357241A8 (en) | Semiconductor wafer carrier mapping sensor | |
AU7381200A (en) | Semiconductor wafer level package | |
HK1063344A1 (en) | Surface mount chip package | |
TW551712U (en) | Socket for semiconductor package | |
GB2380056B (en) | Lateral semiconductor device | |
TW540816U (en) | Semiconductor package | |
SG105519A1 (en) | Substrate level 3d package for semiconductor devices | |
SG111922A1 (en) | Wafer level package for semiconductor devices | |
AU2003226134A8 (en) | Packaging system for semiconductor devices | |
TW503788U (en) | Substrate cleaning device for semiconductor packaging | |
TW556960U (en) | Substrate for semiconductor package structure | |
TW565011U (en) | Flip-chip package substrate | |
TW580194U (en) | Semiconductor build-up package | |
TW585346U (en) | The magazine for semiconductor package substrate | |
TW505096U (en) | Mold for substrate on chip package |