SG105519A1 - Substrate level 3d package for semiconductor devices - Google Patents

Substrate level 3d package for semiconductor devices

Info

Publication number
SG105519A1
SG105519A1 SG200107339A SG200107339A SG105519A1 SG 105519 A1 SG105519 A1 SG 105519A1 SG 200107339 A SG200107339 A SG 200107339A SG 200107339 A SG200107339 A SG 200107339A SG 105519 A1 SG105519 A1 SG 105519A1
Authority
SG
Singapore
Prior art keywords
package
semiconductor devices
substrate level
substrate
level
Prior art date
Application number
SG200107339A
Inventor
Viswanadam Gautham
Original Assignee
Viswanadam Gautham
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Viswanadam Gautham filed Critical Viswanadam Gautham
Priority to SG200107339A priority Critical patent/SG105519A1/en
Publication of SG105519A1 publication Critical patent/SG105519A1/en

Links

SG200107339A 2001-11-28 2001-11-28 Substrate level 3d package for semiconductor devices SG105519A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200107339A SG105519A1 (en) 2001-11-28 2001-11-28 Substrate level 3d package for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200107339A SG105519A1 (en) 2001-11-28 2001-11-28 Substrate level 3d package for semiconductor devices

Publications (1)

Publication Number Publication Date
SG105519A1 true SG105519A1 (en) 2004-08-27

Family

ID=33448793

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200107339A SG105519A1 (en) 2001-11-28 2001-11-28 Substrate level 3d package for semiconductor devices

Country Status (1)

Country Link
SG (1) SG105519A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6013948A (en) * 1995-11-27 2000-01-11 Micron Technology, Inc. Stackable chip scale semiconductor package with mating contacts on opposed surfaces
US6291892B1 (en) * 1998-04-02 2001-09-18 Oki Electric Industry Co., Ltd Semiconductor package that includes a shallow metal basin surrounded by an insulator frame

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6013948A (en) * 1995-11-27 2000-01-11 Micron Technology, Inc. Stackable chip scale semiconductor package with mating contacts on opposed surfaces
US6291892B1 (en) * 1998-04-02 2001-09-18 Oki Electric Industry Co., Ltd Semiconductor package that includes a shallow metal basin surrounded by an insulator frame

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