TW549583U - Substrate and packaging structure for multi-chip packaging - Google Patents

Substrate and packaging structure for multi-chip packaging

Info

Publication number
TW549583U
TW549583U TW90217348U TW90217348U TW549583U TW 549583 U TW549583 U TW 549583U TW 90217348 U TW90217348 U TW 90217348U TW 90217348 U TW90217348 U TW 90217348U TW 549583 U TW549583 U TW 549583U
Authority
TW
Taiwan
Prior art keywords
packaging
substrate
chip
packaging structure
chip packaging
Prior art date
Application number
TW90217348U
Other languages
Chinese (zh)
Inventor
Lin-Ying Weng
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW90217348U priority Critical patent/TW549583U/en
Publication of TW549583U publication Critical patent/TW549583U/en

Links

TW90217348U 2001-10-12 2001-10-12 Substrate and packaging structure for multi-chip packaging TW549583U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90217348U TW549583U (en) 2001-10-12 2001-10-12 Substrate and packaging structure for multi-chip packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90217348U TW549583U (en) 2001-10-12 2001-10-12 Substrate and packaging structure for multi-chip packaging

Publications (1)

Publication Number Publication Date
TW549583U true TW549583U (en) 2003-08-21

Family

ID=29997955

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90217348U TW549583U (en) 2001-10-12 2001-10-12 Substrate and packaging structure for multi-chip packaging

Country Status (1)

Country Link
TW (1) TW549583U (en)

Similar Documents

Publication Publication Date Title
SG91352A1 (en) Semiconductor package
TW531052U (en) Flip chip and flip chip packaging substrate
AU2002216217A1 (en) Semiconductor package
HK1049066A1 (en) Semiconductor package and method for mounting semiconductor package
GB2396963B (en) Semiconductor packaging structure
TW540823U (en) Flip-chip package substrate
TW532567U (en) Flip chip package substrate and flip chip
TW443581U (en) Wafer-sized semiconductor package structure
TW540816U (en) Semiconductor package
HK1041777A2 (en) Package
TW549583U (en) Substrate and packaging structure for multi-chip packaging
TW501790U (en) Substrate-on-chip package and its substrate
AU149514S (en) Package
TW545694U (en) Ultra-thin semiconductor packaging structure
TW471709U (en) Chip-stacked multi-chip package structure
TW588858U (en) Multi-chip package
TW535993U (en) Cavity-down package substrate for packaging multi-chip and package structure thereof
TW580194U (en) Semiconductor build-up package
TW497757U (en) Multi-chip packaging structure
TW453517U (en) Improved structure of semiconductor packaging substrate
TW462536U (en) Chip package structure
TW479845U (en) Multi-chip semiconductor package
TW428875U (en) Multi-chip IC packaging structure
GB0103884D0 (en) Package
TW556960U (en) Substrate for semiconductor package structure

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees