TW545694U - Ultra-thin semiconductor packaging structure - Google Patents

Ultra-thin semiconductor packaging structure

Info

Publication number
TW545694U
TW545694U TW90213577U TW90213577U TW545694U TW 545694 U TW545694 U TW 545694U TW 90213577 U TW90213577 U TW 90213577U TW 90213577 U TW90213577 U TW 90213577U TW 545694 U TW545694 U TW 545694U
Authority
TW
Taiwan
Prior art keywords
ultra
packaging structure
semiconductor packaging
thin semiconductor
thin
Prior art date
Application number
TW90213577U
Other languages
Chinese (zh)
Inventor
Yau-Rung Li
John Liu
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW90213577U priority Critical patent/TW545694U/en
Publication of TW545694U publication Critical patent/TW545694U/en

Links

TW90213577U 2001-08-07 2001-08-07 Ultra-thin semiconductor packaging structure TW545694U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90213577U TW545694U (en) 2001-08-07 2001-08-07 Ultra-thin semiconductor packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90213577U TW545694U (en) 2001-08-07 2001-08-07 Ultra-thin semiconductor packaging structure

Publications (1)

Publication Number Publication Date
TW545694U true TW545694U (en) 2003-08-01

Family

ID=29729634

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90213577U TW545694U (en) 2001-08-07 2001-08-07 Ultra-thin semiconductor packaging structure

Country Status (1)

Country Link
TW (1) TW545694U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees