TW447777U - Ultra-thin semiconductor package structure - Google Patents

Ultra-thin semiconductor package structure

Info

Publication number
TW447777U
TW447777U TW89208687U TW89208687U TW447777U TW 447777 U TW447777 U TW 447777U TW 89208687 U TW89208687 U TW 89208687U TW 89208687 U TW89208687 U TW 89208687U TW 447777 U TW447777 U TW 447777U
Authority
TW
Taiwan
Prior art keywords
ultra
semiconductor package
package structure
thin semiconductor
thin
Prior art date
Application number
TW89208687U
Other languages
Chinese (zh)
Inventor
Richard Lu
R B Tsai
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW89208687U priority Critical patent/TW447777U/en
Publication of TW447777U publication Critical patent/TW447777U/en

Links

TW89208687U 2000-05-20 2000-05-20 Ultra-thin semiconductor package structure TW447777U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89208687U TW447777U (en) 2000-05-20 2000-05-20 Ultra-thin semiconductor package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89208687U TW447777U (en) 2000-05-20 2000-05-20 Ultra-thin semiconductor package structure

Publications (1)

Publication Number Publication Date
TW447777U true TW447777U (en) 2001-07-21

Family

ID=21668216

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89208687U TW447777U (en) 2000-05-20 2000-05-20 Ultra-thin semiconductor package structure

Country Status (1)

Country Link
TW (1) TW447777U (en)

Similar Documents

Publication Publication Date Title
SG91352A1 (en) Semiconductor package
AU2002216217A1 (en) Semiconductor package
AU9447701A (en) Package
SG94812A1 (en) Frame for semiconductor package
GB0024796D0 (en) Package
GB0121500D0 (en) Semiconductor device
GB0003302D0 (en) Semiconductor devices
GB0101867D0 (en) Semiconductor device
SG109474A1 (en) Semiconductor device
TW443581U (en) Wafer-sized semiconductor package structure
EP1209752A4 (en) Semiconductor device
TW447777U (en) Ultra-thin semiconductor package structure
PL112567U1 (en) Factory-protected package
TW545694U (en) Ultra-thin semiconductor packaging structure
TW543922U (en) Ultra-thin type semiconductor device package structure
TW462536U (en) Chip package structure
TW497757U (en) Multi-chip packaging structure
TW486151U (en) Semiconductor stack package structure
SG91919A1 (en) Leadframe and semiconductor package made using the leadframe
TW422413U (en) Improved semiconductor package structure
TW423715U (en) Semiconductor package structure
GB0015775D0 (en) Semiconductor packaging
TW553476U (en) Improved semiconductor device package structure
GB0105919D0 (en) Semiconductor Device
CA89813S (en) Package

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees