TW501790U - Substrate-on-chip package and its substrate - Google Patents

Substrate-on-chip package and its substrate

Info

Publication number
TW501790U
TW501790U TW90218994U TW90218994U TW501790U TW 501790 U TW501790 U TW 501790U TW 90218994 U TW90218994 U TW 90218994U TW 90218994 U TW90218994 U TW 90218994U TW 501790 U TW501790 U TW 501790U
Authority
TW
Taiwan
Prior art keywords
substrate
chip package
package
chip
Prior art date
Application number
TW90218994U
Other languages
Chinese (zh)
Inventor
Chung-Hung Lin
Jesse Huang
Vincent Tu
Ming-Liang Huang
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW90218994U priority Critical patent/TW501790U/en
Publication of TW501790U publication Critical patent/TW501790U/en

Links

TW90218994U 2001-11-02 2001-11-02 Substrate-on-chip package and its substrate TW501790U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90218994U TW501790U (en) 2001-11-02 2001-11-02 Substrate-on-chip package and its substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90218994U TW501790U (en) 2001-11-02 2001-11-02 Substrate-on-chip package and its substrate

Publications (1)

Publication Number Publication Date
TW501790U true TW501790U (en) 2002-09-01

Family

ID=21687202

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90218994U TW501790U (en) 2001-11-02 2001-11-02 Substrate-on-chip package and its substrate

Country Status (1)

Country Link
TW (1) TW501790U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees