SG96686A1 - Multi-level integrated circuit for wide-gap substrate bonding - Google Patents

Multi-level integrated circuit for wide-gap substrate bonding

Info

Publication number
SG96686A1
SG96686A1 SG200201609A SG200201609A SG96686A1 SG 96686 A1 SG96686 A1 SG 96686A1 SG 200201609 A SG200201609 A SG 200201609A SG 200201609 A SG200201609 A SG 200201609A SG 96686 A1 SG96686 A1 SG 96686A1
Authority
SG
Singapore
Prior art keywords
wide
integrated circuit
substrate bonding
gap substrate
level integrated
Prior art date
Application number
SG200201609A
Other languages
English (en)
Inventor
J Reagan Michael
Liebeskind John
C Haluzak Charles
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of SG96686A1 publication Critical patent/SG96686A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00238—Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Wire Bonding (AREA)
  • Pressure Sensors (AREA)
SG200201609A 2001-06-11 2002-03-19 Multi-level integrated circuit for wide-gap substrate bonding SG96686A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/879,876 US6686642B2 (en) 2001-06-11 2001-06-11 Multi-level integrated circuit for wide-gap substrate bonding

Publications (1)

Publication Number Publication Date
SG96686A1 true SG96686A1 (en) 2003-06-16

Family

ID=25375063

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200201609A SG96686A1 (en) 2001-06-11 2002-03-19 Multi-level integrated circuit for wide-gap substrate bonding

Country Status (7)

Country Link
US (2) US6686642B2 (fr)
EP (1) EP1266863A3 (fr)
JP (1) JP2002373912A (fr)
KR (1) KR20020095107A (fr)
CN (1) CN1248312C (fr)
HK (1) HK1049143A1 (fr)
SG (1) SG96686A1 (fr)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10144343A1 (de) * 2001-09-10 2003-03-27 Perkinelmer Optoelectronics Sensor zum berührugslosen Messen einer Temperatur
JP2005532362A (ja) * 2002-06-13 2005-10-27 ノバルティス アクチエンゲゼルシャフト インドール誘導スタチンのカルシウム塩
DE10231730B4 (de) * 2002-07-13 2012-08-30 Robert Bosch Gmbh Mikrostrukturbauelement
US6790748B2 (en) * 2002-12-19 2004-09-14 Intel Corporation Thinning techniques for wafer-to-wafer vertical stacks
ITTO20030269A1 (it) 2003-04-08 2004-10-09 St Microelectronics Srl Procedimento per la fabbricazione di un dispositivo
US20070073448A1 (en) * 2003-08-19 2007-03-29 Renesas Technology Corp. Semiconductor device having a hole or a step of normal mesa shape as viewed from any cross-section and manufacturing method of the same
US7034393B2 (en) * 2003-12-15 2006-04-25 Analog Devices, Inc. Semiconductor assembly with conductive rim and method of producing the same
US20050170609A1 (en) * 2003-12-15 2005-08-04 Alie Susan A. Conductive bond for through-wafer interconnect
US6946728B2 (en) * 2004-02-19 2005-09-20 Hewlett-Packard Development Company, L.P. System and methods for hermetic sealing of post media-filled MEMS package
JP2005302605A (ja) * 2004-04-14 2005-10-27 Canon Inc 半導体装置
US7608534B2 (en) * 2004-06-02 2009-10-27 Analog Devices, Inc. Interconnection of through-wafer vias using bridge structures
DE102004043120A1 (de) * 2004-09-07 2006-03-09 Robert Bosch Gmbh Mikromechanisches Bauelement mit Hohlraum und Herstellungsverfahren für ein solches Bauelement
US7198981B2 (en) * 2004-10-21 2007-04-03 Honeywell International Inc. Vacuum sealed surface acoustic wave pressure sensor
KR20080014727A (ko) 2004-12-27 2008-02-14 퀀덤 페이퍼, 인크. 어드레스 가능 및 프린트 가능 발광 디스플레이
US7214324B2 (en) * 2005-04-15 2007-05-08 Delphi Technologies, Inc. Technique for manufacturing micro-electro mechanical structures
EP2275793A1 (fr) * 2006-05-23 2011-01-19 Sensirion Holding AG Capteur de pression comportant une chambre et procédé de fabrication de celui-ci
US20070290282A1 (en) * 2006-06-15 2007-12-20 Nanochip, Inc. Bonded chip assembly with a micro-mover for microelectromechanical systems
US20070291623A1 (en) * 2006-06-15 2007-12-20 Nanochip, Inc. Cantilever with control of vertical and lateral position of contact probe tip
US20070121477A1 (en) * 2006-06-15 2007-05-31 Nanochip, Inc. Cantilever with control of vertical and lateral position of contact probe tip
US20080074984A1 (en) * 2006-09-21 2008-03-27 Nanochip, Inc. Architecture for a Memory Device
US20080074792A1 (en) * 2006-09-21 2008-03-27 Nanochip, Inc. Control scheme for a memory device
DE102006046292B9 (de) * 2006-09-29 2014-04-30 Epcos Ag Bauelement mit MEMS-Mikrofon und Verfahren zur Herstellung
US20080087979A1 (en) * 2006-10-13 2008-04-17 Analog Devices, Inc. Integrated Circuit with Back Side Conductive Paths
US20080233672A1 (en) * 2007-03-20 2008-09-25 Nanochip, Inc. Method of integrating mems structures and cmos structures using oxide fusion bonding
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US8415879B2 (en) 2007-05-31 2013-04-09 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8674593B2 (en) 2007-05-31 2014-03-18 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8889216B2 (en) 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
US8846457B2 (en) 2007-05-31 2014-09-30 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US8133768B2 (en) * 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8395568B2 (en) 2007-05-31 2013-03-12 Nthdegree Technologies Worldwide Inc Light emitting, photovoltaic or other electronic apparatus and system
US9425357B2 (en) 2007-05-31 2016-08-23 Nthdegree Technologies Worldwide Inc. Diode for a printable composition
US7992332B2 (en) 2008-05-13 2011-08-09 Nthdegree Technologies Worldwide Inc. Apparatuses for providing power for illumination of a display object
US8127477B2 (en) 2008-05-13 2012-03-06 Nthdegree Technologies Worldwide Inc Illuminating display systems
US8258799B2 (en) * 2008-11-07 2012-09-04 The Charles Stark Draper Laboratory, Inc. MEMS dosimeter
US8590136B2 (en) * 2009-08-28 2013-11-26 Analog Devices, Inc. Method of fabricating a dual single-crystal backplate microphone
US20110073967A1 (en) * 2009-08-28 2011-03-31 Analog Devices, Inc. Apparatus and method of forming a mems acoustic transducer with layer transfer processes
US9099381B2 (en) 2012-11-15 2015-08-04 International Business Machines Corporation Selective gallium nitride regrowth on (100) silicon
US9423578B2 (en) * 2013-08-01 2016-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method of manufacturing
EP3367082A1 (fr) 2013-11-06 2018-08-29 Invensense, Inc. Capteur de pression
EP2871455B1 (fr) 2013-11-06 2020-03-04 Invensense, Inc. Capteur de pression
US9330929B1 (en) * 2014-10-13 2016-05-03 Infineon Technologies Dresden Gmbh Systems and methods for horizontal integration of acceleration sensor structures
EP3076146B1 (fr) 2015-04-02 2020-05-06 Invensense, Inc. Capteur de pression
US11225409B2 (en) 2018-09-17 2022-01-18 Invensense, Inc. Sensor with integrated heater
US11326972B2 (en) 2019-05-17 2022-05-10 Invensense, Inc. Pressure sensor with improve hermeticity

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999028971A1 (fr) * 1997-05-15 1999-06-10 Cis Institut Für Mikrosensorik Composant electronique hybride et procede permettant de le produire
WO2001024259A2 (fr) * 1999-09-30 2001-04-05 Alpha Industries, Inc. Encapsulation de semi-conducteurs

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216490A (en) * 1988-01-13 1993-06-01 Charles Stark Draper Laboratory, Inc. Bridge electrodes for microelectromechanical devices
US4989063A (en) * 1988-12-09 1991-01-29 The United States Of America As Represented By The Secretary Of The Air Force Hybrid wafer scale microcircuit integration
US5371431A (en) * 1992-03-04 1994-12-06 Mcnc Vertical microelectronic field emission devices including elongate vertical pillars having resistive bottom portions
US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
US5581028A (en) * 1994-06-23 1996-12-03 Hewlett Packard Company Fluid property sensors incorporating plated metal rings for improved packaging
US5557596A (en) 1995-03-20 1996-09-17 Gibson; Gary Ultra-high density storage device
US5827102A (en) * 1996-05-13 1998-10-27 Micron Technology, Inc. Low temperature method for evacuating and sealing field emission displays
JP3171785B2 (ja) 1996-06-20 2001-06-04 富士通株式会社 薄型表示装置、及びそれに用いる電界放出陰極の製造方法
US5919548A (en) * 1996-10-11 1999-07-06 Sandia Corporation Chemical-mechanical polishing of recessed microelectromechanical devices
US5903099A (en) * 1997-05-23 1999-05-11 Tini Alloy Company Fabrication system, method and apparatus for microelectromechanical devices
US6137212A (en) 1998-05-26 2000-10-24 The United States Of America As Represented By The Secretary Of The Army Field emission flat panel display with improved spacer architecture
US6062461A (en) * 1998-06-03 2000-05-16 Delphi Technologies, Inc. Process for bonding micromachined wafers using solder
US6100477A (en) * 1998-07-17 2000-08-08 Texas Instruments Incorporated Recessed etch RF micro-electro-mechanical switch
US6118181A (en) 1998-07-29 2000-09-12 Agilent Technologies, Inc. System and method for bonding wafers
US6291908B1 (en) * 1999-10-06 2001-09-18 Trw Inc. Micro-miniature switch apparatus
US6713828B1 (en) * 1999-12-17 2004-03-30 Delphi Technologies, Inc. Monolithic fully-integrated vacuum sealed BiCMOS pressure sensor
US6319745B1 (en) * 2000-05-31 2001-11-20 International Business Machines Corporation Formation of charge-coupled-device with image pick-up array

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999028971A1 (fr) * 1997-05-15 1999-06-10 Cis Institut Für Mikrosensorik Composant electronique hybride et procede permettant de le produire
WO2001024259A2 (fr) * 1999-09-30 2001-04-05 Alpha Industries, Inc. Encapsulation de semi-conducteurs

Also Published As

Publication number Publication date
JP2002373912A (ja) 2002-12-26
US6878638B2 (en) 2005-04-12
US20020185737A1 (en) 2002-12-12
EP1266863A3 (fr) 2004-11-17
EP1266863A2 (fr) 2002-12-18
HK1049143A1 (zh) 2003-05-02
CN1391281A (zh) 2003-01-15
US20030201513A1 (en) 2003-10-30
KR20020095107A (ko) 2002-12-20
CN1248312C (zh) 2006-03-29
US6686642B2 (en) 2004-02-03

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