HK1049143A1 - 多層合成電路作闊隙基底結合 - Google Patents

多層合成電路作闊隙基底結合

Info

Publication number
HK1049143A1
HK1049143A1 HK03100965.8A HK03100965A HK1049143A1 HK 1049143 A1 HK1049143 A1 HK 1049143A1 HK 03100965 A HK03100965 A HK 03100965A HK 1049143 A1 HK1049143 A1 HK 1049143A1
Authority
HK
Hong Kong
Prior art keywords
wide
integrated circuit
substrate bonding
gap substrate
level integrated
Prior art date
Application number
HK03100965.8A
Other languages
English (en)
Inventor
J Regan Michael
Liebeskind John
C Haluzak Charles
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of HK1049143A1 publication Critical patent/HK1049143A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00238—Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Wire Bonding (AREA)
  • Pressure Sensors (AREA)
HK03100965.8A 2001-06-11 2003-02-10 多層合成電路作闊隙基底結合 HK1049143A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/879,876 US6686642B2 (en) 2001-06-11 2001-06-11 Multi-level integrated circuit for wide-gap substrate bonding

Publications (1)

Publication Number Publication Date
HK1049143A1 true HK1049143A1 (zh) 2003-05-02

Family

ID=25375063

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03100965.8A HK1049143A1 (zh) 2001-06-11 2003-02-10 多層合成電路作闊隙基底結合

Country Status (7)

Country Link
US (2) US6686642B2 (zh)
EP (1) EP1266863A3 (zh)
JP (1) JP2002373912A (zh)
KR (1) KR20020095107A (zh)
CN (1) CN1248312C (zh)
HK (1) HK1049143A1 (zh)
SG (1) SG96686A1 (zh)

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US20080074984A1 (en) * 2006-09-21 2008-03-27 Nanochip, Inc. Architecture for a Memory Device
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US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
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US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
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US8456393B2 (en) * 2007-05-31 2013-06-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
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Also Published As

Publication number Publication date
US20030201513A1 (en) 2003-10-30
EP1266863A2 (en) 2002-12-18
KR20020095107A (ko) 2002-12-20
US6878638B2 (en) 2005-04-12
JP2002373912A (ja) 2002-12-26
US20020185737A1 (en) 2002-12-12
US6686642B2 (en) 2004-02-03
CN1248312C (zh) 2006-03-29
CN1391281A (zh) 2003-01-15
EP1266863A3 (en) 2004-11-17
SG96686A1 (en) 2003-06-16

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