SG96208A1 - Copper-alloy foil to be used for suspension member of hard-disc drive - Google Patents
Copper-alloy foil to be used for suspension member of hard-disc driveInfo
- Publication number
- SG96208A1 SG96208A1 SG200101577A SG200101577A SG96208A1 SG 96208 A1 SG96208 A1 SG 96208A1 SG 200101577 A SG200101577 A SG 200101577A SG 200101577 A SG200101577 A SG 200101577A SG 96208 A1 SG96208 A1 SG 96208A1
- Authority
- SG
- Singapore
- Prior art keywords
- copper
- hard
- disc drive
- suspension member
- alloy foil
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title 1
- 239000011888 foil Substances 0.000 title 1
- 239000000725 suspension Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4833—Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B21/00—Head arrangements not specific to the method of recording or reproducing
- G11B21/16—Supporting the heads; Supporting the sockets for plug-in heads
- G11B21/20—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier
- G11B21/21—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier with provision for maintaining desired spacing of head from record carrier, e.g. fluid-dynamic spacing, slider
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Metal Rolling (AREA)
- Heat Treatment Of Sheet Steel (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000070152 | 2000-03-14 | ||
JP2001038465 | 2001-02-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG96208A1 true SG96208A1 (en) | 2003-05-23 |
Family
ID=26587430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200101577A SG96208A1 (en) | 2000-03-14 | 2001-03-14 | Copper-alloy foil to be used for suspension member of hard-disc drive |
Country Status (7)
Country | Link |
---|---|
US (1) | US6602362B2 (fr) |
EP (1) | EP1134730A3 (fr) |
KR (1) | KR100415959B1 (fr) |
CN (1) | CN1188859C (fr) |
MY (1) | MY138128A (fr) |
SG (1) | SG96208A1 (fr) |
TW (1) | TW527427B (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1195395C (zh) * | 2001-01-30 | 2005-03-30 | 日鉱金属股份有限公司 | 积层板用铜合金箔 |
KR100491385B1 (ko) * | 2001-07-04 | 2005-05-24 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | 적층판용 구리합금박 |
JP4255330B2 (ja) * | 2003-07-31 | 2009-04-15 | 日鉱金属株式会社 | 疲労特性に優れたCu−Ni−Si系合金部材 |
US7450344B2 (en) * | 2003-11-12 | 2008-11-11 | Intri-Plex Technologies, Inc. | Remelted Magnetic head support structure in a disk drive |
KR101137274B1 (ko) * | 2005-04-04 | 2012-04-20 | 우베 고산 가부시키가이샤 | 구리박 적층 기판 |
US7466517B2 (en) * | 2005-06-15 | 2008-12-16 | Seagate Technology Llc | Unified suspension laminate |
JP5170866B2 (ja) * | 2006-10-10 | 2013-03-27 | 古河電気工業株式会社 | 電気・電子部品用銅合金材およびその製造方法 |
US8303792B1 (en) * | 2007-08-29 | 2012-11-06 | Magnecomp Corporation | High strength electrodeposited suspension conductors |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04102222A (ja) * | 1990-08-21 | 1992-04-03 | Hitachi Ltd | ヘッドアーム及び磁気ディスク装置、及び、フレキシブルプリント回路基板及びその被覆方法 |
JP2000099910A (ja) * | 1998-09-25 | 2000-04-07 | Nippon Steel Chem Co Ltd | サスペンション基板の製造方法 |
EP1017043A2 (fr) * | 1998-12-28 | 2000-07-05 | Sony Chemicals Corporation | Procédé pour la fabrication d'une suspension pour une tête magnétique |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4749548A (en) * | 1985-09-13 | 1988-06-07 | Mitsubishi Kinzoku Kabushiki Kaisha | Copper alloy lead material for use in semiconductor device |
US5315152A (en) * | 1990-05-31 | 1994-05-24 | Kabushiki Kaisha Toshiba | Lead frame with improved adhesiveness property against plastic and plastic sealing type semiconductor packaging using said lead frame |
JP2651122B2 (ja) | 1994-07-12 | 1997-09-10 | 古河電気工業株式会社 | 電気・電子機器部品用CuーNiーSi系合金の製造方法 |
KR100562790B1 (ko) * | 1998-03-10 | 2006-03-21 | 미츠비시 신도 가부시키가이샤 | 동합금 및 동합금박판 |
JPH11264040A (ja) * | 1998-03-18 | 1999-09-28 | Nippon Mining & Metals Co Ltd | 銅合金箔 |
JP3479470B2 (ja) | 1999-03-31 | 2003-12-15 | 日鉱金属株式会社 | ハードディスクドライブサスペンション用銅合金箔及びその製造方法 |
-
2001
- 2001-03-13 KR KR10-2001-0012952A patent/KR100415959B1/ko not_active IP Right Cessation
- 2001-03-13 TW TW090105909A patent/TW527427B/zh not_active IP Right Cessation
- 2001-03-13 MY MYPI20011135A patent/MY138128A/en unknown
- 2001-03-13 EP EP01106185A patent/EP1134730A3/fr not_active Withdrawn
- 2001-03-14 CN CNB011162325A patent/CN1188859C/zh not_active Expired - Fee Related
- 2001-03-14 US US09/805,160 patent/US6602362B2/en not_active Expired - Fee Related
- 2001-03-14 SG SG200101577A patent/SG96208A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04102222A (ja) * | 1990-08-21 | 1992-04-03 | Hitachi Ltd | ヘッドアーム及び磁気ディスク装置、及び、フレキシブルプリント回路基板及びその被覆方法 |
JP2000099910A (ja) * | 1998-09-25 | 2000-04-07 | Nippon Steel Chem Co Ltd | サスペンション基板の製造方法 |
EP1017043A2 (fr) * | 1998-12-28 | 2000-07-05 | Sony Chemicals Corporation | Procédé pour la fabrication d'une suspension pour une tête magnétique |
Also Published As
Publication number | Publication date |
---|---|
EP1134730A3 (fr) | 2002-08-14 |
EP1134730A2 (fr) | 2001-09-19 |
MY138128A (en) | 2009-04-30 |
TW527427B (en) | 2003-04-11 |
CN1188859C (zh) | 2005-02-09 |
US20020179198A1 (en) | 2002-12-05 |
KR20010092294A (ko) | 2001-10-24 |
CN1321982A (zh) | 2001-11-14 |
US6602362B2 (en) | 2003-08-05 |
KR100415959B1 (ko) | 2004-01-24 |
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