SG93901A1 - Substrate processing system and substrate processing method - Google Patents

Substrate processing system and substrate processing method

Info

Publication number
SG93901A1
SG93901A1 SG200006118A SG200006118A SG93901A1 SG 93901 A1 SG93901 A1 SG 93901A1 SG 200006118 A SG200006118 A SG 200006118A SG 200006118 A SG200006118 A SG 200006118A SG 93901 A1 SG93901 A1 SG 93901A1
Authority
SG
Singapore
Prior art keywords
substrate processing
processing system
processing method
substrate
processing
Prior art date
Application number
SG200006118A
Other languages
English (en)
Inventor
Fukuda Yuji
Ogata Kunie
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG93901A1 publication Critical patent/SG93901A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SG200006118A 1999-10-25 2000-10-24 Substrate processing system and substrate processing method SG93901A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30221499 1999-10-25

Publications (1)

Publication Number Publication Date
SG93901A1 true SG93901A1 (en) 2003-01-21

Family

ID=17906342

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200006118A SG93901A1 (en) 1999-10-25 2000-10-24 Substrate processing system and substrate processing method

Country Status (4)

Country Link
US (2) US6431769B1 (ko)
KR (1) KR100558508B1 (ko)
SG (1) SG93901A1 (ko)
TW (1) TW487950B (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3598054B2 (ja) * 2000-11-06 2004-12-08 東京エレクトロン株式会社 塗布膜形成装置
US6558964B2 (en) 2000-12-27 2003-05-06 Lam Research Corporation Method and apparatus for monitoring a semiconductor wafer during a spin drying operation
JP4201564B2 (ja) * 2001-12-03 2008-12-24 日東電工株式会社 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置
PT1663562E (pt) * 2003-09-16 2011-09-01 Soudronic Ag Monitor de pó
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7371022B2 (en) 2004-12-22 2008-05-13 Sokudo Co., Ltd. Developer endpoint detection in a track lithography system
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
JP4816217B2 (ja) * 2006-04-14 2011-11-16 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP4832201B2 (ja) 2006-07-24 2011-12-07 大日本スクリーン製造株式会社 基板処理装置
US8282984B2 (en) * 2007-12-03 2012-10-09 Tokyo Electron Limited Processing condition inspection and optimization method of damage recovery process, damage recovering system and storage medium
JP5060517B2 (ja) * 2009-06-24 2012-10-31 東京エレクトロン株式会社 インプリントシステム
JP5410212B2 (ja) * 2009-09-15 2014-02-05 株式会社Ｓｏｋｕｄｏ 基板処理装置、基板処理システムおよび検査周辺露光装置
US9727049B2 (en) * 2012-09-04 2017-08-08 Taiwan Semiconductor Manufacturing Company, Ltd. Qualitative fault detection and classification system for tool condition monitoring and associated methods
JP6385466B2 (ja) 2015-01-28 2018-09-05 三菱電機株式会社 周辺露光装置
JP7199279B2 (ja) 2019-03-26 2023-01-05 東京エレクトロン株式会社 基板処理装置及び載置台の除電方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326019A (ja) * 1993-05-14 1994-11-25 Canon Inc 周辺露光装置
US5944894A (en) * 1996-08-29 1999-08-31 Tokyo Electron Limited Substrate treatment system
US6281962B1 (en) * 1998-12-17 2001-08-28 Tokyo Electron Limited Processing apparatus for coating substrate with resist and developing exposed resist including inspection equipment for inspecting substrate and processing method thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5393624A (en) * 1988-07-29 1995-02-28 Tokyo Electron Limited Method and apparatus for manufacturing a semiconductor device
JP2692179B2 (ja) * 1988-10-19 1997-12-17 日本電気株式会社 基板処理装置
JPH03112121A (ja) * 1989-09-27 1991-05-13 Hitachi Ltd 露光システム
JP3013393B2 (ja) * 1990-05-31 2000-02-28 ソニー株式会社 フォトレジスト塗布手段
JPH0620913A (ja) * 1992-07-06 1994-01-28 Matsushita Electron Corp 露光方法及び装置
JPH0729809A (ja) * 1993-07-15 1995-01-31 Hitachi Ltd ホトレジスト塗布装置
JP3516195B2 (ja) 1996-05-28 2004-04-05 東京エレクトロン株式会社 塗布膜形成方法及びその装置
TW383414B (en) 1997-03-05 2000-03-01 Tokyo Electron Ltd Photoresist agent processing method and photoresist agent processing system and evaluation method and processing apparatus for photoresist agent film
US6221787B1 (en) * 1998-04-20 2001-04-24 Tokyo Electron Limited Apparatus and method of forming resist film
US6266125B1 (en) * 1998-05-25 2001-07-24 Tokyo Electron Limited Resist processing method and apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326019A (ja) * 1993-05-14 1994-11-25 Canon Inc 周辺露光装置
US5944894A (en) * 1996-08-29 1999-08-31 Tokyo Electron Limited Substrate treatment system
US6281962B1 (en) * 1998-12-17 2001-08-28 Tokyo Electron Limited Processing apparatus for coating substrate with resist and developing exposed resist including inspection equipment for inspecting substrate and processing method thereof

Also Published As

Publication number Publication date
TW487950B (en) 2002-05-21
KR20010051210A (ko) 2001-06-25
US6713120B2 (en) 2004-03-30
US6431769B1 (en) 2002-08-13
US20020168191A1 (en) 2002-11-14
KR100558508B1 (ko) 2006-03-07

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