SG92672A1 - Method of removing particles from stage and cleaning plate - Google Patents

Method of removing particles from stage and cleaning plate

Info

Publication number
SG92672A1
SG92672A1 SG200000523A SG200000523A SG92672A1 SG 92672 A1 SG92672 A1 SG 92672A1 SG 200000523 A SG200000523 A SG 200000523A SG 200000523 A SG200000523 A SG 200000523A SG 92672 A1 SG92672 A1 SG 92672A1
Authority
SG
Singapore
Prior art keywords
stage
cleaning plate
removing particles
particles
cleaning
Prior art date
Application number
SG200000523A
Other languages
English (en)
Inventor
Nishio Naoki
Ishida Kazushi
Takigawa Yukio
Yano Ei
Original Assignee
Advantest Corp
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp, Fujitsu Ltd filed Critical Advantest Corp
Publication of SG92672A1 publication Critical patent/SG92672A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Environmental & Geological Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG200000523A 1999-02-05 2000-01-28 Method of removing particles from stage and cleaning plate SG92672A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11029054A JP2000228439A (ja) 1999-02-05 1999-02-05 ステージ上のパーティクル除去方法及び清掃板

Publications (1)

Publication Number Publication Date
SG92672A1 true SG92672A1 (en) 2002-11-19

Family

ID=12265672

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200000523A SG92672A1 (en) 1999-02-05 2000-01-28 Method of removing particles from stage and cleaning plate

Country Status (6)

Country Link
US (1) US6565419B1 (de)
JP (1) JP2000228439A (de)
KR (1) KR100373774B1 (de)
DE (1) DE10004629C2 (de)
SG (1) SG92672A1 (de)
TW (1) TW460928B (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3970055B2 (ja) 2002-02-28 2007-09-05 キヤノン株式会社 液晶表示装置
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
CN101303536B (zh) * 2003-08-29 2011-02-09 株式会社尼康 曝光装置和器件加工方法
US7655316B2 (en) 2004-07-09 2010-02-02 Applied Materials, Inc. Cleaning of a substrate support
JP4517768B2 (ja) * 2004-07-12 2010-08-04 株式会社クリエイティブ テクノロジー 異物除去装置
US7248334B2 (en) * 2004-12-07 2007-07-24 Asml Netherlands B.V. Sensor shield
US20060162739A1 (en) * 2005-01-21 2006-07-27 Nikon Corporation Cleaning chuck in situ
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
JP4616733B2 (ja) * 2005-09-05 2011-01-19 株式会社アドテックエンジニアリング 露光装置
US20070054115A1 (en) * 2005-09-08 2007-03-08 International Business Machines Corporation Method for cleaning particulate foreign matter from the surfaces of semiconductor wafers
KR101423611B1 (ko) * 2008-01-16 2014-07-30 삼성전자주식회사 기판 처리 장치, 노광 장치 및 클리닝 툴의 세정 방법
EP2249378B1 (de) * 2009-03-23 2015-09-30 Advantest Corporation Bühnenreinigungsverfahren
WO2013083332A1 (en) * 2011-12-07 2013-06-13 Asml Holding N.V. Method for a patterning device support
JP6079698B2 (ja) * 2014-05-23 2017-02-15 住友金属鉱山株式会社 ウェハ平坦度の測定方法
JP6522306B2 (ja) * 2014-09-30 2019-05-29 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6643135B2 (ja) * 2016-02-17 2020-02-12 キヤノン株式会社 リソグラフィ装置および物品製造方法
US11016401B2 (en) 2017-05-25 2021-05-25 Asml Holding N.V. Substrates and methods of using those substrates
CN112570386B (zh) * 2020-12-09 2022-05-24 云南电网有限责任公司临沧供电局 一种微重力环境无尘激光清洗装置和方法
CN112792729A (zh) * 2021-01-06 2021-05-14 天津中环领先材料技术有限公司 一种硅片减薄净化工件及采用该工件的减薄净化工艺
TWI798053B (zh) * 2022-04-12 2023-04-01 福懋科技股份有限公司 粉塵清潔設備及其粉塵清潔方法

Citations (2)

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JP2000108159A (ja) * 1998-10-08 2000-04-18 Apic Yamada Corp 樹脂封止装置
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant

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DE7812733U1 (de) 1978-04-26 1979-02-08 Hori, Hiroyuki, Takarazuka, Hyogo (Japan) Vorrichtung zum entfernen loser fremdpartikel, insbesondere von verunreinigungen, von der oberflaeche eines festen gegenstandes
US4510640A (en) 1984-01-06 1985-04-16 Shogo Omori Duster-polisher made of plastic film
JPH0195010A (ja) 1987-10-07 1989-04-13 Matsushita Electron Corp 成形金型のクリーニング方法
JP3212405B2 (ja) * 1992-07-20 2001-09-25 富士通株式会社 エキシマレーザ加工方法及び装置
JPH06165975A (ja) 1992-11-27 1994-06-14 Dainippon Screen Mfg Co Ltd 基板端縁洗浄装置
JPH0774137A (ja) * 1993-07-05 1995-03-17 Dainippon Screen Mfg Co Ltd 基板表面のパーティクル除去方法及びその装置
JP3417008B2 (ja) * 1993-11-04 2003-06-16 株式会社デンソー 半導体ウエハのエッチング方法
JP3493089B2 (ja) 1995-12-25 2004-02-03 株式会社ルネサステクノロジ 半導体装置の製造方法および異物除去シート
US5690749A (en) * 1996-03-18 1997-11-25 Motorola, Inc. Method for removing sub-micron particles from a semiconductor wafer surface by exposing the wafer surface to clean room adhesive tape material
JPH09293740A (ja) 1996-04-26 1997-11-11 Sony Corp 半導体製造工程における余剰樹脂の除去加工方法および除去装置
US5807658A (en) * 1996-08-20 1998-09-15 Presstek, Inc. Self-cleaning, abrasion-resistant, laser-imageable lithographic printing contructions
CA2221922C (en) * 1996-08-20 2004-01-27 Presstek, Inc. Self-cleaning, abrasion-resistant, laser-imageable lithographic printing constructions
TW374045B (en) * 1997-02-03 1999-11-11 Tokyo Electron Ltd Polishing apparatus, polishing member and polishing method
US5902678A (en) 1997-04-01 1999-05-11 Nitto Denko Corporation Pressure-sensitive adhesive or pressure-sensitive adhesive tape for foreign-matter removal
JPH1119946A (ja) 1997-06-30 1999-01-26 Tsukuba Seiko Kk 樹脂成形型面クリーニング装置
JPH11138429A (ja) * 1997-11-11 1999-05-25 Sony Corp 研磨装置
JPH11138426A (ja) * 1997-11-11 1999-05-25 Tokyo Electron Ltd 研磨装置
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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
JP2000108159A (ja) * 1998-10-08 2000-04-18 Apic Yamada Corp 樹脂封止装置

Also Published As

Publication number Publication date
DE10004629A1 (de) 2000-08-17
US6565419B1 (en) 2003-05-20
JP2000228439A (ja) 2000-08-15
KR100373774B1 (ko) 2003-02-26
KR20010006608A (ko) 2001-01-26
DE10004629C2 (de) 2002-11-14
TW460928B (en) 2001-10-21

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