SG85622A1 - Electrically conductive paste and electronic element - Google Patents

Electrically conductive paste and electronic element

Info

Publication number
SG85622A1
SG85622A1 SG9901053A SG1999001053A SG85622A1 SG 85622 A1 SG85622 A1 SG 85622A1 SG 9901053 A SG9901053 A SG 9901053A SG 1999001053 A SG1999001053 A SG 1999001053A SG 85622 A1 SG85622 A1 SG 85622A1
Authority
SG
Singapore
Prior art keywords
electrically conductive
conductive paste
electronic element
electronic
paste
Prior art date
Application number
SG9901053A
Other languages
English (en)
Inventor
Sanada Yukio
Takahashi Hiromasa
Kuroiwa Shinichiro
Fujiyama Masaki
Hamada Kunihiko
Otani Akira
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of SG85622A1 publication Critical patent/SG85622A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Capacitors (AREA)
  • Conductive Materials (AREA)
SG9901053A 1998-03-12 1999-03-03 Electrically conductive paste and electronic element SG85622A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06151298A JP3397125B2 (ja) 1998-03-12 1998-03-12 電子部品

Publications (1)

Publication Number Publication Date
SG85622A1 true SG85622A1 (en) 2002-01-15

Family

ID=13173221

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9901053A SG85622A1 (en) 1998-03-12 1999-03-03 Electrically conductive paste and electronic element

Country Status (3)

Country Link
US (2) US6197221B1 (ja)
JP (1) JP3397125B2 (ja)
SG (1) SG85622A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4590666B2 (ja) * 1999-12-14 2010-12-01 株式会社村田製作所 導電性ペーストおよびこれを用いたセラミック電子部品
JP4576660B2 (ja) * 2000-03-28 2010-11-10 株式会社村田製作所 積層セラミックコンデンサ用導電性ペーストならびにこれを用いた積層セラミックコンデンサ
JP2001307944A (ja) * 2000-04-26 2001-11-02 Taiyo Yuden Co Ltd 積層セラミックコンデンサの製造方法及び外部電極用ペースト
CN100511509C (zh) * 2004-02-26 2009-07-08 京瓷株式会社 通路导体用导电性糊和用其的陶瓷配线板及其制造方法
JP4673086B2 (ja) * 2005-02-28 2011-04-20 京セラ株式会社 ビア導体メタライズ用の導体ペーストおよびこれを用いたセラミック配線基板の製造方法
US20080065052A1 (en) * 2005-10-14 2008-03-13 Carl Zeiss Meditec Ag Device and method for material processing by means of laser radiation
US8553735B2 (en) * 2005-10-14 2013-10-08 Carl Zeiss Meditec Ag Device and method for material processing by means of laser radiation
JP4291857B2 (ja) * 2007-01-24 2009-07-08 三ツ星ベルト株式会社 銅導体ペースト、導体回路板及び電子部品
TW201118059A (en) * 2009-11-20 2011-06-01 Holy Stone Entpr Co Ltd Manufacturing process for high precision ceramic substrate
KR20110065622A (ko) * 2009-12-10 2011-06-16 삼성전기주식회사 적층 세라믹 커패시터
JP5780856B2 (ja) * 2011-06-30 2015-09-16 京セラ株式会社 積層セラミックコンデンサ
JP6854593B2 (ja) * 2015-07-14 2021-04-07 株式会社村田製作所 積層セラミックコンデンサ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU948918A1 (ru) * 1980-12-18 1982-08-07 Ивановский Химико-Технологический Институт Легкоплавкое стекло
JPS60219704A (ja) * 1984-04-17 1985-11-02 株式会社日立製作所 電圧非直線抵抗体及びその製造法
US4701827A (en) * 1986-02-10 1987-10-20 Kyocera Corporation Multilayer ceramic capacitor
US4865772A (en) * 1988-01-26 1989-09-12 Masatoshi Suehiro Copper thick film conductor composition
US5418193A (en) * 1993-05-07 1995-05-23 Murata Manufacturing Co., Ltd. Copper paste for forming conductive thick film
JPH0851044A (ja) * 1994-06-01 1996-02-20 Murata Mfg Co Ltd 磁器コンデンサ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4476039A (en) * 1983-01-21 1984-10-09 E. I. Du Pont De Nemours And Company Stain-resistant ruthenium oxide-based resistors
US4906404A (en) * 1988-11-07 1990-03-06 Dai-Ichi Kogyo Seiyaku Co., Ltd. Copper conductor composition
US5250229A (en) * 1991-10-10 1993-10-05 E. I. Du Pont De Nemours And Company Silver-rich conductor compositions for high thermal cycled and aged adhesion
DE4239862A1 (de) * 1992-11-27 1994-06-01 Cerdec Ag Keramische Farbpaste und Druckmedium hierfür
US5439852A (en) * 1994-08-01 1995-08-08 E. I. Du Pont De Nemours And Company Cadmium-free and lead-free thick film conductor composition

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU948918A1 (ru) * 1980-12-18 1982-08-07 Ивановский Химико-Технологический Институт Легкоплавкое стекло
JPS60219704A (ja) * 1984-04-17 1985-11-02 株式会社日立製作所 電圧非直線抵抗体及びその製造法
US4701827A (en) * 1986-02-10 1987-10-20 Kyocera Corporation Multilayer ceramic capacitor
US4865772A (en) * 1988-01-26 1989-09-12 Masatoshi Suehiro Copper thick film conductor composition
US5418193A (en) * 1993-05-07 1995-05-23 Murata Manufacturing Co., Ltd. Copper paste for forming conductive thick film
JPH0851044A (ja) * 1994-06-01 1996-02-20 Murata Mfg Co Ltd 磁器コンデンサ

Also Published As

Publication number Publication date
US6585916B2 (en) 2003-07-01
JP3397125B2 (ja) 2003-04-14
US6197221B1 (en) 2001-03-06
JPH11260146A (ja) 1999-09-24
US20010001481A1 (en) 2001-05-24

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