SG79967A1 - Ic testing apparatus - Google Patents

Ic testing apparatus

Info

Publication number
SG79967A1
SG79967A1 SG9800748A SG1998000748A SG79967A1 SG 79967 A1 SG79967 A1 SG 79967A1 SG 9800748 A SG9800748 A SG 9800748A SG 1998000748 A SG1998000748 A SG 1998000748A SG 79967 A1 SG79967 A1 SG 79967A1
Authority
SG
Singapore
Prior art keywords
testing apparatus
testing
Prior art date
Application number
SG9800748A
Other languages
English (en)
Inventor
Kiyokawa Toshiyuki
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of SG79967A1 publication Critical patent/SG79967A1/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0483Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867Handlers or transport devices, e.g. loaders, carriers, trays
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)
SG9800748A 1997-04-18 1998-04-15 Ic testing apparatus SG79967A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9101672A JPH10293158A (ja) 1997-04-18 1997-04-18 Ic試験装置

Publications (1)

Publication Number Publication Date
SG79967A1 true SG79967A1 (en) 2001-04-17

Family

ID=14306865

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9800748A SG79967A1 (en) 1997-04-18 1998-04-15 Ic testing apparatus

Country Status (7)

Country Link
US (1) US6218849B1 (ko)
JP (1) JPH10293158A (ko)
KR (1) KR100295707B1 (ko)
CN (1) CN1203367A (ko)
DE (1) DE19817124A1 (ko)
MY (1) MY119479A (ko)
SG (1) SG79967A1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6714714B1 (en) * 2001-01-04 2004-03-30 Axsun Technologies, Inc. Butterfly package pallet
JP4615151B2 (ja) * 2001-06-19 2011-01-19 モレックス インコーポレイテド 半導体パッケージ用ソケット
US7275938B2 (en) * 2001-06-19 2007-10-02 Molex Incorporated Socket for semiconductor package
TW531821B (en) * 2002-02-08 2003-05-11 Ultratera Corp Fixture for use in test of semiconductor package and process with use of the same
TW566551U (en) * 2002-07-05 2003-12-11 Via Tech Inc IC device testing socket assembly with a fault preventing device
JP4093930B2 (ja) * 2003-07-17 2008-06-04 株式会社東京精密 フレーム搬送プローバ
JP4537702B2 (ja) * 2003-12-26 2010-09-08 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP2005223244A (ja) * 2004-02-09 2005-08-18 Tokyo Seimitsu Co Ltd チップの飛び出し位置検出方法
US7030636B1 (en) 2005-05-02 2006-04-18 Fargo Assembly Company Low pin testing system
JP4841552B2 (ja) * 2005-07-08 2011-12-21 東北精機工業株式会社 デバイス位置決め台、及び、該デバイス位置決め台を有するハンドラー
TWM288053U (en) * 2005-08-30 2006-02-21 Hon Hai Prec Ind Co Ltd Electrical connector
US7847570B2 (en) 2007-10-19 2010-12-07 Teradyne, Inc. Laser targeting mechanism
US7733081B2 (en) 2007-10-19 2010-06-08 Teradyne, Inc. Automated test equipment interface
US20170023643A1 (en) * 2015-07-20 2017-01-26 Qualcomm Incorporated Handler based automated testing of integrated circuits in an electronic device
JP2018054464A (ja) * 2016-09-29 2018-04-05 セイコーエプソン株式会社 電子部品搬送装置及び電子部品検査装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5513948A (en) * 1991-05-17 1996-05-07 Kensington Laboratories, Inc. Universal specimen prealigner
WO1996029625A1 (en) * 1995-03-22 1996-09-26 Minnesota Mining And Manufacturing Company System for tuning an integrated optical switch element
WO1996035972A1 (en) * 1995-05-08 1996-11-14 Testdesign Corporation Optical fiber interface for integrated circuit test system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4553843A (en) 1981-08-03 1985-11-19 Micro Component Technology, Inc. Apparatus for determining the alignment of leads on a body
JPS60247106A (ja) 1984-05-22 1985-12-06 Fujitsu Ltd 形状検査装置
US4704700A (en) * 1985-05-20 1987-11-03 American Tech Manufacturing, Inc. Apparatus and method for lead integrity determination for dip devices
US4800335A (en) * 1987-05-28 1989-01-24 Zenith Electronics Corporation Test fixture for circuit components on circuit boards
JP2540879B2 (ja) 1987-09-17 1996-10-09 ソニー株式会社 実装機の部品姿勢判定方法
JP2853136B2 (ja) 1989-01-17 1999-02-03 松下電器産業株式会社 電子部品実装方法及び電子部品実装装置及び電子部品供給装置
US5432456A (en) * 1993-11-24 1995-07-11 Compaq Computer Corporation Connector installation GO/NO-GO test fixture
EP0808554A1 (de) 1995-12-11 1997-11-26 QTec Industrie-Automation GmbH Verfahren und einrichtung zur dreidimensionalen, berührungslosen vermessung der geometrie von anschlussbeinen bei halbleiter-bauelementen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5513948A (en) * 1991-05-17 1996-05-07 Kensington Laboratories, Inc. Universal specimen prealigner
WO1996029625A1 (en) * 1995-03-22 1996-09-26 Minnesota Mining And Manufacturing Company System for tuning an integrated optical switch element
WO1996035972A1 (en) * 1995-05-08 1996-11-14 Testdesign Corporation Optical fiber interface for integrated circuit test system

Also Published As

Publication number Publication date
JPH10293158A (ja) 1998-11-04
CN1203367A (zh) 1998-12-30
DE19817124A1 (de) 1999-02-11
KR19980081524A (ko) 1998-11-25
KR100295707B1 (ko) 2001-08-07
MY119479A (en) 2005-05-31
US6218849B1 (en) 2001-04-17

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