SG78301A1 - Socket apparatus for removably loading electric parts - Google Patents
Socket apparatus for removably loading electric partsInfo
- Publication number
- SG78301A1 SG78301A1 SG1998001496A SG1998001496A SG78301A1 SG 78301 A1 SG78301 A1 SG 78301A1 SG 1998001496 A SG1998001496 A SG 1998001496A SG 1998001496 A SG1998001496 A SG 1998001496A SG 78301 A1 SG78301 A1 SG 78301A1
- Authority
- SG
- Singapore
- Prior art keywords
- electric parts
- socket apparatus
- loading electric
- removably loading
- removably
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/193—Means for increasing contact pressure at the end of engagement of coupling part, e.g. zero insertion force or no friction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19505597A JP3270716B2 (ja) | 1997-07-04 | 1997-07-04 | ソケット及び半導体装置の取付方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG78301A1 true SG78301A1 (en) | 2001-02-20 |
Family
ID=16334812
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1998001496A SG78301A1 (en) | 1997-07-04 | 1998-06-23 | Socket apparatus for removably loading electric parts |
Country Status (5)
Country | Link |
---|---|
US (1) | US6027355A (ja) |
JP (1) | JP3270716B2 (ja) |
KR (1) | KR100380669B1 (ja) |
SG (1) | SG78301A1 (ja) |
TW (1) | TW398061B (ja) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1517600B1 (en) * | 1998-06-30 | 2018-05-02 | Enplas Corporation | Socket for electrical parts |
JP3755718B2 (ja) * | 1999-04-28 | 2006-03-15 | 株式会社エンプラス | 電気部品用ソケット |
JP4087012B2 (ja) * | 1999-05-31 | 2008-05-14 | 株式会社エンプラス | 電気部品用ソケット |
JP3758069B2 (ja) * | 1999-07-30 | 2006-03-22 | 株式会社エンプラス | 電気部品用ソケット |
JP3257994B2 (ja) | 1999-08-30 | 2002-02-18 | 日本テキサス・インスツルメンツ株式会社 | ソケット |
US6402528B2 (en) | 1999-11-30 | 2002-06-11 | Texas Instruments Incorporated | Electronic part mounting device |
JP4266466B2 (ja) | 1999-11-30 | 2009-05-20 | 株式会社センサータ・テクノロジーズジャパン | ソケット及び電子部品装着装置 |
JP3739626B2 (ja) * | 2000-03-10 | 2006-01-25 | 株式会社エンプラス | 電気部品用ソケット |
JP2002025731A (ja) | 2000-07-07 | 2002-01-25 | Texas Instr Japan Ltd | ソケット及び電子部品装着装置 |
JP3425125B2 (ja) * | 2000-08-10 | 2003-07-07 | タイコエレクトロニクスアンプ株式会社 | Bgaパッケージ用ソケット |
JP2002071749A (ja) * | 2000-08-29 | 2002-03-12 | Molex Inc | Icパッケージの試験評価用ソケット |
TW564578B (en) * | 2000-10-25 | 2003-12-01 | Texas Instruments Inc | Socket apparatus and method for removably mounting an electronic package |
US6796823B1 (en) * | 2001-05-21 | 2004-09-28 | Yamaichi Electronics Co., Ltd. | Socket for electronic element |
JP4721582B2 (ja) * | 2001-09-14 | 2011-07-13 | 株式会社センサータ・テクノロジーズジャパン | ソケット |
JP4138305B2 (ja) * | 2001-12-12 | 2008-08-27 | 株式会社エンプラス | 電気部品用ソケット |
TW554586B (en) * | 2002-07-23 | 2003-09-21 | Nanya Technology Corp | Socket of chip scale package |
JP4116851B2 (ja) | 2002-09-19 | 2008-07-09 | 富士通株式会社 | 電子部品の処理方法及び電子部品用治具 |
JP4180906B2 (ja) * | 2002-12-17 | 2008-11-12 | 株式会社エンプラス | コンタクトピン,コンタクトピン成形方法及び電気部品用ソケット |
JP4237485B2 (ja) | 2002-12-27 | 2009-03-11 | 株式会社エンプラス | 電気部品用ソケット |
US7195507B2 (en) * | 2003-08-06 | 2007-03-27 | Yamaichi Electronics U.S.A., Inc. | Socket apparatus with actuation via pivotal motion |
JP4098231B2 (ja) * | 2003-12-19 | 2008-06-11 | 山一電機株式会社 | 半導体装置用ソケット |
JP4312685B2 (ja) * | 2004-08-31 | 2009-08-12 | 山一電機株式会社 | 半導体装置の着脱方法、それが用いられる半導体装置の着脱装置、および半導体装置用ソケット |
US7121860B2 (en) * | 2004-09-02 | 2006-10-17 | Micron Technology, Inc. | Pinch-style support contact, method of enabling electrical communication with and supporting an IC package, and socket including same |
KR100629958B1 (ko) * | 2005-01-15 | 2006-09-28 | 황동원 | 반도체용 테스트 및 번인을 위한 비지에이형 소켓 |
DE102005007593B4 (de) * | 2005-02-18 | 2008-05-29 | Qimonda Ag | Sockel-Vorrichtung zum Testen von Halbleiter-Bauelementen und Verfahren zum Aufnehmen eines Halbleiter-Bauelements in einer Sockel-Vorrichtung |
JP4471941B2 (ja) | 2005-03-10 | 2010-06-02 | 山一電機株式会社 | 半導体装置用ソケット |
JP4767741B2 (ja) * | 2006-04-13 | 2011-09-07 | 株式会社エンプラス | 電気部品用ソケット |
JP4802059B2 (ja) * | 2006-07-27 | 2011-10-26 | 株式会社エンプラス | 電気部品用ソケット |
JP4495200B2 (ja) | 2007-09-28 | 2010-06-30 | 山一電機株式会社 | 半導体装置用ソケット |
JP2010118275A (ja) | 2008-11-13 | 2010-05-27 | Yamaichi Electronics Co Ltd | 半導体装置用ソケット |
US7988500B2 (en) * | 2009-12-16 | 2011-08-02 | Sensata Technologies Massachusetts, Inc. | Socket and contact having anchors |
CN201667414U (zh) * | 2010-04-07 | 2010-12-08 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
JPWO2013061486A1 (ja) * | 2011-10-26 | 2015-04-02 | ユニテクノ株式会社 | コンタクトプローブおよびそれを備えた検査ソケット |
CN108627712B (zh) * | 2017-03-17 | 2021-02-02 | 泰科电子(上海)有限公司 | 载具 |
US10559920B1 (en) * | 2018-08-07 | 2020-02-11 | Te Connectivity Corporation | Card edge connector having improved mating interface |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4630875A (en) * | 1984-07-02 | 1986-12-23 | Amp Incorporated | Chip carrier socket which requires low insertion force for the chip carrier |
US5213531A (en) * | 1990-05-14 | 1993-05-25 | Yamachi Electric Co., Ltd. | Connector |
US5123855A (en) * | 1991-04-26 | 1992-06-23 | Minnesota Mining And Manufacturing Company | Zero insertion force connector for printed circuit boards |
JP2665419B2 (ja) * | 1991-08-13 | 1997-10-22 | 山一電機株式会社 | 電気部品用接続器 |
US5482471A (en) * | 1993-02-24 | 1996-01-09 | Texas Instruments Incorporated | Socket apparatus for IC package testing |
GB2286490A (en) * | 1994-02-10 | 1995-08-16 | Hsu Fu Yu | Contact for ZIF socket |
JP2620525B2 (ja) * | 1994-09-08 | 1997-06-18 | 山一電機株式会社 | 球面形バンプとの接触構造 |
JP3518091B2 (ja) * | 1995-09-25 | 2004-04-12 | 株式会社エンプラス | Icソケット |
-
1997
- 1997-07-04 JP JP19505597A patent/JP3270716B2/ja not_active Expired - Fee Related
-
1998
- 1998-06-03 US US09/089,612 patent/US6027355A/en not_active Expired - Lifetime
- 1998-06-23 SG SG1998001496A patent/SG78301A1/en unknown
- 1998-06-29 TW TW087110420A patent/TW398061B/zh not_active IP Right Cessation
- 1998-07-02 KR KR10-1998-0026543A patent/KR100380669B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP3270716B2 (ja) | 2002-04-02 |
JPH1126126A (ja) | 1999-01-29 |
KR19990013529A (ko) | 1999-02-25 |
US6027355A (en) | 2000-02-22 |
KR100380669B1 (ko) | 2003-07-16 |
TW398061B (en) | 2000-07-11 |
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