TW564578B - Socket apparatus and method for removably mounting an electronic package - Google Patents
Socket apparatus and method for removably mounting an electronic package Download PDFInfo
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- TW564578B TW564578B TW090126219A TW90126219A TW564578B TW 564578 B TW564578 B TW 564578B TW 090126219 A TW090126219 A TW 090126219A TW 90126219 A TW90126219 A TW 90126219A TW 564578 B TW564578 B TW 564578B
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- contact
- pin
- base
- receiving hole
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/15—Pins, blades or sockets having separate spring member for producing or increasing contact pressure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/912—Electrical connectors with testing means
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
564578 A7 五、發明說明(/) 經濟部智慧財產局員工消費合作社印製 【發明領域】 本發明一般而言係關於可移除式安裝例如包含積體電 路之封裝之電子封裝之插座,用以執行此種封裝之電性測 试,本發明尤有關將這種電子封裝之每個導電接點電連接5至插座中之各個引線以供更進一步地連接至測試設備之插 座。【發明背景】1C晶片已以巧脂密封的IC(積體電路,integrated circuit)封衣通φ會接受稱為老化測試(burn_in 之可靠Η)度測試,用以將它們分類成令人滿意與不令人滿意的產品° 圖13(a)-13(d)顯示一種使用於供具有BGA(球形柵極 陣列,Ball Grid Array)接點之電子封裝用的老化測試之已 知插座101之一例。插座1〇1具有一個正方形基底1〇2, 於其中安裝有複數個接腳104以供BGA封裝1〇〇之各個 焊球100a之壓接。每個接腳104係由延長的金屬構件所 構成,而一對臂部104a與l〇4b係設置於接腳1〇4之一端。 能夠承載BGA封裝100之滑座105係安裝於基底1〇2上 以供其朝水平方向(X方向)移動。滑座1〇5係適合於經由 接腳容納孔105a以容納接腳1〇4。如圖13(a)、13(b)所示, 用以谷納每個焊球100a之各個球體容納孔1〇5c,係以與 接腳容納孔105a交叉之方式形成於滑座1〇5之底座1〇讣 上。又,如圖13(b)所示,滑座1〇5之各個啣接部件1〇兄 係形成於接腳容納孔l〇5a之内面,用以與各個接腳ι〇4 15 20564578 A7 V. Description of the invention (/) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics [Field of the Invention] The present invention is generally related to the removable mounting of an electronic package socket such as a package containing integrated circuits, for To perform the electrical test of such a package, the present invention is particularly related to electrically connecting each of the conductive contacts of this electronic package 5 to respective leads in the socket for further connection to the socket of the test equipment. [Background of the Invention] IC (integrated circuit) ICs that have been sealed with smart grease on 1C chips are subjected to a degree of test called burn_in, which is used to classify them into satisfactory and Unsatisfactory product ° Figures 13 (a) -13 (d) show an example of a known socket 101 used for burn-in testing of electronic packages with BGA (Ball Grid Array) contacts . The socket 101 has a square base 102, and a plurality of pins 104 are mounted therein for crimping each solder ball 100a of the BGA package 100. Each of the pins 104 is formed by an extended metal member, and a pair of arm portions 104a and 104b are provided at one end of the pin 104. The slider 105 capable of carrying the BGA package 100 is mounted on the base 102 for its movement in the horizontal direction (X direction). The slider 105 is adapted to receive the pin 104 via the pin receiving hole 105a. As shown in Figs. 13 (a) and 13 (b), each ball receiving hole 105c for receiving each solder ball 100a is formed in the slider 105 in a manner to intersect with the pin receiving hole 105a. On the base 10 讣. Also, as shown in FIG. 13 (b), each of the engaging members 10 of the slider 105 is formed on the inner surface of the pin accommodating hole 105a, and is used to connect with each of the pins 0415 20
91. 1. 3,000 !!/—!1 - I I I I I — I β (請先閱讀背面之注意事項再填寫本頁) 564578 A7 B7 15 經濟部智慧財產局員工消費合作社印製 20 五、發明說明(乂 之臂部104a喻接。用以操作滑座1〇5之上蓋ι〇6係設置 於基底102上,用以藉由壓縮螺旋彈菁1〇7而朝向與遠離 基底102移動。 在上述之插座中,如果將上蓋1〇6向下壓,則滑座ι〇5 會朝x+方向移動,導致接腳104之臂部1〇4a與滑座1〇5 之啣接部件105d啣接,藉以以彎折狀態朝又+方向打開 接腳。於此情況下,當BGA封裝1〇〇下降至滑座1〇5之 底座l〇5b之上時,BGA封裝1〇〇之每個烊球i〇〇a係容 納於各個球體容納i 105c中。當提高上蓋1〇6時,滑座 105係藉由接腳104之臂部104a的力量而朝方向回復 原狀。因此,每個臂部104a會接觸到各個焊球100a,同 時其他#邛104b會在其被焊球i〇〇a推出時朝χ_方向彎 曲。每對臂部104a與l〇4b夾住一個焊球1〇〇a,俾能使 BGA封裝之每個焊球100a電連接至接腳1〇4。 在上述配置中,臂部l〇4a與i〇4b係與臂部104a之 開啟和藉由臂部l〇4a與l〇4b兩者對焊球100a之固定相 關聯地移動。因此,已需要提供足夠大之區域,以順應臂 部104a與l〇4b在滑座1〇5之底座i〇5b中之移動量。因 為對於接腳104可多麼緊密地配置有物理限制,所以對 於具有已以更微小間距配置之焊球的BGA封裝而言,難 以使用習知插座101 〇 【發明之概述】91. 1. 3,000 !! / —! 1-IIIII — I β (Please read the notes on the back before filling this page) 564578 A7 B7 15 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 20 V. Description of the Invention The upper cover 106 of the slide base 105 is arranged on the base 102 for moving toward and away from the base 102 by compressing the spiral elastic cyan 107. In the above socket, if the upper cover 106 is downward Press, the slider ι〇5 will move in the x + direction, causing the arm 104a of the pin 104 to be engaged with the engaging member 105d of the slider 105, thereby opening the pin in the + direction in a bent state. In this case, when the BGA package 100 is lowered above the base 105b of the slider 105, each ball i00a of the BGA package 100 is accommodated in each sphere to accommodate 105c Middle. When the upper cover 106 is raised, the slider 105 returns to the original state by the force of the arm portion 104a of the pin 104. Therefore, each arm portion 104a will contact each solder ball 100a, and the other # 邛104b will bend in the χ_ direction when it is pushed out by the solder ball i〇〇a. Each pair of arms 104a and 104b clamp a solder ball 1 〇a, 俾 can make each solder ball 100a of the BGA package be electrically connected to the pin 104. In the above configuration, the arm portions 104a and 104b are opened with the arm portion 104a and by the arm portion l Both 〇4a and 104b move in association with the fixation of the solder ball 100a. Therefore, it is necessary to provide a large enough area to conform to the arms 104a and 104b in the base 105b of the slider 105. The amount of movement. Because there are physical restrictions on how closely the pins 104 can be arranged, it is difficult to use the conventional socket 101 for a BGA package with solder balls that have been arranged at a finer pitch. [Summary of the Invention]
本發明之一個目的係用以解決習知技術之上述問題。 本發明之另一個目的係提供一種適合與更微小間距之IC 91. 1. 3,000 . .--訂·-------- (請先«讀背面之注意事項再填寫本頁) 564578 五、發明說明( 15 20 封裝一起使用之插座。 簡言之’依據本發明之較佳實施例所製造之插座,係 用以可移除地容納具有依據選定圖案配置之接點之電子零 件’此插座包含插座基底,其具有對應於選定圖案所配置 之複數個接腳,每個接腳都具有能接觸電子零件之接點之 懸臂式接腳臂。能相對於插座基底而朝水平方向移動之滑 座,係可滑動地安裝於基底上,並具有複數個對應至接腳 臂之位置之接腳容納貫通孔。貫通孔之牆壁之配置,係能 使它們不會施加任^偏壓至接腳臂,以使之可作用為自由 端。滑座亦具有接點容納孔,用以容納接點並與貫通孔連 通。當滑座位於選定位置時,接點可容納於接點容納孔中, 而當滑座位於另-選定位置時,臂部可靈活地與接點容納 孔中之接點連接。 依據本發明之一項特徵,每個接腳係具有單一接腳 !在之爾之一對臂部,並且電子零件之接點 係在》月座移動時⑽於接點容納孔中,藉固定這個接點在牆壁(亦即,在接& & -如士鞛由 表_接腳之臂部之二,接 因此,在清座(對應至在適當===個接點。 逵桩夕啻工帝从 、田刀里之下所欲與接腳之臂部 ΪΓΐ: 點所需要之移動範圍)上,僅需要提 習知技術所設置之面積。因此,可容納具有小於 依據本發明之另一項特徵,係設有上蓋,1::: 向或"離插座基底之方向移動。上蓋具有能,接滑 ------- 訂--------- (請先閲讀背面之注意事項再填寫本頁) -0 ^紙張尺度通用中國國家標玉(Lm)A4規格⑽χ撕來 91· 1. 3,000 564578 A7 B7 五、發明說明(从 接部,當倾部與滑騎接時,滑座會沿著如上蓋移動朝 :或遠離插座基底之選定方向移動。依據本發明,只有在 ,、電子零件之接點喻接時,接腳才會弯曲,藉以增進接腳 之耐久性。依據本發明之另一項特徵,接點容納孔之接點 _接表面可以疋圓柱形表面,或其可被設計成更符合與插 座》起使用之電子零件之接點的表面形狀(例如,對於焊 球接點而言為部分球狀)。 依據本發明之1徵,接腳臂之接觸部可具有凸部,譬 如具有-對隔開凸‘之螯狀凸冑,這些凸部係沿著選定方 10向延伸,俾能在安裝時,使它們延伸朝向接點喻接表面。 因此’即使在僅使用單-臂部時,接腳可穩固地與在相當 於複數個臂部接腳面積之接觸面積中之電子零件之接點連 接。 依據又另一種特徵,接腳臂之接觸部係配置成與位於 15電子零件之側面(接點係由此延伸)上之接點之根部接觸。 當與具有BGA封裝(具有球形接點)之電子零件一起使用 時,接腳臂之接觸部係與在封裝之下表面與接點之那部分 (於此處之直徑變成相對於平行於封裝之下表面之平面為 最大值)之間的接點σ卸接。 !〇 依據本發明之實施例之另一項特徵,具有用以運送電 子零件之固定與釋放部件之夾具係可朝向與遠離插座移 動,並可用以移動上蓋或不具有上蓋之插座之滑座。 本發明之額外目的與特徵,將部分揭露於以下之說明 中’且部分將是從說明中得以顯而易見的。利用於以下的 6 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) """丨丨丨—‘丨丨-1!^ ·丨丨丨·丨丨丨·線·- (請先閲讀背面之注意事項再填窝本頁)An object of the present invention is to solve the above problems of the conventional technology. Another object of the present invention is to provide an IC suitable for finer pitches. 91. 1. 3,000... Ordering ---------- (please «read the notes on the back side before filling out this page) 564578 V. Description of the invention (15 20 sockets used together in a package. In short, 'sockets manufactured according to a preferred embodiment of the present invention are used to removably accommodate electronic components having contacts configured according to a selected pattern' The socket includes a socket base, which has a plurality of pins configured corresponding to the selected pattern, and each pin has a cantilevered pin arm that can contact the contact point of the electronic component. It can move horizontally relative to the socket base The sliding seat is slidably mounted on the base and has a plurality of pin receiving through holes corresponding to the positions of the pin arms. The walls of the through holes are configured so that they will not apply any bias to The foot arm can be used as a free end. The slider also has a contact receiving hole for receiving the contact and communicating with the through hole. When the slider is at the selected position, the contact can be received in the contact receiving hole Medium, and when the slider is located When the position is fixed, the arm can be flexibly connected with the contact in the contact receiving hole. According to a feature of the present invention, each pin has a single pin! One of the pair of arms and electronic parts The contact point is held in the contact receiving hole when the moon seat is moved. By fixing the contact point on the wall (that is, the connection between the & & Therefore, in Qingzao (corresponds to the appropriate === contacts. 逵 啻 啻 啻 the emperor ’s desire, and the arm of the pin ΪΓΐ: the movement range required by the point), It is only necessary to mention the area set by the known technology. Therefore, it can accommodate another feature smaller than that according to the present invention, and is provided with an upper cover, which is 1 ::: moved in the direction of " from the base of the socket. Slip ------- Order --------- (Please read the precautions on the back before filling this page) -0 ^ Paper size General Chinese National Standard Jade (Lm) A4 Specification ⑽χTear 91 · 1. 3,000 564578 A7 B7 V. Description of the invention (From the connection part, when the tilting part is connected with the rider, the slide will move along the upper cover toward: or away from the socket base In the selected direction, according to the present invention, only when the contacts of the electronic parts are connected, the pins will be bent, thereby improving the durability of the pins. According to another feature of the present invention, the contact receiving holes Contacts_The contact surface can be a cylindrical surface, or it can be designed to more closely conform to the surface shape of the contacts of electronic parts used in sockets (for example, the part is spherical for solder ball contacts). According to one aspect of the present invention, the contact portion of the leg arm may have a convex portion, for example, a chevron-shaped projection having a pair of spaced projections. These projections extend along the selected direction in 10 directions. They extend toward the contact surface. Therefore, even when only one-arm portion is used, the pin can be firmly connected to the contact point of the electronic component in the contact area equivalent to the area of the plurality of arm pins. According to yet another feature, the contact portion of the leg arm is configured to contact the root of a contact located on the side of the 15 electronic component (the contact is extended therefrom). When used with an electronic part with a BGA package (with ball contacts), the contact portion of the pin arm is the same as the portion below the package and the contact (the diameter here becomes relative to the parallel to the package) The contact surface σ between the plane of the lower surface is the maximum value). According to another feature of the embodiment of the present invention, the fixture having the fixing and releasing parts for transporting electronic parts can be moved toward and away from the socket, and can be used to move the sliding seat of the socket with or without the socket. Additional objects and features of the present invention will be partially disclosed in the following description 'and some will be apparent from the description. The following 6 paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) " " " 丨 丨 丨 '' 丨 丨 -1! ^ · 丨 丨 丨 丨 丨 丨 ·· Line ·-(Please read the notes on the back before filling this page)
91. 1. 3,C 56457891. 1. 3, C 564578
五、發明說明(5 經濟部智慧財產局員工消費合作社印製 申請專利範圍中詳細指出之手段、組合與方法,可能實現 與獲得本發明之目的與優點。 【圖式之簡單說明】 併入且構成說明書之一部分之附圖,係顯示本發明之 5 較佳實施例。在附圖中: 圖1係為顯示依據本發明第一較佳實施例之插座之基 本構造的俯視平面圖; 圖2係為顯示圖· 1之插座與固定夾具之電子零件的前 視圖,而夾具係以‘剖面顯示; 10 圖3係為沿著圖1之線A-A之剖面圖; 圖4係為沿著圖1之線之剖面圖; 圖5(a)與5(b)係分別為圖i_4之插座的接腳之尖端部 分之放大分解前視圖與側視圖; 圖5(c)係為顯示接腳、接腳容納孔與位於圖1之p的 15接點容納孔之間的位置關係之放大俯視平面圖; 圖5(d)係為顯示接腳、接腳容納孔與位於圖4之q 的接點谷納孔之間的位置關係之放大分解前視圖; 圖6係為顧示具有處於下降位置之上蓋之插座之前視 圖; 20 圖7係為圖6之剖面圖; 圖8係為類似於圖6之剖面圖,但以在插座之上之虛 線與安裝插座中之實線顯示電子零件; 圖9係為類似於圖7之剖面圖,但顯示處於上升位置 之上蓋的插座; 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 91. 1. 3,000 ---,1--<------i丨丨—ί丨訂ί丨丨!丨丨-線^1^· (請先閱讀背面之注意事項再填寫本頁)V. Description of the invention (5 The means, combinations, and methods detailed in the scope of patent application for printing by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs may achieve and obtain the objects and advantages of the present invention. [Simplified description of the drawings] The drawings constituting a part of the description show the fifth preferred embodiment of the present invention. In the drawings: FIG. 1 is a top plan view showing the basic structure of a socket according to the first preferred embodiment of the present invention; In order to show the front view of the socket and the electronic components of the fixing fixture shown in Figure 1, the fixture is shown in a 'section; 10 Figure 3 is a sectional view taken along line AA of Figure 1; Figure 4 is a sectional view taken along Figure 1 Sectional view of the line; Figures 5 (a) and 5 (b) are enlarged front and side views of the tip portion of the pin of the socket of Figure i_4, respectively; Figure 5 (c) shows the pins and pins An enlarged top plan view of the positional relationship between the receiving hole and the 15-contact receiving hole located at p in FIG. 1; FIG. 5 (d) is a diagram showing the pin, the pin receiving hole, and the contact valley located at q in FIG. 4 An enlarged and exploded front view of the positional relationship between the holes; Figure 6 is Gu shows the front view of the socket with the upper cover in the lowered position; Figure 7 is a sectional view of Figure 6; Figure 8 is a sectional view similar to Figure 6, but with the dashed line above the socket and the actual installation in the socket Line shows electronic parts; Figure 9 is a cross-sectional view similar to Figure 7, but showing the socket in the upper position of the cover; This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 91. 1. 3,000 ---, 1-< ------ i 丨 丨 —ί 丨 Orders 丨 丨! 丨 丨 -line ^ 1 ^ · (Please read the precautions on the back before filling this page)
564578 五、發明說明( 圖10(a)係為顯示接腳、接腳容納孔與圖7之接點容 納孔之間的位置關係之放大分解前視圖; 圖10(b)係為顯示接腳、接腳容納孔與圖8之接點容 納孔之間的位置關係之放大分解前視圖; 5 圖l〇(c)係為顯示接腳、球體容納孔與圖9所示之接 腳容納孔之間的位置關係之放大分解前視圖: 圖11(a)、11(b)與11(c)、11(d)係分別為放大分解前 視圖與側視圖,其顯示依據本發明之其他接腳之接腳螯; 圖12係為顯示依據本發明之變化的滑座之接點啣接 表面之放大分解前視圖; 圖13(a)係為依據習知技術所製成之插座之俯視平面 圖, 圖13(b)係為沿著圖13(a)之線C-C之剖面圖,其顯 示將要被安裝之電子零件; 15 圖l3(c)係為類似於圖13(b)之視圖,但顯示容納於插 座中之電子零件;以及 圖13(d)係為圖13(a)之放大部分。 【發明之詳細說明】 如圖2所示,這個較佳實施例之電子零件安裝裝置j 20係用以安裝已依據選定圖案而在上面配置有球形焊球(接 點)2a之BGA封裝(電子零件,以下稱為”封裝")。安裝裝 置包含插座10以及與插座10成對準關係配置之夹具5〇, 其乃用以移動插座之滑座。插座10具有主要插座本體或 基底11與上蓋14,其中基底π係由例如聚醚硫亞氨 8 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) —/------,—訂---------線 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 91. 1. 3,000 564578 A7564578 V. Description of the invention (Figure 10 (a) is an enlarged and exploded front view showing the positional relationship between the pin, the pin receiving hole and the contact receiving hole of FIG. 7; Figure 10 (b) is a display pin An enlarged and exploded front view of the positional relationship between the pin receiving hole and the contact receiving hole in FIG. 8; FIG. 10 (c) is a view showing the pin, the ball receiving hole and the pin receiving hole shown in FIG. 9. The enlarged and exploded front views of the positional relationship among the figures: Figures 11 (a), 11 (b), 11 (c), and 11 (d) are enlarged and exploded front and side views, respectively, showing other connections according to the present invention. Figure 12 is an enlarged and exploded front view showing a contact interface of a slider in accordance with a variation of the present invention; Figure 13 (a) is a top plan view of a socket made in accordance with conventional technology Fig. 13 (b) is a cross-sectional view taken along line CC of Fig. 13 (a), which shows the electronic parts to be installed; 15 Fig. 13 (c) is a view similar to Fig. 13 (b), but 13 (d) is an enlarged part of FIG. 13 (a). [Detailed description of the invention] As shown in FIG. 2, this is a better embodiment. The electronic component mounting device j 20 of the embodiment is used for mounting a BGA package (electronic component, hereinafter referred to as "package") having a spherical solder ball (contact) 2a disposed thereon according to a selected pattern. The mounting device includes a socket 10 and a fixture 50 arranged in an alignment relationship with the socket 10, which is a sliding seat for moving the socket. The socket 10 has a main socket body or a base 11 and an upper cover 14, wherein the base π is made of, for example, polyetherthioimide This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) — / ------, — Order --------- line (please read the precautions on the back before filling (This page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 91. 1. 3,000 564578 A7
經濟部智慧財產局員工消費合作社印製 (polyether imide)之適當樹脂材料所構成,而上蓋14具有 呈中心配置的電子零件取用開口部並且能夠垂直移動朝向 與遠離基底11。基底11係適合被固定於例如印刷基板之 配線基板上(未顯示在附圖中)。基底具有大致為正方形之 5底部lla,以及包圍底部lla並和底部Ua形成中央間隔 或空穴之牆壁lib。多數個延長接腳13係設置於基底^ 之底部1U,並與封裝2之焊球2a之圖案對應一致,如 圖1與4所示。突出固定部分m(參見圖4)係形成於接 腳13之兩末端的中間,而當將固定部分nb容納於基底 川11之開Π部時,接腳係以—種朝向㈣於基底U之底部 的垂直方向延伸之筆直狀態受到固定。The Intellectual Property Bureau of the Ministry of Economic Affairs is composed of an appropriate resin material printed by a consumer cooperative, and the upper cover 14 has a centrally located opening for electronic parts, and can move vertically toward and away from the substrate 11. The substrate 11 is adapted to be fixed to a wiring substrate such as a printed substrate (not shown in the drawings). The base has a substantially square bottom 5a, and a wall lib surrounding the bottom 11a and forming a central space or cavity with the bottom Ua. The plurality of extension pins 13 are disposed on the bottom 1U of the substrate ^ and correspond to the patterns of the solder balls 2a of the package 2, as shown in Figs. The protruding fixing portion m (see FIG. 4) is formed in the middle of both ends of the pin 13, and when the fixing portion nb is accommodated in the opening portion of the base 11, the pin is oriented in a direction of the base U The vertical state of the bottom extending vertically is fixed.
,與習知技術成對比的是,每個接腳13之懸臂固定架 尖端部分並不具有—對彼此朝向並遠離移動之臂部。於本 t施例中,每個接腳13係設有臂冑13&,其可朝向一個 μ扣不方向彈性變形,而每個接腳之配置方式,乃使臂部… 變形之方向將平行於基底11之-側面之方向(圖1之方向 參考圖1,水平方向於此係稱為χ方向,而垂直於X 方向之方向被稱為γ方向。垂直於[與Y方向之方向係 20 稱為Z方向。 八參考圖1或圖4,滑座12係設置於基底n之底部部 a上的二間中,並適合於朝向在第一與第二端之間的 方向而在底部部分lla上滑動。平的承載部或 底座12a 成於滑座12之表面上’於該處可置放封裝2。能容 . 严 -------—--------^ Aw (請先《讀背面之注意事項再填寫本頁) 9 564578 A7 五、發明說明(Υ ) (請先閲讀背面之注意事項再填寫本頁) 納封裝之焊球2a之多數個接點容納孔12b,係與封裝2 之特定焊球圖案對應一致地設置於底座12a中。如圖5(勾 與5(d)所示,每個接點容納孔12b係為圓柱狀,俾能形成 接點啣接表面12c。開孔12b之直徑係大於球體2a之外 5裣,而其冰度係大於焊球之高度。接腳容納孔12d係形成 於滑座12中以容納接腳13,且與從基底n延伸之每個 接腳13之位置對應一致,而每個接腳容納孔l2d係與各 個接點谷納孔12b合併且相連通。每個接腳容納孔12d都 疋長方形之貫通孔,而其縱側係朝向滑座12之χ方向延 ίο伸。每個接腳之臂部13a係安置於貫通孔12d中,並可相 對於各個接點容納孔12b内部之位置移動。在χ方向之 每個接腳容納孔12d之長度係大約等於或略大於滑座12 之移動量。母個接腳13係適合於維持其從基底丨〗延伸之 筆直直立方向且在滑座朝χ方向的整個移動期間都不會 I5 碰觸到滑座12之側面。 經濟部智慧財產局員工消費合作社印製 每個接腳13之臂部I3a係容納於接腳容納孔12d中, 並配置成面對接點容納孔12b之接點啣接表面12c。如圖 5(a)、5(b)所示,能夠啣接焊球2a之表面之一部分的接腳 螯13c’當將接腳安裝於基底時,係藉由朝向χγ表面上 20之兩個選定方向分支但通常朝向接點啣接表面,以於臂部 13a尖端形成銳角。 如圖5(d)所示,當滑座位於一端(使接腳位於封閉位 置)時’在接腳13之接腳螯13c與滑座12之各個接點啣 接表面12c之間之χ方向之距離,係設定成小於焊球 10 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公31 ) 91. 1. 3,000 564578 A7 B7 五、發明說明( 15 20 =之直徑之數值。當滑座12已朝χ+方向移動指定數量 :、’滑座12之接點容納孔⑽會開啟,其結果是距離變 dl其乃大於焊球2a之直徑的距離。當滑座12朝 方向=動且焊球2a係容納於接點容納孔m中時,焊球 係被彈地固疋在接點★接表面l2e與接腳丨3之接腳聲 13之間。此外,接腳13係能產生適當的力量,此乃取決 於它們的形狀與所使甩之材料。此外,亦可能將經由接腳 螯13C傳輸之力量設定成適合刺入焊球2a之數值。 關於在Z方向i接腳13之接腳f…之位置與滑座 之底座12a之尚度之間的關係,接腳螯13e最好是配 置^略微在焊球2a之中央部分之上,俾能使接腳螯可命 接焊球2a之根部,亦即,在焊球以在平行於封裝2之下 表面之平面中具有它們最大直徑之區域與具有封裝之蟬球 之連接位置之間的那個部分。 如圖1或圖4所示,在滑座12之底座12a之外周邊 邛分上之導引牆壁部分12e,係設有一個傾斜之導引面 以將封裝2引導至底座i2a。 如圖4所示,上蓋14於兩個對向側上具有朝z方向 I伸之運動限制啣接構件〗4a,並於其末端形成閉鎖。每 個構件14a之閉鎖係與形成於基底11上之啣接凸部llc 啣接,以限制上蓋遠離基底之運動。上蓋14係適合於移 動朝向基底11,直到其下表面碰觸基底之牆壁llb之上 表面為止。參考圖3,具有例如彎曲的凸狀表面(如所示) 之選定表面之複數個凸輪構件14b,係設置於上蓋14之 I__ 11 Ϊ紙張尺度適財關冢標準(CNS)A4規格⑽χ 297公爱In contrast to the conventional technique, the tip portion of the cantilever holder of each pin 13 does not have-the arms facing toward each other and away from the moving arm. In this embodiment, each pin 13 is provided with an armrest 13 & which can be elastically deformed in a direction of a μ buckle, and the configuration of each pin is such that the arm portion ... the direction of deformation will be parallel The direction of the -side of the substrate 11 (refer to Figure 1 for the direction of Figure 1, the horizontal direction is referred to as the χ direction, and the direction perpendicular to the X direction is referred to as the γ direction. The direction perpendicular to the [and Y direction is 20 It is referred to as the Z direction. With reference to FIG. 1 or FIG. 4, the slide base 12 is provided in the two rooms on the bottom portion a of the base n, and is adapted to face the direction between the first and second ends in the bottom portion. Sliding on lla. The flat load-bearing part or base 12a is formed on the surface of the slide base 12 where the package 2 can be placed. Capable. Strict ------------------- ^ Aw (Please read the “Notes on the back side before filling out this page”) 9 564578 A7 V. Description of the invention (Υ) (Please read the “Notes on the back side before filling out this page”) Most of the contacts of the packaged solder ball 2a can be accommodated The hole 12b is provided in the base 12a corresponding to the specific solder ball pattern of the package 2. As shown in FIG. 5 (hook and 5 (d), each contact receiving hole 12b is a circle) Columnar, 俾 can form the contact interface 12c. The diameter of the opening 12b is larger than 5 裣 outside the sphere 2a, and the ice degree is larger than the height of the solder ball. The pin receiving hole 12d is formed in the slide 12 To accommodate the pins 13 and correspond to the position of each pin 13 extending from the base n, each pin receiving hole 12d is combined with and communicates with each of the contact valley holes 12b. Each pin receives The holes 12d are rectangular through holes, and their longitudinal sides extend toward the χ direction of the slide base 12. The arm portions 13a of each pin are placed in the through holes 12d and can accommodate the holes with respect to the respective contacts. The position inside 12b is moved. The length of each pin receiving hole 12d in the χ direction is approximately equal to or slightly larger than the amount of movement of the slide 12. The female pins 13 are suitable for maintaining its upright extension from the base. Direction and during the entire movement of the slider in the χ direction, I5 will not touch the side of the slider 12. The employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints the arm I3a of each pin 13 to be accommodated in the pin. In the hole 12d and configured to face the contact engagement table of the contact receiving hole 12b 12c. As shown in Figs. 5 (a) and 5 (b), the pin 13c 'which can be connected to a part of the surface of the solder ball 2a, when the pin is mounted on the substrate, it is oriented toward the Branches in two selected directions but usually face the contact interface surface to form an acute angle at the tip of the arm 13a. As shown in Figure 5 (d), when the slide is at one end (making the pin in the closed position), The distance in the χ direction between the pin 13c of 13 and the contact surface 12c of each contact of the slide 12 is set to be less than the solder ball 10. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 male) 31) 91. 1. 3,000 564578 A7 B7 V. Description of the invention (15 20 = the numerical value of the diameter. When the slide base 12 has moved a specified amount in the direction of χ + :, the contact receiving hole ⑽ of the slide base 12 is opened, and as a result, the distance becomes dl which is larger than the diameter of the solder ball 2a. When the slide 12 moves in the direction = moving and the solder ball 2a is received in the contact receiving hole m, the solder ball is elastically fixed to the contact ★ between the contact surface l2e and the contact sound 13 of the contact 3 . In addition, pins 13 can generate appropriate strength, depending on their shape and the materials used. In addition, it is also possible to set the power transmitted through the pin 13C to a value suitable for penetrating the solder ball 2a. Regarding the relationship between the position of the pin f ... of the i pin 13 in the Z direction and the reliability of the base 12a of the slider, the pin 13e is preferably arranged ^ slightly above the central portion of the solder ball 2a, 俾It is possible to make the prongs connect to the roots of the solder ball 2a, that is, between the area where the solder balls have their maximum diameter in a plane parallel to the lower surface of the package 2 and the connection position of the packaged cicada ball That part. As shown in FIG. 1 or FIG. 4, the guide wall portion 12e on the outer periphery of the base 12a of the slide base 12 is provided with an inclined guide surface to guide the package 2 to the base i2a. As shown in FIG. 4, the upper cover 14 has a movement-restricting engagement member 4a extending in the z-direction I on two opposite sides, and a latch is formed at its ends. The latch of each member 14a is engaged with the engaging protrusion 11c formed on the base 11 to restrict the movement of the upper cover away from the base. The upper cover 14 is adapted to be moved toward the base 11 until its lower surface touches the upper surface of the wall 11b of the base. Referring to FIG. 3, a plurality of cam members 14b having a selected surface, such as a curved convex surface (as shown), are provided on the upper cover 14 of I__ 11 Ϊ paper size suitable financial standard (CNS) A4 specifications ⑽χ 297 male Love
<請先閱讀背面之注意事項再填寫本頁) -------—訂---------線·- 564578 15 20 A7 五、發明說明(β ) 每個角落以移動滑座12。與凸輪構件合作的是,從動啣 接部件12g係設置於滑座12之外周邊上,用以與上蓋之 凸輪構件14b喻接。具有帛z #向延伸之縱軸線的複數 個第二壓縮螺旋彈簧15,係設置在上蓋14與基底u之 5 =當沒有外力施加在上蓋14上時,來自第—壓縮螺旋 彈普15之力量將上蓋移動至舉昇位置,而喻接構件w 之閉鎖係與基底u之㈣凸部Ue喻接。具有朝X方向 延伸之縱軸線的複數個第二壓縮螺旋彈簧16,係設置在 滑座12與基底之間。#沒有外力施加在上蓋且以χιό 方向之來自每一個第二壓縮螺旋彈簧 16之力量時 ,滑座 12剑壁llb喻接於基底之乂_側,且滑座12之從動喻 接部件12g係與上蓋14之凸輪構件Mb喻接。 如圖2所示,用以操作滑座之夾具50係具有可沿著 z方向朝向與遠離插座1G移動之頭部51,並具有形成於 夾具(適合與上蓋U喻接)之插座1()面上之顿表面〜 ^部52係裝設於頭部,當希望時,此頭部可藉由例如 吸力之適當裝置以固定封裝2。 ^上述之本實施财,㈣定封裝2之夾具% 向降下,藉以使夹具之喻接表面53與上蓋i4*接。 續朝下運動導致上蓋14朝Z+方向移動,以對抗 ί 一,螺旋彈箦15與第二屡縮螺旋彈簧所提供之乂 二杜到上盍14與基底U轉為止’如圖6所示。當覆 所ΙΓ,從動⑽部件12g係由覆蓋構件之凸 輪杨所限制導引’藉以使滑座12朝&方向移動以對 I_____ 12 本紙張尺度適財四驛播準(CNS)A規格⑵^ χ挪公爱) 91. 1· 3,000< Please read the notes on the back before filling this page) -------- Order --------- line · -564578 15 20 A7 V. Description of the invention (β) Move the slide 12. In cooperation with the cam member, the driven engagement member 12g is provided on the outer periphery of the slide base 12 to be connected with the cam member 14b of the upper cover. A plurality of second compression coil springs 15 with a longitudinal axis extending in the direction of 帛 z # are arranged on the upper cover 14 and the base 5 = the force from the first compression spiral bomb 15 when no external force is applied to the upper cover 14 The upper cover is moved to the lifted position, and the locking of the joint member w is jointed with the convex portion Ue of the base u. A plurality of second compression coil springs 16 having a longitudinal axis extending in the X direction are disposed between the slide base 12 and the base. #When no external force is applied to the upper cover and the force from each second compression coil spring 16 in the direction of χιό, the sliding wall 12b of the slide 12 is connected to the side of the base, and the follower of the slide 12 is 12g It is connected to the cam member Mb of the upper cover 14. As shown in FIG. 2, the clamp 50 for operating the slide base has a head 51 that can be moved toward and away from the socket 1G in the z direction, and has a socket 1 () formed in the clamp (suitable for connection with the upper cover U) The top surface 52 on the surface is attached to the head. When desired, this head can be fixed to the package 2 by a suitable device such as suction. ^ In the above implementation, it is determined that the fixture% of the package 2 is lowered downwards, so that the figurative connection surface 53 of the fixture is connected to the upper cover i4 *. Continued downward movement causes the upper cover 14 to move in the Z + direction to counteract the one provided by the helical spring 15 and the second repetitively contracted helical spring until the upper ridge 14 and the base U rotate, as shown in FIG. When covering IΓ, the driven member 12g is guided by the cam of the covering member to restrict the guide 'so that the slide 12 moves in the & direction to the I_____ 12 paper size suitable for the four station broadcast standard (CNS) A specification ⑵ ^ χ Norwegian public love) 91. 1 · 3,000
— It------ ---^ . (請先閲讀背面之注意事項再填寫本頁) 0 564578 A7 五、發明說明(// ) 抗第二壓縮螺旋彈簧1 6之力量。 如圖7與10⑷所示,當滑座已經移動至極端χ+位置 時,接腳13係相對地移動遠離接點容納孔l2b到達唯一 於接腳容納孔12d内部之位置,料維持從基底u延伸 之筆直直立方向,藉以開啟接點容納孔l2b。以滑座位於 圖7之位置且如圖8所示’封裝2會接著脫離夾具5〇, 藉以使封裂2掉落至滑座12之底座⑸之上。封裝2係 沿著導12f而被引導至滑座之底座心之上,而封 裝2之每個焊球2a备容納於接點容納孔i2b中,如圖1〇( 所示。 15 20 當接著朝Z-方向提高夾具50時,滑座12係由於第 二壓縮螺旋彈簧16之力量而朝x方向回復至原狀,同時 滑座會與牆壁llb啣接於基底之x_側上,而覆蓋構件14 係朝Z·方向移動,如圖9所示。於此階段下,在接點容 納孔12b中之焊球2a係被固定在彼此相當靠近之接腳螯 13c與各個接點啣接表面12c之間,如圖i〇c所示。 在焊球2a恰巧配置成遠離在接點容納孔12b之XY 平面上之中央刀的情況下,因為焊球h受到接點喻接 表面12c導引,所以焊球2a之位置會略微受到調整,同 時趨近接腳螯13c,藉以將它們沿著χ方向之一條直線(在 各個接腳螯13c與接點啣接表面12c之間)定方位。接腳 臂13a在被焊球2a朝X方向推壓時,會彎曲預定量。接 腳螯13c係以依據臂部13a之彎曲量之彈箐力量,而與谭 球2a表面之根部啣接,結果可使接腳13有效地與各個焊 13 本紙張尺度適用中關家標準(CNSii格(21{) χ撕公爱) 91. 1. 3,000— It ------ --- ^. (Please read the notes on the back before filling out this page) 0 564578 A7 V. Description of the invention (//) Resistance to the second compression coil spring 16. As shown in Fig. 7 and Fig. 10, when the slide has moved to the extreme χ + position, the pin 13 is relatively moved away from the contact receiving hole 12b to reach a position unique to the inside of the pin receiving hole 12d, and the material is maintained from the base u. The extended straight direction opens the contact receiving hole l2b. With the slide seat at the position shown in FIG. 7 and as shown in FIG. 8, the package 2 will then be released from the clamp 50, so that the seal 2 is dropped onto the base ⑸ of the slide seat 12. The package 2 is guided to the base core of the slide along the guide 12f, and each solder ball 2a of the package 2 is received in the contact receiving hole i2b, as shown in FIG. 10 (. 15 20 When next When the clamp 50 is raised in the Z-direction, the slide base 12 returns to the original state in the x direction due to the force of the second compression coil spring 16. At the same time, the slide base and the wall 11b are connected to the x_ side of the base, and the covering member 14 is moved in the Z direction, as shown in Figure 9. At this stage, the solder ball 2a in the contact receiving hole 12b is fixed to the prongs 13c and the contact contact surfaces 12c which are relatively close to each other. In the case where the solder ball 2a happens to be located away from the center knife on the XY plane of the contact receiving hole 12b, because the solder ball h is guided by the contact surface 12c, Therefore, the position of the solder ball 2a will be slightly adjusted, and at the same time approach the pin 13c, so as to position them along a straight line in the χ direction (between each pin 13c and the contact interface 12c). The arm 13a is bent by a predetermined amount when pushed by the solder ball 2a in the X direction. The pin 13c is based on the position of the arm portion 13a. The impulse force of the bending amount is connected with the root of the surface of Tanqiu 2a. As a result, the pins 13 can be effectively welded to each of the 13 paper standards. 91. 1. 3,000
---------^--------- (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 564578--------- ^ --------- (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 564578
料球體2a電性連接。 依據本實施例,封裝2之焊球2a係被加壓至固定於 基底中之各個接腳13,同時焊球係被滑座12之接點啣接 表面12c所導引。因此,不論焊球2a已被配置於滑座 5之接點容納孔12b之内部之位置為何,都可能相對於各個 接腳13之接腳螯13c而正瑞地定位焊球。 依據上述之本實施例,每個接腳13都具有一個臂部 13a,且封裝2之焊.球2a係在滑座12移動時被加壓至臂 邛。因此,只需要g供足夠空間以容納用以將臂部彎曲預 定量所需要之務動範圍,藉以相較於習知技術之下,縮小 了在滑座之底座12a上被每個接腳的臂部13a所佔用之 面積。鑒於接腳13可如上所述被配置成彼此更接近之事 實,插座可適合於與具有配置得比可容納於習知插座來得 罪近之焊球2a之封裝2 —起使用。 15 於上述之本實施例中,因為每個接腳僅具有一個臂 部,所以可簡化接腳13本身之構造,同時亦可簡化容納 接腳13之滑座之零件,亦即,可免除依據上述習知技術 之用以與接腳_接所需之那個部分。因此,可能簡化滑座 12本身之構造,並可降低使用於製備接腳13與滑座12 20 之金屬鑄模之成本。 依據上述實施例,臂部13a只有在它們連接至焊球2a 時才會彎曲。因此,吾人可能基於滑座12之移動量與用 以與焊球2a啣接之位置,而將臂部13a之弯曲量設定成 期望之選定值。因此,可能以適當壓縮力量連接臂部13a 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 91. 1. 3,000 564578 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明(/3 ) 與各個焊球2a,同時改善接腳之耐久性到達比在習知技 術接腳的情況下來得大之程度。如上所述,一般而言,習 知技術接腳係在接腳之開啟動作與處於連接狀態期間受到 應力作用。依據本發明,對應於彎曲量所需之最小應力係 5僅於連接狀態時產生。 又’依據本實施例,與焊球2a啣接之接腳之部分具 有分叉螯之形狀。無論是否僅使用一個臂部13a,這些接 腳可穩定地以相當於兩個臂部之啣接型態與焊球2a啣 接。 - 1〇 又’依據本實施例,接腳螯13c係與焊球2a之根部 啣接或刺入焊球2a之根部。因為焊球2a係於連接至封裝 2之焊球之那部分處容納接腳螯13c,因此可能控制於此 連接所產生之焊球2a之變形量。這在焊球2a被加熱且變 成相當軟的狀況下是特別有效的。藉由調整在接點容納孔 15 中與焊球2a啣接之部分12c之位置,可避免接腳螯13c 之過度刺入。 圖ll(a)-ll(d)顯示依據本發明所製造之其他接腳之接 腳螯。如圖11⑷、U(b)所示,係局部分割接腳130之臂 部130a之尖端部分,而接腳凸部或接腳螯13〇〇係設置於 2〇各個尖端部。如圖U⑷、n⑷所示,可分割接腳⑶之 整個臂部131a,而接腳凸部螯13U係設置於每個尖端部 分。因此可能增加判定適合臂部之彎曲量所需要之條件, 藉以獲得最佳值。 圖12顯示依據本發明所製造之另一滑座之接點吻接 ---:---^---I--· I--- I 丨丨訂---------線 (請先閱讀背面之注意事項再填寫本頁)The pellets 2a are electrically connected. According to this embodiment, the solder balls 2a of the package 2 are pressurized to the respective pins 13 fixed in the substrate, while the solder balls are guided by the contact engagement surfaces 12c of the slider 12. Therefore, regardless of the position where the solder ball 2a has been arranged inside the contact accommodating hole 12b of the slider 5, it is possible to positively position the solder ball with respect to the pin 13c of each pin 13. According to the embodiment described above, each pin 13 has an arm portion 13a, and the soldering of the package 2 is performed. The ball 2a is pressurized to the arm 时 when the carriage 12 is moved. Therefore, it is only necessary to provide enough space to accommodate the work range required to bend the arm by a predetermined amount, thereby reducing the size of each pin on the base 12a of the slider compared to the conventional technology. The area occupied by the arm portion 13a. In view of the fact that the pins 13 may be arranged closer to each other as described above, the socket may be suitable for use with a package 2 having a solder ball 2a which offends closer than a conventional socket configured. 15 In the above-mentioned embodiment, since each pin has only one arm portion, the structure of the pin 13 itself can be simplified, and the parts of the slide receiving the pin 13 can also be simplified, that is, the basis can be eliminated. The above-mentioned conventional technique is used to connect the required part with the pin. Therefore, it is possible to simplify the structure of the slide base 12 itself and reduce the cost of the metal molds used to prepare the pins 13 and the slide base 12 20. According to the above-mentioned embodiment, the arm portions 13a are bent only when they are connected to the solder balls 2a. Therefore, we may set the amount of bending of the arm portion 13a to a desired selected value based on the amount of movement of the slide 12 and the position for engaging the solder ball 2a. Therefore, it is possible to connect the arm 13a with an appropriate compressive force. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 91. 1. 3,000 564578 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 V. Invention Explanation (/ 3) With each solder ball 2a, the durability of the pins is improved to a greater extent than in the case of the conventional technology pins. As mentioned above, in general, the conventional technology pins are stressed during the opening operation of the pins and during the connection state. According to the present invention, the minimum stress system 5 corresponding to the amount of bending is generated only in the connected state. According to this embodiment, the portion of the pin that is engaged with the solder ball 2a has the shape of a bifurcation. Regardless of whether or not only one arm portion 13a is used, these pins can be stably engaged with the solder ball 2a in an engagement pattern equivalent to the two arm portions. -10 'According to this embodiment, the pin 13c is engaged with or penetrates the root of the solder ball 2a. Since the solder ball 2a receives the pin 13c at the portion connected to the solder ball of the package 2, it is possible to control the amount of deformation of the solder ball 2a generated by this connection. This is particularly effective when the solder ball 2a is heated and becomes quite soft. By adjusting the position of the portion 12c that is in contact with the solder ball 2a in the contact accommodating hole 15, excessive penetration of the pin 13c can be avoided. Figures ll (a) -ll (d) show pins of other pins made in accordance with the present invention. As shown in Figs. 11 (a) and U (b), the tip portion of the arm portion 130a of the pin 130 is partially divided, and the pin projection or pin 1300 is provided at each tip portion. As shown in Figs. U⑷ and n ,, the entire arm portion 131a of the pin ⑶ can be divided, and the pin projection 13U is provided at each tip portion. Therefore, it is possible to increase the conditions required to determine the amount of bending suitable for the arm, so as to obtain the optimal value. FIG. 12 shows the contact kissing of another sliding seat manufactured according to the present invention ---: --- ^ --- I --- I --- I 丨 丨 order --------- (Please read the notes on the back before filling this page)
564578 A7 五、發明說明(# ) 表面。如圖12所示,滑座之接㈣接表面心可形成於 局部球面狀(其中曲率係幾乎與焊球2a之曲率相同)中。 因此,相較於圓柱形矣而】%々:_ ⑻㈣表面…之下’可更正確地安置焊球, 再者,亦可能增強焊球2a之變形量之控制。 5 纟上述實施例中’已顯示出設有上蓋之插座之-例。 吾人應注意到本發明亦可使用沒有上蓋之插座。於此情況 下,可设置包含覆蓋構件14之凸輪部14b之夾具5〇,用 以與滑座12之從動啣接部件12g啣接。564578 A7 V. Description of invention (#) surface. As shown in FIG. 12, the contact surface center of the slider may be formed in a partial spherical shape (where the curvature is almost the same as that of the solder ball 2a). Therefore, compared with the cylindrical 矣%]: ⑻㈣ ⑻㈣ the surface ... below ′ can more accurately place the solder ball, and furthermore, it is possible to enhance the control of the amount of deformation of the solder ball 2a. 5 中 In the above embodiment, an example of the socket provided with an upper cover has been shown. I should note that the invention can also be used with uncovered sockets. In this case, a jig 50 including a cam portion 14b of the cover member 14 may be provided to be engaged with the driven engagement member 12g of the slider 12.
S 又,在上述實施例中,已經顯示滑座往復沿著χ方 10向而於基底上移動之型式的插座之例子。然而,本發明亦 可使用往復地沿著基底之斜線移動之滑座的型式之插座。 雖然已參照具體較佳實施例說明本發明,但是熟習本項技 藝者可輕易理解到其他變化與修改型式。因此,鐘於習知 技術’本案意圖儘可能寬廣地解釋以下的申請專利範圍, 15以包含所有這些變化與修改型式。 II I I I 1 I illll — Ι^· — — — — — ! — · ^ (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 適 度 尺 張 紙 本 準 標 家 10 (2 格 規 6 1 564578 A7 B7 五、發明說明(f ) 【圖式之代號說明 15 經濟部智慧財產局員工消費合作社印製 20 1〜電子零件安裝裝置 2〜封褒 2a〜焊球 10〜插座 11〜基底 11 a〜底部 lib〜牆壁 11c〜啣接凸部 12〜滑座 12a〜底座 12b〜接點容納孔 12c〜接點啣接表面 12d〜接腳容納孔 12e〜牆壁部分 12f〜導引面 * 12g〜從動_接部件 13〜接腳 13a〜接腳臂 13b〜固定部分 13c〜接腳螯 14〜上蓋 14a〜啣接構件 14b〜凸輪構件 15〜第一壓縮螺旋彈簧 16〜第二壓縮螺旋彈簧 50〜夾具 51〜頭部 52〜固定部 53〜啣接表面 100〜BGA封裝 100a〜焊球 101〜插座 102〜基底 104〜接腳 104a〜臂部 104b〜臂部 10 5〜滑座 105a〜接腳容納孔 10 5b〜底座 105c〜球體容納孔 105d〜α卸接部件 106〜上蓋 107〜壓縮螺旋彈簧 120c〜接點喻接表面 130〜接腳 130a〜臂部 17 本紙張尺度通用中國國豕標準(CNS)A4規格(210 X 297公釐) —,—产--------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 91. 1. 3,000 564578 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(A) 130c〜接腳螯 131〜接腳 13 la〜臂部 131c〜接腳凸部螯 —-—~------—I —.—訂---------線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 91. 1. 3,000S. In the above embodiment, an example has been shown of a socket of the type in which the carriage moves back and forth along the 10 direction of the x direction and moves on the substrate. However, the present invention can also be used with a socket-type socket that moves back and forth along the diagonal of the base. Although the present invention has been described with reference to specific preferred embodiments, those skilled in the art will readily understand other variations and modifications. Therefore, Zhong Yuxian Technology 'intends to explain the scope of the following patent applications as broadly as possible, 15 to include all these variations and modifications. II III 1 I illll — Ι ^ · — — — — —! — ^ (Please read the notes on the back before filling out this page) The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints a moderately sized paper standard prospector 10 (2 Code 6 1 564578 A7 B7 V. Description of the invention (f) [Description of the code of the drawing 15 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economy 20 1 ~ Electronic parts mounting device 2 ~ Seal 2a ~ Solder ball 10 ~ Socket 11 ~ Base 11 a ~ Bottom lib ~ Wall 11c ~ Engagement projection 12 ~ Slide 12a ~ Base 12b ~ Contact receiving hole 12c ~ Contact engaging surface 12d ~ Pin receiving hole 12e ~ Wall portion 12f ~ Guide Leading surface * 12g ~ Driver_connector 13 ~ pin 13a ~ pin arm 13b ~ fixed portion 13c ~ foot 14 ~ top cover 14a ~ engaging member 14b ~ cam member 15 ~ first compression coil spring 16 ~ 第Two compression coil springs 50 ~ fixture 51 ~ head 52 ~ fixing part 53 ~ engaging surface 100 ~ BGA package 100a ~ solder ball 101 ~ socket 102 ~ base 104 ~ pin 104a ~ arm 104b ~ arm 10 5 ~ slip Block 105a ~ pin receiving hole 10 5b ~ base 105c ~ sphere receiving hole 105d ~ α unmounting unit 106 ~ upper cover 107 ~ compression coil spring 120c ~ contact joint surface 130 ~ pin 130a ~ arm 17 This paper is in accordance with China National Standard (CNS) A4 Specifications (210 X 297 mm) —, — Production -------------- Order --------- Line (Please read the precautions on the back before filling this page) 91. 1. 3,000 564578 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (A) 130c ~ pin 131 ~ pin 13 la ~ arm 131c ~ pin convex pin ------- ------— I —.— Order --------- line (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 91. 1. 3,000
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2000325171 | 2000-10-25 |
Publications (1)
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TW564578B true TW564578B (en) | 2003-12-01 |
Family
ID=34611346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW090126219A TW564578B (en) | 2000-10-25 | 2001-10-24 | Socket apparatus and method for removably mounting an electronic package |
Country Status (2)
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KR (1) | KR100799135B1 (en) |
TW (1) | TW564578B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI735165B (en) * | 2019-04-04 | 2021-08-01 | 黃東源 | Lidless bga socket device for testing bga ic |
TWI736589B (en) * | 2016-02-25 | 2021-08-21 | 日商山一電機股份有限公司 | Contact terminal and ic socket including the same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3256796B2 (en) * | 1994-08-23 | 2002-02-12 | 日本テキサス・インスツルメンツ株式会社 | Socket and test method for electrical component using socket |
JP3550787B2 (en) * | 1995-03-30 | 2004-08-04 | 株式会社エンプラス | IC socket |
US5691041A (en) * | 1995-09-29 | 1997-11-25 | International Business Machines Corporation | Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer |
JP3676523B2 (en) * | 1996-10-22 | 2005-07-27 | 株式会社エンプラス | Contact pin and electrical connection device |
JP3270716B2 (en) * | 1997-07-04 | 2002-04-02 | 日本テキサス・インスツルメンツ株式会社 | Socket and mounting method of semiconductor device |
-
2001
- 2001-10-24 KR KR1020010065642A patent/KR100799135B1/en not_active IP Right Cessation
- 2001-10-24 TW TW090126219A patent/TW564578B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI736589B (en) * | 2016-02-25 | 2021-08-21 | 日商山一電機股份有限公司 | Contact terminal and ic socket including the same |
TWI735165B (en) * | 2019-04-04 | 2021-08-01 | 黃東源 | Lidless bga socket device for testing bga ic |
Also Published As
Publication number | Publication date |
---|---|
KR20020032359A (en) | 2002-05-03 |
KR100799135B1 (en) | 2008-01-29 |
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