TW564578B - Socket apparatus and method for removably mounting an electronic package - Google Patents

Abstract

A socket (10) has a plurality of contacts (13) arranged in base (11). Each contact has one arm (13a) for contacting a solder ball of an electronic package (2). A slider (12) has a seat (12a) for package (2), a plurality of terminal receiving holes (12b), a terminal engagement surface (12c) formed at each terminal receiving hole for engagement with a respective solder ball and a plurality of contact receiving holes (12d). When slider (12) is moved in one directions package (2) can be seated with each ball disposed in a respective terminal receiving hole. When the slider returns, each ball is elastically contacted between an arm (13a) and a terminal engagement surface (12c).

Description

564578 A7 V. Description of the invention (/) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics [Field of the Invention] The present invention is generally related to the removable mounting of an electronic package socket such as a package containing integrated circuits, for To perform the electrical test of such a package, the present invention is particularly related to electrically connecting each of the conductive contacts of this electronic package 5 to respective leads in the socket for further connection to the socket of the test equipment. [Background of the Invention] IC (integrated circuit) ICs that have been sealed with smart grease on 1C chips are subjected to a degree of test called burn_in, which is used to classify them into satisfactory and Unsatisfactory product ° Figures 13 (a) -13 (d) show an example of a known socket 101 used for burn-in testing of electronic packages with BGA (Ball Grid Array) contacts . The socket 101 has a square base 102, and a plurality of pins 104 are mounted therein for crimping each solder ball 100a of the BGA package 100. Each of the pins 104 is formed by an extended metal member, and a pair of arm portions 104a and 104b are provided at one end of the pin 104. The slider 105 capable of carrying the BGA package 100 is mounted on the base 102 for its movement in the horizontal direction (X direction). The slider 105 is adapted to receive the pin 104 via the pin receiving hole 105a. As shown in Figs. 13 (a) and 13 (b), each ball receiving hole 105c for receiving each solder ball 100a is formed in the slider 105 in a manner to intersect with the pin receiving hole 105a. On the base 10 讣. Also, as shown in FIG. 13 (b), each of the engaging members 10 of the slider 105 is formed on the inner surface of the pin accommodating hole 105a, and is used to connect with each of the pins 0415 20

91. 1. 3,000 !! / —! 1-IIIII — I β (Please read the notes on the back before filling this page) 564578 A7 B7 15 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 20 V. Description of the Invention The upper cover 106 of the slide base 105 is arranged on the base 102 for moving toward and away from the base 102 by compressing the spiral elastic cyan 107. In the above socket, if the upper cover 106 is downward Press, the slider ι〇5 will move in the x + direction, causing the arm 104a of the pin 104 to be engaged with the engaging member 105d of the slider 105, thereby opening the pin in the + direction in a bent state. In this case, when the BGA package 100 is lowered above the base 105b of the slider 105, each ball i00a of the BGA package 100 is accommodated in each sphere to accommodate 105c Middle. When the upper cover 106 is raised, the slider 105 returns to the original state by the force of the arm portion 104a of the pin 104. Therefore, each arm portion 104a will contact each solder ball 100a, and the other # 邛104b will bend in the χ_ direction when it is pushed out by the solder ball i〇〇a. Each pair of arms 104a and 104b clamp a solder ball 1 〇a, 俾 can make each solder ball 100a of the BGA package be electrically connected to the pin 104. In the above configuration, the arm portions 104a and 104b are opened with the arm portion 104a and by the arm portion l Both 〇4a and 104b move in association with the fixation of the solder ball 100a. Therefore, it is necessary to provide a large enough area to conform to the arms 104a and 104b in the base 105b of the slider 105. The amount of movement. Because there are physical restrictions on how closely the pins 104 can be arranged, it is difficult to use the conventional socket 101 for a BGA package with solder balls that have been arranged at a finer pitch. [Summary of the Invention]

An object of the present invention is to solve the above problems of the conventional technology. Another object of the present invention is to provide an IC suitable for finer pitches. 91. 1. 3,000... Ordering ---------- (please «read the notes on the back side before filling out this page) 564578 V. Description of the invention (15 20 sockets used together in a package. In short, 'sockets manufactured according to a preferred embodiment of the present invention are used to removably accommodate electronic components having contacts configured according to a selected pattern' The socket includes a socket base, which has a plurality of pins configured corresponding to the selected pattern, and each pin has a cantilevered pin arm that can contact the contact point of the electronic component. It can move horizontally relative to the socket base The sliding seat is slidably mounted on the base and has a plurality of pin receiving through holes corresponding to the positions of the pin arms. The walls of the through holes are configured so that they will not apply any bias to The foot arm can be used as a free end. The slider also has a contact receiving hole for receiving the contact and communicating with the through hole. When the slider is at the selected position, the contact can be received in the contact receiving hole Medium, and when the slider is located When the position is fixed, the arm can be flexibly connected with the contact in the contact receiving hole. According to a feature of the present invention, each pin has a single pin! One of the pair of arms and electronic parts The contact point is held in the contact receiving hole when the moon seat is moved. By fixing the contact point on the wall (that is, the connection between the & & Therefore, in Qingzao (corresponds to the appropriate === contacts. 逵 啻 啻 啻 the emperor ’s desire, and the arm of the pin ΪΓΐ: the movement range required by the point), It is only necessary to mention the area set by the known technology. Therefore, it can accommodate another feature smaller than that according to the present invention, and is provided with an upper cover, which is 1 ::: moved in the direction of " from the base of the socket. Slip ------- Order --------- (Please read the precautions on the back before filling this page) -0 ^ Paper size General Chinese National Standard Jade (Lm) A4 Specification ⑽χTear 91 · 1. 3,000 564578 A7 B7 V. Description of the invention (From the connection part, when the tilting part is connected with the rider, the slide will move along the upper cover toward: or away from the socket base In the selected direction, according to the present invention, only when the contacts of the electronic parts are connected, the pins will be bent, thereby improving the durability of the pins. According to another feature of the present invention, the contact receiving holes Contacts_The contact surface can be a cylindrical surface, or it can be designed to more closely conform to the surface shape of the contacts of electronic parts used in sockets (for example, the part is spherical for solder ball contacts). According to one aspect of the present invention, the contact portion of the leg arm may have a convex portion, for example, a chevron-shaped projection having a pair of spaced projections. These projections extend along the selected direction in 10 directions. They extend toward the contact surface. Therefore, even when only one-arm portion is used, the pin can be firmly connected to the contact point of the electronic component in the contact area equivalent to the area of the plurality of arm pins. According to yet another feature, the contact portion of the leg arm is configured to contact the root of a contact located on the side of the 15 electronic component (the contact is extended therefrom). When used with an electronic part with a BGA package (with ball contacts), the contact portion of the pin arm is the same as the portion below the package and the contact (the diameter here becomes relative to the parallel to the package) The contact surface σ between the plane of the lower surface is the maximum value). According to another feature of the embodiment of the present invention, the fixture having the fixing and releasing parts for transporting electronic parts can be moved toward and away from the socket, and can be used to move the sliding seat of the socket with or without the socket. Additional objects and features of the present invention will be partially disclosed in the following description 'and some will be apparent from the description. The following 6 paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) " " " 丨 丨 丨 '' 丨 丨 -1! ^ · 丨 丨 丨 丨 丨 丨 ·· Line ·-(Please read the notes on the back before filling this page)

91. 1. 3, C 564578

V. Description of the invention (5 The means, combinations, and methods detailed in the scope of patent application for printing by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs may achieve and obtain the objects and advantages of the present invention. [Simplified description of the drawings] The drawings constituting a part of the description show the fifth preferred embodiment of the present invention. In the drawings: FIG. 1 is a top plan view showing the basic structure of a socket according to the first preferred embodiment of the present invention; In order to show the front view of the socket and the electronic components of the fixing fixture shown in Figure 1, the fixture is shown in a 'section; 10 Figure 3 is a sectional view taken along line AA of Figure 1; Figure 4 is a sectional view taken along Figure 1 Sectional view of the line; Figures 5 (a) and 5 (b) are enlarged front and side views of the tip portion of the pin of the socket of Figure i_4, respectively; Figure 5 (c) shows the pins and pins An enlarged top plan view of the positional relationship between the receiving hole and the 15-contact receiving hole located at p in FIG. 1; FIG. 5 (d) is a diagram showing the pin, the pin receiving hole, and the contact valley located at q in FIG. 4 An enlarged and exploded front view of the positional relationship between the holes; Figure 6 is Gu shows the front view of the socket with the upper cover in the lowered position; Figure 7 is a sectional view of Figure 6; Figure 8 is a sectional view similar to Figure 6, but with the dashed line above the socket and the actual installation in the socket Line shows electronic parts; Figure 9 is a cross-sectional view similar to Figure 7, but showing the socket in the upper position of the cover; This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 91. 1. 3,000 ---, 1-< ------ i 丨 丨 —ί 丨 Orders 丨 丨! 丨 丨 -line ^ 1 ^ · (Please read the precautions on the back before filling this page)

564578 V. Description of the invention (Figure 10 (a) is an enlarged and exploded front view showing the positional relationship between the pin, the pin receiving hole and the contact receiving hole of FIG. 7; Figure 10 (b) is a display pin An enlarged and exploded front view of the positional relationship between the pin receiving hole and the contact receiving hole in FIG. 8; FIG. 10 (c) is a view showing the pin, the ball receiving hole and the pin receiving hole shown in FIG. 9. The enlarged and exploded front views of the positional relationship among the figures: Figures 11 (a), 11 (b), 11 (c), and 11 (d) are enlarged and exploded front and side views, respectively, showing other connections according to the present invention. Figure 12 is an enlarged and exploded front view showing a contact interface of a slider in accordance with a variation of the present invention; Figure 13 (a) is a top plan view of a socket made in accordance with conventional technology Fig. 13 (b) is a cross-sectional view taken along line CC of Fig. 13 (a), which shows the electronic parts to be installed; 15 Fig. 13 (c) is a view similar to Fig. 13 (b), but 13 (d) is an enlarged part of FIG. 13 (a). [Detailed description of the invention] As shown in FIG. 2, this is a better embodiment. The electronic component mounting device j 20 of the embodiment is used for mounting a BGA package (electronic component, hereinafter referred to as "package") having a spherical solder ball (contact) 2a disposed thereon according to a selected pattern. The mounting device includes a socket 10 and a fixture 50 arranged in an alignment relationship with the socket 10, which is a sliding seat for moving the socket. The socket 10 has a main socket body or a base 11 and an upper cover 14, wherein the base π is made of, for example, polyetherthioimide This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) — / ------, — Order --------- line (please read the precautions on the back before filling (This page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 91. 1. 3,000 564578 A7

The Intellectual Property Bureau of the Ministry of Economic Affairs is composed of an appropriate resin material printed by a consumer cooperative, and the upper cover 14 has a centrally located opening for electronic parts, and can move vertically toward and away from the substrate 11. The substrate 11 is adapted to be fixed to a wiring substrate such as a printed substrate (not shown in the drawings). The base has a substantially square bottom 5a, and a wall lib surrounding the bottom 11a and forming a central space or cavity with the bottom Ua. The plurality of extension pins 13 are disposed on the bottom 1U of the substrate ^ and correspond to the patterns of the solder balls 2a of the package 2, as shown in Figs. The protruding fixing portion m (see FIG. 4) is formed in the middle of both ends of the pin 13, and when the fixing portion nb is accommodated in the opening portion of the base 11, the pin is oriented in a direction of the base U The vertical state of the bottom extending vertically is fixed.

In contrast to the conventional technique, the tip portion of the cantilever holder of each pin 13 does not have-the arms facing toward each other and away from the moving arm. In this embodiment, each pin 13 is provided with an armrest 13 & which can be elastically deformed in a direction of a μ buckle, and the configuration of each pin is such that the arm portion ... the direction of deformation will be parallel The direction of the -side of the substrate 11 (refer to Figure 1 for the direction of Figure 1, the horizontal direction is referred to as the χ direction, and the direction perpendicular to the X direction is referred to as the γ direction. The direction perpendicular to the [and Y direction is 20 It is referred to as the Z direction. With reference to FIG. 1 or FIG. 4, the slide base 12 is provided in the two rooms on the bottom portion a of the base n, and is adapted to face the direction between the first and second ends in the bottom portion. Sliding on lla. The flat load-bearing part or base 12a is formed on the surface of the slide base 12 where the package 2 can be placed. Capable. Strict ------------------- ^ Aw (Please read the “Notes on the back side before filling out this page”) 9 564578 A7 V. Description of the invention (Υ) (Please read the “Notes on the back side before filling out this page”) Most of the contacts of the packaged solder ball 2a can be accommodated The hole 12b is provided in the base 12a corresponding to the specific solder ball pattern of the package 2. As shown in FIG. 5 (hook and 5 (d), each contact receiving hole 12b is a circle) Columnar, 俾 can form the contact interface 12c. The diameter of the opening 12b is larger than 5 裣 outside the sphere 2a, and the ice degree is larger than the height of the solder ball. The pin receiving hole 12d is formed in the slide 12 To accommodate the pins 13 and correspond to the position of each pin 13 extending from the base n, each pin receiving hole 12d is combined with and communicates with each of the contact valley holes 12b. Each pin receives The holes 12d are rectangular through holes, and their longitudinal sides extend toward the χ direction of the slide base 12. The arm portions 13a of each pin are placed in the through holes 12d and can accommodate the holes with respect to the respective contacts. The position inside 12b is moved. The length of each pin receiving hole 12d in the χ direction is approximately equal to or slightly larger than the amount of movement of the slide 12. The female pins 13 are suitable for maintaining its upright extension from the base. Direction and during the entire movement of the slider in the χ direction, I5 will not touch the side of the slider 12. The employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints the arm I3a of each pin 13 to be accommodated in the pin. In the hole 12d and configured to face the contact engagement table of the contact receiving hole 12b 12c. As shown in Figs. 5 (a) and 5 (b), the pin 13c 'which can be connected to a part of the surface of the solder ball 2a, when the pin is mounted on the substrate, it is oriented toward the Branches in two selected directions but usually face the contact interface surface to form an acute angle at the tip of the arm 13a. As shown in Figure 5 (d), when the slide is at one end (making the pin in the closed position), The distance in the χ direction between the pin 13c of 13 and the contact surface 12c of each contact of the slide 12 is set to be less than the solder ball 10. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 male) 31) 91. 1. 3,000 564578 A7 B7 V. Description of the invention (15 20 = the numerical value of the diameter. When the slide base 12 has moved a specified amount in the direction of χ + :, the contact receiving hole ⑽ of the slide base 12 is opened, and as a result, the distance becomes dl which is larger than the diameter of the solder ball 2a. When the slide 12 moves in the direction = moving and the solder ball 2a is received in the contact receiving hole m, the solder ball is elastically fixed to the contact ★ between the contact surface l2e and the contact sound 13 of the contact 3 . In addition, pins 13 can generate appropriate strength, depending on their shape and the materials used. In addition, it is also possible to set the power transmitted through the pin 13C to a value suitable for penetrating the solder ball 2a. Regarding the relationship between the position of the pin f ... of the i pin 13 in the Z direction and the reliability of the base 12a of the slider, the pin 13e is preferably arranged ^ slightly above the central portion of the solder ball 2a, 俾It is possible to make the prongs connect to the roots of the solder ball 2a, that is, between the area where the solder balls have their maximum diameter in a plane parallel to the lower surface of the package 2 and the connection position of the packaged cicada ball That part. As shown in FIG. 1 or FIG. 4, the guide wall portion 12e on the outer periphery of the base 12a of the slide base 12 is provided with an inclined guide surface to guide the package 2 to the base i2a. As shown in FIG. 4, the upper cover 14 has a movement-restricting engagement member 4a extending in the z-direction I on two opposite sides, and a latch is formed at its ends. The latch of each member 14a is engaged with the engaging protrusion 11c formed on the base 11 to restrict the movement of the upper cover away from the base. The upper cover 14 is adapted to be moved toward the base 11 until its lower surface touches the upper surface of the wall 11b of the base. Referring to FIG. 3, a plurality of cam members 14b having a selected surface, such as a curved convex surface (as shown), are provided on the upper cover 14 of I__ 11 Ϊ paper size suitable financial standard (CNS) A4 specifications ⑽χ 297 male Love

< Please read the notes on the back before filling this page) -------- Order --------- line · -564578 15 20 A7 V. Description of the invention (β) Move the slide 12. In cooperation with the cam member, the driven engagement member 12g is provided on the outer periphery of the slide base 12 to be connected with the cam member 14b of the upper cover. A plurality of second compression coil springs 15 with a longitudinal axis extending in the direction of 帛 z # are arranged on the upper cover 14 and the base 5 = the force from the first compression spiral bomb 15 when no external force is applied to the upper cover 14 The upper cover is moved to the lifted position, and the locking of the joint member w is jointed with the convex portion Ue of the base u. A plurality of second compression coil springs 16 having a longitudinal axis extending in the X direction are disposed between the slide base 12 and the base. #When no external force is applied to the upper cover and the force from each second compression coil spring 16 in the direction of χιό, the sliding wall 12b of the slide 12 is connected to the side of the base, and the follower of the slide 12 is 12g It is connected to the cam member Mb of the upper cover 14. As shown in FIG. 2, the clamp 50 for operating the slide base has a head 51 that can be moved toward and away from the socket 1G in the z direction, and has a socket 1 () formed in the clamp (suitable for connection with the upper cover U) The top surface 52 on the surface is attached to the head. When desired, this head can be fixed to the package 2 by a suitable device such as suction. ^ In the above implementation, it is determined that the fixture% of the package 2 is lowered downwards, so that the figurative connection surface 53 of the fixture is connected to the upper cover i4 *. Continued downward movement causes the upper cover 14 to move in the Z + direction to counteract the one provided by the helical spring 15 and the second repetitively contracted helical spring until the upper ridge 14 and the base U rotate, as shown in FIG. When covering IΓ, the driven member 12g is guided by the cam of the covering member to restrict the guide 'so that the slide 12 moves in the & direction to the I_____ 12 paper size suitable for the four station broadcast standard (CNS) A specification ⑵ ^ χ Norwegian public love) 91. 1 · 3,000

— It ------ --- ^. (Please read the notes on the back before filling out this page) 0 564578 A7 V. Description of the invention (//) Resistance to the second compression coil spring 16. As shown in Fig. 7 and Fig. 10, when the slide has moved to the extreme χ + position, the pin 13 is relatively moved away from the contact receiving hole 12b to reach a position unique to the inside of the pin receiving hole 12d, and the material is maintained from the base u. The extended straight direction opens the contact receiving hole l2b. With the slide seat at the position shown in FIG. 7 and as shown in FIG. 8, the package 2 will then be released from the clamp 50, so that the seal 2 is dropped onto the base ⑸ of the slide seat 12. The package 2 is guided to the base core of the slide along the guide 12f, and each solder ball 2a of the package 2 is received in the contact receiving hole i2b, as shown in FIG. 10 (. 15 20 When next When the clamp 50 is raised in the Z-direction, the slide base 12 returns to the original state in the x direction due to the force of the second compression coil spring 16. At the same time, the slide base and the wall 11b are connected to the x_ side of the base, and the covering member 14 is moved in the Z direction, as shown in Figure 9. At this stage, the solder ball 2a in the contact receiving hole 12b is fixed to the prongs 13c and the contact contact surfaces 12c which are relatively close to each other. In the case where the solder ball 2a happens to be located away from the center knife on the XY plane of the contact receiving hole 12b, because the solder ball h is guided by the contact surface 12c, Therefore, the position of the solder ball 2a will be slightly adjusted, and at the same time approach the pin 13c, so as to position them along a straight line in the χ direction (between each pin 13c and the contact interface 12c). The arm 13a is bent by a predetermined amount when pushed by the solder ball 2a in the X direction. The pin 13c is based on the position of the arm portion 13a. The impulse force of the bending amount is connected with the root of the surface of Tanqiu 2a. As a result, the pins 13 can be effectively welded to each of the 13 paper standards. 91. 1. 3,000

--------- ^ --------- (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 564578

The pellets 2a are electrically connected. According to this embodiment, the solder balls 2a of the package 2 are pressurized to the respective pins 13 fixed in the substrate, while the solder balls are guided by the contact engagement surfaces 12c of the slider 12. Therefore, regardless of the position where the solder ball 2a has been arranged inside the contact accommodating hole 12b of the slider 5, it is possible to positively position the solder ball with respect to the pin 13c of each pin 13. According to the embodiment described above, each pin 13 has an arm portion 13a, and the soldering of the package 2 is performed. The ball 2a is pressurized to the arm 时 when the carriage 12 is moved. Therefore, it is only necessary to provide enough space to accommodate the work range required to bend the arm by a predetermined amount, thereby reducing the size of each pin on the base 12a of the slider compared to the conventional technology. The area occupied by the arm portion 13a. In view of the fact that the pins 13 may be arranged closer to each other as described above, the socket may be suitable for use with a package 2 having a solder ball 2a which offends closer than a conventional socket configured. 15 In the above-mentioned embodiment, since each pin has only one arm portion, the structure of the pin 13 itself can be simplified, and the parts of the slide receiving the pin 13 can also be simplified, that is, the basis can be eliminated. The above-mentioned conventional technique is used to connect the required part with the pin. Therefore, it is possible to simplify the structure of the slide base 12 itself and reduce the cost of the metal molds used to prepare the pins 13 and the slide base 12 20. According to the above-mentioned embodiment, the arm portions 13a are bent only when they are connected to the solder balls 2a. Therefore, we may set the amount of bending of the arm portion 13a to a desired selected value based on the amount of movement of the slide 12 and the position for engaging the solder ball 2a. Therefore, it is possible to connect the arm 13a with an appropriate compressive force. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 91. 1. 3,000 564578 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 V. Invention Explanation (/ 3) With each solder ball 2a, the durability of the pins is improved to a greater extent than in the case of the conventional technology pins. As mentioned above, in general, the conventional technology pins are stressed during the opening operation of the pins and during the connection state. According to the present invention, the minimum stress system 5 corresponding to the amount of bending is generated only in the connected state. According to this embodiment, the portion of the pin that is engaged with the solder ball 2a has the shape of a bifurcation. Regardless of whether or not only one arm portion 13a is used, these pins can be stably engaged with the solder ball 2a in an engagement pattern equivalent to the two arm portions. -10 'According to this embodiment, the pin 13c is engaged with or penetrates the root of the solder ball 2a. Since the solder ball 2a receives the pin 13c at the portion connected to the solder ball of the package 2, it is possible to control the amount of deformation of the solder ball 2a generated by this connection. This is particularly effective when the solder ball 2a is heated and becomes quite soft. By adjusting the position of the portion 12c that is in contact with the solder ball 2a in the contact accommodating hole 15, excessive penetration of the pin 13c can be avoided. Figures ll (a) -ll (d) show pins of other pins made in accordance with the present invention. As shown in Figs. 11 (a) and U (b), the tip portion of the arm portion 130a of the pin 130 is partially divided, and the pin projection or pin 1300 is provided at each tip portion. As shown in Figs. U⑷ and n ，, the entire arm portion 131a of the pin ⑶ can be divided, and the pin projection 13U is provided at each tip portion. Therefore, it is possible to increase the conditions required to determine the amount of bending suitable for the arm, so as to obtain the optimal value. FIG. 12 shows the contact kissing of another sliding seat manufactured according to the present invention ---: --- ^ --- I --- I --- I 丨 丨 order --------- (Please read the notes on the back before filling this page)

564578 A7 V. Description of invention (#) surface. As shown in FIG. 12, the contact surface center of the slider may be formed in a partial spherical shape (where the curvature is almost the same as that of the solder ball 2a). Therefore, compared with the cylindrical 矣%]: ⑻㈣ ⑻㈣ the surface ... below ′ can more accurately place the solder ball, and furthermore, it is possible to enhance the control of the amount of deformation of the solder ball 2a. 5 中 In the above embodiment, an example of the socket provided with an upper cover has been shown. I should note that the invention can also be used with uncovered sockets. In this case, a jig 50 including a cam portion 14b of the cover member 14 may be provided to be engaged with the driven engagement member 12g of the slider 12.

S. In the above embodiment, an example has been shown of a socket of the type in which the carriage moves back and forth along the 10 direction of the x direction and moves on the substrate. However, the present invention can also be used with a socket-type socket that moves back and forth along the diagonal of the base. Although the present invention has been described with reference to specific preferred embodiments, those skilled in the art will readily understand other variations and modifications. Therefore, Zhong Yuxian Technology 'intends to explain the scope of the following patent applications as broadly as possible, 15 to include all these variations and modifications. II III 1 I illll — Ι ^ · — — — — —! — ^ (Please read the notes on the back before filling out this page) The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints a moderately sized paper standard prospector 10 (2 Code 6 1 564578 A7 B7 V. Description of the invention (f) [Description of the code of the drawing 15 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economy 20 1 ~ Electronic parts mounting device 2 ~ Seal 2a ~ Solder ball 10 ~ Socket 11 ~ Base 11 a ~ Bottom lib ~ Wall 11c ~ Engagement projection 12 ~ Slide 12a ~ Base 12b ~ Contact receiving hole 12c ~ Contact engaging surface 12d ~ Pin receiving hole 12e ~ Wall portion 12f ~ Guide Leading surface * 12g ~ Driver_connector 13 ~ pin 13a ~ pin arm 13b ~ fixed portion 13c ~ foot 14 ~ top cover 14a ~ engaging member 14b ~ cam member 15 ~ first compression coil spring 16 ~ 第Two compression coil springs 50 ~ fixture 51 ~ head 52 ~ fixing part 53 ~ engaging surface 100 ~ BGA package 100a ~ solder ball 101 ~ socket 102 ~ base 104 ~ pin 104a ~ arm 104b ~ arm 10 5 ~ slip Block 105a ~ pin receiving hole 10 5b ~ base 105c ~ sphere receiving hole 105d ~ α unmounting unit 106 ~ upper cover 107 ~ compression coil spring 120c ~ contact joint surface 130 ~ pin 130a ~ arm 17 This paper is in accordance with China National Standard (CNS) A4 Specifications (210 X 297 mm) —, — Production -------------- Order --------- Line (Please read the precautions on the back before filling this page) 91. 1. 3,000 564578 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (A) 130c ~ pin 131 ~ pin 13 la ~ arm 131c ~ pin convex pin ------- ------— I —.— Order --------- line (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 91. 1. 3,000

Claims (1)

564578 VI. Scope of patent application 10 15 20 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 25 ^ Zhang Jiao Ji Shicai Family Logo X 297) (A8 B8 C8 D8 Patent Application No. 90126219 ROC Patent Appln. No. 90126219 Amended Claims in Chinese-Enel. (I)} for the amended unlined patent application (Submitted on September S, 2003) A socket device for removable In addition to ground, an electronic package having a plurality of contacts extending downward from the package and configured in a selected pattern, the socket device includes: an electrically insulating substrate having an upper surface and a lower surface, and having an upper surface and a lower surface extending A plurality of pin receiving holes are arranged between the two pins and arranged in a selected pattern. The electrically insulating slider has an upper surface and a lower surface. The electrically insulating slider is slidably received on the upper surface of the substrate for moving along the substrate. A linear movement between the upper end and the end of the brother; the electronic package housing base is formed on the upper surface of the slide; the pin accommodation hole is each pin in the base The hole is formed through the sliding seat between the upper surface and the lower surface and can be aligned therewith; the contact receiving hole has a contact engaging surface which is formed for each pin receiving hole in the sliding seat On the upper surface of the slider, each contact receiving hole in the slider is merged with each pin receiving hole in the slider to communicate with each other; the conductive pins are extended to accommodate and hold each pin on the base. A receiving hole, which extends through each pin receiving hole in the sliding seat, each pin has a free end configured to be adjacent to the upper surface of the sliding seat; the sliding seat can be in a first position (the pins are configured to be The contact surface is separated from the contact surface—turn). The second position (connection_, configured to be a second distance away from the contact surface) is moved by 90535B- 接 .doc 564578 The scope of the patent application A8 B8 C8 D8 5 10 15 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Employee Consumer Cooperatives. 20 When configured in two positions, so as to have a plurality of patterns according to the selected pattern: the sub-package can be placed on the electronic package receptacle,- Incorporated in each contact receiving hole, and the contacts in the contact receiving hole are sandwiched between each contact = = surface and pin, and each contact surface and contact 0 2. If applying for a patent The socket device according to item 1 of the scope, wherein the pins are out of contact with the carriage during the entire moving range of the carriage. 3. The socket device according to item i of the patent application scope, wherein the free ends of the pins are arranged below the upper surface of the slide base. The socket device according to item 1 of the scope of patent application, wherein the pins are provided with fixed portions for fixedly mounting the pins in each pin receiving hole of the base, and each pin has an upward extension. Pin arms that enter each pin receiving hole in the slide. 5 · = The socket device described in item 丨 of the patent application scope further includes two spaced-apart convex portions formed on the free ends of each pin configured to face each contact metaphor surface. 6. The socket device according to item 4 of the scope of patent application, wherein the free end of each leg arm is bifurcated, and the convex portion is formed on each branch configured to face the contact surface of each contact. On the fork. 7. The socket device according to item 4 of the patent claim, wherein each leg arm is bifurcated, and the convex part is formed at each bifurcation point configured to face the contact surface of each contact On the free end. 8. The socket device as described in item 1 of the scope of patent application, which is suitable for -20-This paper size applies the Chinese National Standard (CNS) A4 specification (21 × 297 mm) Shen Jing Patent Fan ^ An electronic package with a lower surface and solder ball contacts—from use, the solder ball contacts have a straight path that changes in size to a maximum relative to the direction parallel to the lower surface of the electronic package. The socket device It also includes two spaced-apart protrusions formed on the free ends of each pin configured to face the contact surface of each contact. These protrusions are arranged below the upper surface of the slide and are smaller than the solder balls. The distance from the maximum diameter of the contact to the distance from the lower surface of the electronic package. 9. The socket device according to item 1 of the scope of patent application, wherein the contact metaphor surface is substantially cylindrical. 10 10. The socket device according to item i of the towel range, wherein the contact surface is partially spherical. 11. The wire inserting device described in item 丨 of the patent application system further includes a first spring member installed in the base to provide a bias to the slider toward the first position. 15 I2. The socket device according to item 1 of the scope of patent application, further comprising: a spring member installed in the base to provide a bias to the slide seat toward the first position, and the slave engaging surface is formed on the slide The upper cover is mounted on the base, and an electronic package access opening is formed in the center. The upper cover is mounted on the base and can be moved toward and away from the upper surface of the base. Cam part; a second spring member installed in the base to provide bias to the upper cover in a direction away from the base, the upper cover is movable toward the base to oppose the bias of the second spring member, and the cam member is suitable for The device engaging surface engages and moves the slider toward the second position to oppose the first spring mechanism -21- ^ 64578 A8 B8 C8 D8 Scope of patent application: 15 pieces of bias printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 13. The socket device as described in item 12 of the scope of patent application, further comprising a loss = it can be oriented toward and away from the electronic package access opening with the upper cover ^ the insertion and return movement of the sub-package fixing and release portion, the loss It has a kiss cover kissing surface. The movement of the fixture toward the socket will cause the upper surface to be connected to the upper cover. The continuous movement of the clamp will move the upper cover toward the base, so that the cam guide guides the follower. It is connected to the surface and causes the sliding of the carriage. 14 ·-A method for packaging electronic wires, including the following steps: Mounting a plurality of spaced-apart extended electrical pins in the substrate, each of the pins having a straight line extending from the upper surface of the substrate into each pin valley The cantilevered leg arm of the hole, the part of the pin receiving hole is bounded by the contact interface surface in the slide, the slide is slidably mounted on the upper surface of the base; the slide is moved away from the first position In order to resist the bias of the spring force, the contact surface of each contact can be moved away from the pin arms in the respective pin accommodation holes to reach the second position, and the second position allows the contacts of the electronic package to be placed. Between the detachment surface of the contact 0 and each leg arm; and allow the spring force to move the slide in the opposite direction of the return toward the first position 'to push the contact point to the leg arm connection by the contact engagement surface . 15. The method for mounting an electronic package as described in item 14 of the scope of patent application, further comprising the step of maintaining a gap between the slider and the leg arm during moving the slider. -22-This paper size is applicable to China National Standard (CNS) A4 (21 × 297 mm)