KR20020032359A - Socket apparatus and method for removably mounting an electronic package - Google Patents

Abstract

PURPOSE: A socket and an electronic part mounting device equipped with the same are provided to make a socket enabled to correspond with an IC package with a fine pitch. CONSTITUTION: A socket(10) comprises a base(11) to which a plurality of contacts(13) having an arm(13a) enabled to touch a solder ball of the package are arranged, a loading part(12a) on which the package is loaded, plurality of ball locking surfaces arranged on the loading part to be locked into the solder balls, a plurality of contact housing holes(12d) arranged to house contacts of base side, and a slider to which the ball locking surface and the contact housing hole are arranged in paired state in an X direction, enabled to move in the X direction.

Description

SOCKET APPARATUS AND METHOD FOR REMOVABLY MOUNTING AN ELECTRONIC PACKAGE}

The present invention generally relates to a socket for removably mounting such a package for performing an electrical test of an electronic package, such as a package containing an integrated circuit, more specifically each conductive terminal of the electronic package being connected to the test apparatus. It relates to a socket electrically connected to each conductor in the socket so as to be additionally connected.

IC packages in which integrated circuit (IC) chips are sealed by resin usually undergo a reliability test called a burn-in test that separates these packages into satisfactory and unsatisfactory products.

13A-13D show one example of a known socket 101 used for burn-in testing for an electronic package equipped with a Ball Grid Array (BGA) terminal. The socket 101 is provided with a square base 102 on which a plurality of contacts 104 are pressure-connected with each solder ball 100a of the BGA package 100. Each contact 104 is made of an elongate metal member, with a pair of arms 104a and 104b provided at one end thereof. A slider 105 capable of supporting the BGA package 100 is mounted on the base 102 to move in the horizontal direction (X direction). The slider 105 is adapted to receive the contact 104 through the contact receiving hole 105a. As shown in FIGS. 13A and 13B, a ball receiving hole 105c for receiving each solder ball 100a is formed on the sheet 105b of the slider 105 in a manner crossing the contact receiving hole 105a. have. In addition, as shown in FIG. 13B, each engaging portion 105d of the slider 105 is formed inside the contact receiving hole 105a to be engaged with the arm 104a of each contact 104. A cover 106 for operating the slider 105 is mounted on the base 102 such that it can move towards and away from the base 102 through the compression coil spring 107.

In the socket as described above, when the cover 106 is pressed downward, the slider 105 moves in the X + direction so that the arm 104a of the contact 104 is engaged with the engaging portion 105d of the slider 105. By engaging, the contact is bent and opened in the X + direction. In this state, when the BGA package 100 descends over the sheet 105b of the slider 105, each solder ball 100a of the BGA package 100 is accommodated in each ball receiving hole 105c. When the cover 104 is raised, the slider 105 is returned in the X-direction by the force of the arm 104a of the contact 104. As a result, each arm 104a is in contact with each solder ball 100a, and at the same time the other arm 104b is bent in the X-direction as it is pushed by the solder ball 100a. Since each arm 104a, 104b pair sandwiches the solder ball 100a, each solder ball 100a of the BGA package is electrically connected to the contact 104.

In the above-described configuration, the arms 104a and 104b move in relation to the opening of the arm 104a by these two arms 104a and 104b and the maintenance of the solder ball 100a. Therefore, it was necessary to provide a sufficiently large area corresponding to the amount of movement of the arms 104a and 104b in the seat portion 105b of the slider. Because of the physical limitations on how closely the contacts 104 can be placed, it has been difficult to use conventional socats 101 for BGA packages where solder balls are arranged at finer pitches.

The object of the present invention is to solve the above-mentioned problems of the prior art. Another object of the present invention is to provide a socket suitable for use with finer pitch IC packages.

1 is a plan view showing a basic configuration of a socket according to a first preferred embodiment of the present invention.

It is a front view which shows the socket of FIG. 1, and the electronic component holding jig | tool of sectional form.

3 is a cross-sectional view taken along the line A-A of FIG.

4 is a cross-sectional view taken along the line B-B of FIG.

5A and 5B are enlarged front and side views, respectively, in which the distal end portions of the contacts of the sockets shown in FIGS. 1 to 4 are disassembled.

5C is an enlarged plan view illustrating a positional relationship between a contact, a terminal accommodating hole, and a contact accommodating hole in P of FIG.

FIG. 5D is a partially enlarged front view illustrating the positional relationship between the contact, the terminal accommodating hole, and the contact accommodating hole in Q of FIG. 4.

6 is a front view of the socket in which the cover is in the lowered position.

7 is a cross-sectional view of FIG. 6.

FIG. 8 is a cross-sectional view similar to FIG. 6 except that the electronic component on the socket is indicated by a dotted line, and the state mounted in the socket is shown by the solid line.

FIG. 9 is a cross-sectional view similar to FIG. 7 but showing a state in which the cover is in a raised position.

FIG. 10A is a partially enlarged front view illustrating the positional relationship between the contact, the terminal accommodating hole, and the contact accommodating hole of FIG. 7.

FIG. 10B is a partially enlarged front view illustrating the positional relationship between the contact, the terminal accommodating hole, and the contact accommodating hole of FIG. 8.

FIG. 10C is a partially enlarged front view illustrating the positional relationship between the contact shown in FIG. 9, the ball receiving hole, and the contact receiving hole. FIG.

11A to 11D are front and side views respectively illustrating enlarged and disassembled contact claws of other contacts according to the present invention.

12 is an enlarged front view showing the terminal engaging surface of the deforming slider according to the present invention.

13A is a plan view of a socket according to the prior art.

FIG. 13B is a cross-sectional view taken along the line C-C of FIG. 13A showing the electronic components to be mounted together.

FIG. 13C is similar to FIG. 13B, but showing a state where the electronic component is accommodated in the socket.

FIG. 13D is an enlarged view of a portion of FIG. 13A.

<Explanation of symbols for the main parts of the drawings>

2: electronic package

10: socket

11: base

12: slider

12a: sheet

12b: terminal receiving hole

12c: terminal engagement surface

12d: contact receiving hole

13: contact

Briefly, a socket manufactured according to a preferred embodiment of the present invention for removably receiving an electronic component having a terminal arranged in a predetermined selected pattern is provided with a plurality of contacts arranged corresponding to the selected pattern. And a socket base, each of which is provided with a cantilevered contact arm capable of contacting the terminal of the electronic component. A slider movable horizontally relative to the socket base is slidably mounted on the socket base, the slider having a plurality of contact receiving through holes corresponding to the position of the contact arm. The wall of the through hole is configured such that no bias is applied to the contact arm allowing the contact arm to function as a free end. The slider is also provided with a terminal accommodating hole for accommodating the terminal and communicating with the through hole. The terminal may be received in the terminal receiving hole when the slider is in a predetermined selected position, and the contact arm may be flexibly connected with a terminal in the terminal receiving hole when the slider is in another selected position.

According to a further feature of the invention, each contact is provided with one contact arm instead of a conventional crimpable arm pair, the terminals of the electronic component being engaged in the terminal receiving holes when the slider is moved, such that the terminals are walled, i.e. Each terminal of an electronic component can be connected by holding between the terminal engagement surface in a terminal accommodating hole, and the arm of a contact. Therefore, the slider only needs to provide a space corresponding to the movement range required for the terminal of the electronic component to be connected with the arm of the contact under the action of a suitable force, so that the area occupied by the contact arm on the slider sheet is smaller than that provided in the prior art. Becomes small. As a result, a terminal with a finer pitch can be accommodated. According to another feature of the invention, a cover is provided that is movable towards or away from the socket base. The cover is provided with an engagement portion that can engage the slider, which moves the slider in a predetermined selected direction as the cover moves toward or away from the socket base when the engagement portion engages the slider. According to the invention, the contact is bent only when engaged with the terminal of the electronic component, thereby increasing the durability of the contact. According to another feature of the invention, the terminal engaging surface of the terminal accommodating hole may be a cylindrical surface or formed more partially, e. Can be.

According to one feature of the invention, the contact portion of the contact arm is provided with a claw-like protrusion, for example, provided with a pair of spaced apart protrusions extending in a predetermined selected direction so as to extend toward the terminal engagement surface when mounted. Can be formed. Thus, the contact can be stably connected with the terminal of the electronic component in the contact region corresponding to the contact region of the plurality of arms even when only one arm is employed.

According to another feature of the invention, the contact portion of the contact arm is configured to contact the root portion of the terminal on the electronic component side from which the terminal extends. When used with an electronic component provided with a BGA package provided with a ball-shaped terminal, the contact portion of the contact arm has a terminal portion that has the largest diameter with respect to the bottom surface of the package and a plane parallel to the bottom surface of the package. Meshes with the terminal in between.

According to another feature of one embodiment of the invention, a jig equipped with a holding and releasing part for carrying an electronic component moves towards and away from the socket. It is possible and can be used to move the cover or to move the slider of the coverless socket.

Other objects and features of the present invention are disclosed in the following detailed description and will be apparent from the description. The objects and advantages of the invention may be realized and obtained by means, combinations and methods defined in the appended claims.

The accompanying drawings, which are integrated with this specification, constitute a part of this specification and show preferred embodiments of the present invention.

As shown in Fig. 2, the electronic component mounting mechanism 1 of the preferred embodiment is a BGA package (electronic component referred to as a "package") in which a ball-shaped solder ball (terminal) 2a is arranged in a predetermined selected pattern. It is for mounting. The mounting mechanism includes a socket 10 and a jig 50 arranged in alignment with the socket 10 to move the slider of the socket. The socket 10 has a socket body made of a suitable resin material, such as polyether imide, i.e., a base 11 and vertically movable toward and away from the base 11 with an electronic component access hole in the center thereof. Cover 14 is provided. The base 11 is fixed on a wiring board (not shown) such as a printed board. The base has a generally square bottom 11a and a wall 11b which encloses the bottom 11a and together with the floor forms a central space, ie a cavity. The bottom 11a of the base 11 is provided with a large number of elongate contacts 13 corresponding to the solder ball 2a pattern of the package 2, as shown in FIGS. 1 and 4. A protruding anchor portion 13b (see FIG. 4) is formed in the middle of both ends of the contact 13, and when the anchor portion 13b is received in the hole of the base 11, the contact is made of the base. It is fixed in an upright state extending in the direction perpendicular to the bottom of (11).

As distinguished from the prior art, the cantilever tip of each contact 13 is not provided with a pair of arms which can move toward and away from each other. In this embodiment, each contact 13 is provided with one arm 13a, which has a direction in which the arm 13a is deformed in the direction of the side of the base 11 (the X direction in FIG. 1) and the arm 13a. With each contact disposed to be parallel, it may be elastically deformed in one predetermined direction.

Referring to FIG. 1, in the present specification, a horizontal direction is referred to as an X direction, and a direction perpendicular thereto is referred to as a Y direction. The directions perpendicular to the X and Y directions are called Z directions.

Referring to FIG. 1 or 4, a slider 12 is provided in the space above the bottom 11a of the base 11, which is X between the first end and the second end on the bottom 11a. It is possible to slide in the direction. On the surface of the slider 12, on which the package 2 can be placed, a flat holder, i.e. a sheet 12a, is formed. A large number of terminal receiving holes 12b for accommodating the solder balls 2a of the package are formed in the sheet 12a corresponding to the specific solder ball pattern of the package 2. As shown in Figs. 5C and 5D, each terminal accommodating hole 12b is formed into a cylindrical shape so as to form the terminal engaging surface 12c. The diameter of the terminal accommodating hole 12b is larger than the outer diameter of the solder ball 2a, and the depth thereof is larger than the height of the solder ball. A contact receiving hole 12d is formed in the slider 12 to receive the contact 13 corresponding to the position of each contact 13 extending from the base 11, and each contact receiving hole 12d is formed at each terminal receiving portion. It joins with the hole 12b and communicates with the hole. Each contact receiving hole 12d is a rectangular through hole whose longitudinal direction extends in the X direction of the slider 12. The arm 13a of each contact is disposed in the through hole 12d and is relatively movable with respect to a predetermined position inside each terminal receiving hole 12b. The length of each contact receiving hole 12d in the X direction is approximately equal to or slightly larger than the amount of movement of the slider 12. Each contact 13 is adapted to maintain its upright orientation extending from the base 11 without contacting the side of the slider 12 while the slider is moving in the X direction.

The arm 13a of each contact 13 is accommodated in the contact receiving hole 12d and is disposed opposite to the terminal engaging surface 12c of the terminal receiving hole 12b. As shown in FIGS. 5A and 5B, the contact claws 13c that can engage a portion of the surface of the solder ball 2a are two in the XY plane when the contact is mounted to the base, but generally toward the terminal engagement surface. Branching in the selected direction is formed at an acute angle at the tip end of the arm 13a.

As shown in FIG. 5D, the distance d2 in the X direction between the contact claw 13c of the contact 13 and each terminal engagement surface 12c of the slider 12 is (a state where the contact is in the closed position). Is set to a value smaller than the diameter of the solder ball 2a when the slider is at one end. When the slider 12 is moved by the predetermined amount in the X + direction, the terminal receiving hole 12b of the slider 12 is opened, and as a result, the distance becomes a distance d1 larger than the diameter of the solder ball 2a. When the slider 12 is moved in the X-direction while the solder ball 2a is accommodated in the terminal accommodating hole 12b, the solder ball is between the terminal engaging surface 12c and the contact claw 13c of the contact 13. Resilient at Moreover, the contact 13 can exert an appropriate force depending on its shape and the material used. In addition, the force transmitted through the contact claw 13c can be set to a value suitable for penetrating the solder ball 2a.

Regarding the relationship between the position of the contact claw 13c of the contact 13 in the Z direction and the height of the sheet 12a of the slider 12, the contact claw 13c is the root portion of the solder ball 2a, that is, The contact claws 13c may be contacted with each other so that the solder balls 2a may be engaged with a region having a maximum diameter in a plane parallel to the bottom surface of the package 2 and a portion between the positions where the solder balls are connected to the package. It is preferable to arrange slightly above the center part.

As shown in Fig. 1 or 4, the guide wall portion 12e on the outer circumferential portion of the sheet 12a of the slider 12 has a guide surface 12f inclined to guide the package 2 to the sheet 12a. Formed.

As can be seen in FIG. 4, the cover 14 is provided with a movement limiting engagement member 14a, which extends in the Z direction on two opposite sides and catches at its distal end. ) Is formed. The catch of each member 14a is engaged with the engaging projection 11c formed in the base 11 to restrict the cover from moving in the direction away from the base. The cover 14 is adapted to move toward the base 11 until its lower side contacts the upper end face of the wall 11b of the base. Referring to FIG. 3, a plurality of cam members 14b having a selected surface, such as the convex curved surface shown, are provided at each corner of the cover 14 to move the slider 12. In cooperation with the cam member, an engagement follower 12g is provided on the outer circumference of the slider 12 to engage the cam member 14b of the cover. A plurality of first compression coil springs 15 with longitudinal axes extending in the Z direction are provided between the cover 14 and the base 11. When there is no external force acting on the cover 14, the force from the first compression coil spring 15 is in a state where the catch of the engagement member 14a is engaged with the engagement protrusion 11c of the base 11. Move the cover to the raised position. A plurality of second compression coil springs 16 with longitudinal axes extending in the X direction are provided between the slider 12 and the base 11. When no external force is applied on the cover and the force from each second compression coil spring 16 acts in the X-direction, the slider 12 engages the wall 11b on the X- side of the base and the slider 12 The engagement follower portion 12g of) is engaged with the cam member 14b of the cover 14.

As shown in FIG. 2, the jig 50 for operating the slider is provided with a head 51 movable in the Z direction toward the socket 10 and in a direction away from the socket, and engaged with the cover 14. An engaging surface 53 is formed on the socket 10 side of the jig which is to be rolled. If desired, a holder 52 is provided on the head which can hold the package 2 by suitable means such as suction.

In the above-described embodiment, the jig 50 holding the package 2 is lowered in the Z + direction so that the engaging surface 53 of the jig is engaged with the cover 14. When the jig continues to descend downward, the cover 14 is provided by the first compression coil spring 15 and the second compression coil spring 16 until it engages with the base 11 as shown in FIG. 6. It is moved in the direction Z + opposite the force. As the cover member 14 descends, the engagement follower 12g is cam-moved by the cam member 14b of the cover member, so that the slider 12 is in a direction opposite to the force of the second compression coil spring 16. Allow it to move in the X + direction.

As shown in Figs. 7 and 10A, when the slider is moved to the terminal X + position, the contact 13 is moved away from the terminal accommodating hole 12b while maintaining the upright alignment state from the base 11. The terminal receiving hole 12b is opened by moving relative to the position inside the contact receiving hole 12d. With the slider in the position shown in FIG. 7, and as shown in FIG. 8, the package 2 is disengaged from the jig 50 and falls onto the seat 12a of the slider 12. The package 2 is guided on the sheet 12a of the slider along the guide surface 12f, and each solder ball 2a of the package 2 is accommodated in the terminal receiving hole 12b as shown in FIG. 10B.

Next, when the jig 50 is raised in the Z-direction, the slider 12 is engaged in the X-direction due to the force of the second compression coil spring 16 in engagement with the wall 11b on the X- side of the base. Returning, the cover member 14 is moved in the Z-direction as shown in FIG. In this step, the solder balls 2a in the terminal accommodating holes 12b are held between the contact claws 13c and the respective terminal engaging surfaces 12c which are relatively close to each other, as shown in Fig. 10C.

With the solder ball 2a disposed away from the center in the XY plane of the terminal receiving hole 12b, the position of the solder ball 2a is guided by the terminal engaging surface 12c while the solder ball approaches the contact claw 13c. Somewhat adjusted accordingly, they are oriented in the X direction along a straight line between each contact claw 13c and the terminal engaging surface 12c. The contact arm 13a is bent by the solder ball 2a by a predetermined amount as it is pushed in the X-direction. The contact claw 13c is engaged with the root portion of the surface of the solder ball 2a by a spring force depending on the degree of bending of the arm 13a, so that the contact 13 is effectively electrically connected to each solder ball 2a.

According to the embodiment of the present invention, the solder ball 2a of the package 2 is pressed against each contact 13 fixed to the base while being guided by the terminal engaging surface 12c of the slider 12. Therefore, regardless of the position where the solder ball 2a is disposed inside the terminal accommodating hole 12b of the slider 12, the solder ball can be accurately positioned with respect to the contact claw 13c of each contact 13.

According to the above-described embodiment, each arm 13 is provided with one arm 13a, and the solder ball 2a of the package 2 is pressed against the arm when the slider 12 moves. Thus, since only enough space is provided to accommodate the range of movement required to bend the arm by a predetermined amount, the area occupied by the arm 13a of each contact on the sheet 12a of the slider is reduced compared to the prior art. You can do it. In view of the fact that the contacts 13 can be arranged closer to each other as described above, the socket of the present invention is a package 2 with a solder ball 2a arranged closer than that which can be accommodated in a conventional socket. It can be made suitable for use together.

In the above-described embodiment, since each contact is provided with only one arm, the structure of the contact 13 itself can be simplified, and along with this, the slider portion for accommodating the contact 13, i. The part required for the engagement of the contacts according to the prior art becomes unnecessary. Therefore, the structure of the slider 12 itself can be simplified, and the cost of the metal frame used to manufacture the contact 13 and the slider 12 can be reduced.

According to the above embodiment, the arm 13a is bent only when connected to the solder ball 2a. Therefore, the bending degree of the arm 13a can be set to a desired selection value based on the moving amount of the slider 12 and the engagement position of the solder ball 2a. As a result, the arm 13a and each solder ball 2a can be connected with an appropriate compressive force, and at the same time, the durability of the contact can be improved more than in the case of conventional contacts. As mentioned above, the stress is applied to the conventional contact not only in the connected state but also during the opening operation of the contact. According to the invention, the required minimum stress corresponding to the degree of bending is produced only in the connected state.

Further, according to the above embodiment, the contact portion engaged with the solder ball 2a is in the form of a bifurcated claw. Such a contact can be stably engaged with the solder ball 2a in an engagement pattern corresponding to two arms even though only one arm 13a is used.

Further, according to the above embodiment, the contact claw 13c engages or penetrates the root portion of the solder ball 2a. Since the solder ball 2a accommodates the contact claw 13c in the solder ball portion connected to the package, it is possible to control the amount of deformation of the solder ball 2a caused during such connection. This is particularly effective when the solder ball 2a is heated and relatively softened. Excessive penetration by the contact claw 13c can be prevented by adjusting the position of the portion 12c that engages the solder ball 2a in the terminal accommodating hole 12b.

11A-11D show contact claws of other contacts made in accordance with the present invention. As shown in FIGS. 11A and 11B, the tip portion of the arm 130a of the contact 130 is partially divided, and each tip portion is provided with a contact protrusion or claw 130c. As illustrated in FIGS. 11C and 11D, the entire arm 131a of the contact 131 may be divided with the contact protruding claw 131c provided at each tip. Therefore, the conditions necessary for determining an appropriate bending degree for the arm can be increased, and an optimum value can be obtained.

12 shows the terminal engagement surface of another slider made in accordance with the present invention. As illustrated in FIG. 12, the terminal engagement surface 120c of the slider may have a partially spherical shape in which the curvature is approximately equal to the curvature of the solder ball 2a. Thus, the solder balls can be positioned more accurately compared to the cylindrical surface 12c, and can further enhance the control of the amount of deformation of the solder balls 2a.

In the above embodiment, one example of a socket provided with a cover has been described. It should be noted that the present invention can also be used for sockets without a cover. In this case, a jig 50 may be provided that includes a cam portion 14b of the cover member 14 that engages with the engagement follower 12g of the slider 12.

In addition, in the above-described embodiment, one example of the socket in which the slider is moved back and forth in the X direction on the base has been described. However, the present invention can also be used for a socket in which the slider is moved back and forth along the diagonal of the base. Although the present invention has been described in connection with particularly preferred embodiments, it will be apparent to those skilled in the art that other variations and modifications are possible. Accordingly, the invention of the appended claims is to be interpreted as broadly as possible in the light of the prior art, to cover all such variations and modifications.

According to the present invention, the area occupied by the contact arm on the slider sheet is provided in the prior art because only the space corresponding to the movement range required for the terminal of the electronic component to be connected with the arm of the contact under the action of a suitable force is provided. It becomes smaller than the area | region to become, and can accommodate a terminal with a finer pitch.

Claims (15)

A socket device for removably receiving an electronic package having a plurality of terminals extending downward from the electronic package and arranged in a selected pattern, An electrically insulating base having a top surface and a bottom surface and having a plurality of contact receiving holes extending through the top surface and the bottom surface and arranged in the selected pattern; As an electrically insulating slider, A bay to move along a straight line between the first and second ends of the base The top and bottom surfaces slidably accommodated on the top surface of the An electronic package slider accommodating sheet formed on an upper surface of the slider; Slave between top and bottom surfaces for each contact receiving hole in the base Contacts formed through the ether and aligned with the contact receiving holes in the base With receiving holes, Through the top surface of the slider for each contact receiving hole of the slider There is a terminal engagement surface, and is joined to each contact receiving hole of the slider Terminal receiving hole in communication with these holes The electrically insulating slider having a configuration formed thereon; An elongated electrically conductive contact received and retained in each contact receiving hole of the base, extending through each contact receiving hole of the slider, each having a free distal end disposed near the top surface of the slider. Including, The slider is movable between a first position where the contact is disposed at a first distance from each terminal engagement surface and a second position at which the contact is disposed at a greater second distance from each terminal engagement surface, such that the selected The electronic package with a plurality of terminals arranged in a pattern may be disposed on the electronic package accommodating sheet, wherein the plurality of terminals are in a state accommodated in each terminal accommodating hole when the slider is in the second position, And the terminal in the terminal receiving hole when the slider is in the first position is interposed between each terminal engagement surface and the contact and in engagement with the terminal engagement surface and the contact. The socket arrangement of claim 1 wherein the contact does not engage the slider over a range of movement of the slider. The socket device of claim 1 wherein the free distal end of the contact is disposed below an upper surface of the slider. The socket according to claim 1, wherein the contact is provided with an anchor portion for fixing the contact in each contact receiving hole of the base, and each contact is provided with a contact arm extending upwardly into each contact receiving hole of the slider. Device. The socket device of claim 1 further comprising two spaced apart protrusions formed at the free distal tip of each contact and configured to face each terminal engagement surface. The socket device according to claim 4, wherein the free distal tip portion of each contact arm is bifurcated, and the protruding portions are formed in these diverged branches, respectively, and are configured to face each terminal engagement surface. 5. The socket arrangement as set forth in claim 4, wherein each of the contact arms is bifurcated, and the protruding portions are respectively formed at the free distal tip portions of these divergent branches, and are configured to face each terminal engagement surface. The device of claim 1, wherein the socket device is adapted for use with an electronic package having a bottom surface and solder ball terminals, wherein the diameter of the solder ball terminals can vary up to a maximum size in a direction parallel to the bottom surface of the electronic package. And two spaced apart protrusions formed on the free distal end of each contact and configured to face each terminal engagement surface, the protrusions being less than a distance from the maximum diameter of the solder ball terminal to the bottom surface of the electronic package. And a socket device disposed below the top surface of the slider at a distance. The socket device of claim 1, wherein the terminal engagement surface is generally cylindrical. The socket device of claim 1, wherein the terminal engagement surface is partially spherical. The socket member of claim 1 further comprising a first spring member mounted to the base to bias the slider to a first position. 2. The cover of claim 1, further comprising a spring member mounted to the base to bias the slider to the first position, wherein the slider is provided with an engaging follower surface, and a cover having an electronic package access hole formed at the center thereof. Mounted on the base so as to be movable toward and towards the top surface of the base, the cover being provided with a downwardly extending cam portion aligned with the respective engagement driven surface, the second spring member being the base; A bias applied to the cover in a direction away from the base, the cover being movable toward the base against the bias of the second spring member, wherein the cam member is engaged with the engagement driven surface and the slider Against the bias of the first spring member To move toward the second position. 13. The jig of claim 12, further comprising a jig that is movable toward and away from the socket, the jig having an electronic package retaining and releasing portion aligned with the electronic package access hole of the cover, wherein the jig has a cover engaging surface. Thereby, the jig moves toward the socket so that the cover engaging surface is engaged with the cover, and as the jig continues to move, the cover is moved towards the base, thereby causing the cam portion to cam move the engaging follower surface and the slider The socket device which slides. A plurality of spaced apart three-armed, with cantilevered contact arms extending entirely upright into each contact receiving hole bounded in part by a terminal engagement surface of the slider that is slidably mounted to the upper surface of the base. Mounting a long electrical contact to the base, The slider is moved in a direction away from the first position against the bias of the spring force such that each terminal engagement surface is moved from the contact arm in each contact receiving hole to the second position so that the terminals of the electronic package are in contact with the terminal engagement surface. To be positioned between the arms, Moving the slider in a return direction opposite to the first position by the spring force, pushing the terminal by the terminal engagement surface to engage the contact arm Method comprising a. The method of claim 14 including maintaining a gap between the slider and the contact arm during movement of the slider.