SG71080A1 - Resonant tag and method for deactivating resonant frequency characteristics thereof - Google Patents

Resonant tag and method for deactivating resonant frequency characteristics thereof

Info

Publication number
SG71080A1
SG71080A1 SG1998000182A SG1998000182A SG71080A1 SG 71080 A1 SG71080 A1 SG 71080A1 SG 1998000182 A SG1998000182 A SG 1998000182A SG 1998000182 A SG1998000182 A SG 1998000182A SG 71080 A1 SG71080 A1 SG 71080A1
Authority
SG
Singapore
Prior art keywords
resonant
deactivating
frequency characteristics
tag
resonant frequency
Prior art date
Application number
SG1998000182A
Other languages
English (en)
Inventor
Shinya Uchibori
Original Assignee
Miyake Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP07167978A external-priority patent/JP3116209B2/ja
Application filed by Miyake Kk filed Critical Miyake Kk
Publication of SG71080A1 publication Critical patent/SG71080A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/0672—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with resonating marks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Burglar Alarm Systems (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SG1998000182A 1994-12-01 1995-06-20 Resonant tag and method for deactivating resonant frequency characteristics thereof SG71080A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32350694 1994-12-01
JP07167978A JP3116209B2 (ja) 1994-12-01 1995-06-10 共振タグ等の回路様金属箔シートの製造方法

Publications (1)

Publication Number Publication Date
SG71080A1 true SG71080A1 (en) 2000-03-21

Family

ID=26491853

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998000182A SG71080A1 (en) 1994-12-01 1995-06-20 Resonant tag and method for deactivating resonant frequency characteristics thereof

Country Status (8)

Country Link
KR (1) KR100197509B1 (zh)
CN (1) CN1100999C (zh)
AU (1) AU700075B2 (zh)
BR (1) BR9502961A (zh)
CA (1) CA2153022C (zh)
MY (1) MY117567A (zh)
SG (1) SG71080A1 (zh)
TW (1) TW404092B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5754110A (en) * 1996-03-07 1998-05-19 Checkpoint Systems, Inc. Security tag and manufacturing method
KR100605480B1 (ko) 2004-04-19 2006-07-31 고상근 알에프아이디 시스템의 태그 제조방법
JP5377096B2 (ja) 2008-09-08 2013-12-25 株式会社東芝 高周波パッケージ装置およびその製造方法
KR20120028418A (ko) 2010-09-14 2012-03-23 삼성모바일디스플레이주식회사 유기 발광 표시 장치용 밀봉기판의 제조 방법 및 유기 발광 표시 장치용 밀봉기판
KR101959576B1 (ko) 2010-11-19 2019-03-18 디에스엠 아이피 어셋츠 비.브이. 금속박 패턴 적층체, 금속박의 펀칭 방법, 회로 기판, 그 제조 방법 및 태양 전지 모듈
CN103597915B (zh) 2011-06-06 2017-05-24 帝斯曼知识产权资产管理有限公司 金属箔图案层叠体、金属箔层叠体、金属箔层叠基板、太阳能电池模块和金属箔图案层叠体的制造方法
CN112621891B (zh) * 2019-09-24 2022-10-14 泰州隆基乐叶光伏科技有限公司 导电金属箔冲压方法及冲压装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3116078A1 (de) * 1981-04-22 1983-01-20 IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen "praegefolie"
CH677988A5 (zh) * 1986-07-30 1991-07-15 Actron Entwicklungs Ag
CH680483A5 (zh) * 1989-10-20 1992-08-31 Kobe Properties Ltd

Also Published As

Publication number Publication date
KR100197509B1 (ko) 1999-06-15
MY117567A (en) 2004-07-31
BR9502961A (pt) 1997-05-27
CN1100999C (zh) 2003-02-05
AU700075B2 (en) 1998-12-17
AU2329495A (en) 1996-06-06
KR960021510A (ko) 1996-07-18
TW404092B (en) 2000-09-01
CA2153022A1 (en) 1996-06-02
CN1126841A (zh) 1996-07-17
CA2153022C (en) 1999-11-30

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