SG67512A1 - Apparatus and method of separating sample and substrate fabrication method - Google Patents

Apparatus and method of separating sample and substrate fabrication method

Info

Publication number
SG67512A1
SG67512A1 SG1998001381A SG1998001381A SG67512A1 SG 67512 A1 SG67512 A1 SG 67512A1 SG 1998001381 A SG1998001381 A SG 1998001381A SG 1998001381 A SG1998001381 A SG 1998001381A SG 67512 A1 SG67512 A1 SG 67512A1
Authority
SG
Singapore
Prior art keywords
substrate fabrication
separating sample
fabrication method
separating
sample
Prior art date
Application number
SG1998001381A
Other languages
English (en)
Inventor
Kazuaki Omi
Takao Yonehara
Kiyofumi Sakaguchi
Kazutaka Yanagita
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of SG67512A1 publication Critical patent/SG67512A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1933—Spraying delaminating means [e.g., atomizer, etc.
    • Y10T156/1939—Air blasting delaminating means]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Combined Means For Separation Of Solids (AREA)
  • Weting (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Centrifugal Separators (AREA)
SG1998001381A 1997-06-16 1998-06-09 Apparatus and method of separating sample and substrate fabrication method SG67512A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9159038A JPH115064A (ja) 1997-06-16 1997-06-16 試料の分離装置及びその方法並びに基板の製造方法

Publications (1)

Publication Number Publication Date
SG67512A1 true SG67512A1 (en) 1999-09-21

Family

ID=15684894

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998001381A SG67512A1 (en) 1997-06-16 1998-06-09 Apparatus and method of separating sample and substrate fabrication method

Country Status (9)

Country Link
US (1) US6427747B1 (ko)
EP (1) EP0886300A3 (ko)
JP (1) JPH115064A (ko)
KR (1) KR100372810B1 (ko)
CN (1) CN1208672A (ko)
AU (1) AU724851B2 (ko)
CA (1) CA2240701C (ko)
SG (1) SG67512A1 (ko)
TW (1) TW398039B (ko)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6382292B1 (en) 1997-03-27 2002-05-07 Canon Kabushiki Kaisha Method and apparatus for separating composite member using fluid
US6418999B1 (en) * 1997-12-26 2002-07-16 Cannon Kabushiki Kaisha Sample separating apparatus and method, and substrate manufacturing method
SG71182A1 (en) 1997-12-26 2000-03-21 Canon Kk Substrate processing apparatus substrate support apparatus substrate processing method and substrate manufacturing method
JPH11243050A (ja) 1998-02-24 1999-09-07 Canon Inc 露光装置
US6540861B2 (en) * 1998-04-01 2003-04-01 Canon Kabushiki Kaisha Member separating apparatus and processing apparatus
JP4343295B2 (ja) * 1998-11-06 2009-10-14 キヤノン株式会社 試料の処理システム
US6672358B2 (en) 1998-11-06 2004-01-06 Canon Kabushiki Kaisha Sample processing system
JP2000150611A (ja) * 1998-11-06 2000-05-30 Canon Inc 試料の処理システム
TW484184B (en) 1998-11-06 2002-04-21 Canon Kk Sample separating apparatus and method, and substrate manufacturing method
JP4365920B2 (ja) * 1999-02-02 2009-11-18 キヤノン株式会社 分離方法及び半導体基板の製造方法
FR2796491B1 (fr) * 1999-07-12 2001-08-31 Commissariat Energie Atomique Procede de decollement de deux elements et dispositif pour sa mise en oeuvre
US6221740B1 (en) * 1999-08-10 2001-04-24 Silicon Genesis Corporation Substrate cleaving tool and method
JP2002075917A (ja) 2000-08-25 2002-03-15 Canon Inc 試料の分離装置及び分離方法
JP4708577B2 (ja) 2001-01-31 2011-06-22 キヤノン株式会社 薄膜半導体装置の製造方法
JP2002229473A (ja) 2001-01-31 2002-08-14 Canon Inc 表示装置の製造方法
JP4803884B2 (ja) 2001-01-31 2011-10-26 キヤノン株式会社 薄膜半導体装置の製造方法
DE10108369A1 (de) * 2001-02-21 2002-08-29 B L E Lab Equipment Gmbh Verfahren und Vorrichtung zum Ablösen eines Halbleiterwafers von einem Träger
FR2823373B1 (fr) * 2001-04-10 2005-02-04 Soitec Silicon On Insulator Dispositif de coupe de couche d'un substrat, et procede associe
JP2002353423A (ja) * 2001-05-25 2002-12-06 Canon Inc 板部材の分離装置及び処理方法
JP2003017668A (ja) * 2001-06-29 2003-01-17 Canon Inc 部材の分離方法及び分離装置
JP2005311199A (ja) * 2004-04-23 2005-11-04 Canon Inc 基板の製造方法
JP2008135690A (ja) * 2006-10-30 2008-06-12 Denso Corp 半導体力学量センサおよびその製造方法
JP6167108B2 (ja) * 2011-10-31 2017-07-19 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッドＭｅｍｃ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 結合ウェハ構造体を劈開させるための固定装置及び劈開方法
KR102082271B1 (ko) * 2013-05-24 2020-04-16 엘지디스플레이 주식회사 캐리어기판 분리 시스템 및 분리 방법
KR101898121B1 (ko) * 2015-10-22 2018-09-12 저지앙 마이크로테크 머테리얼 컴퍼니 리미티드 워크피스 처리 방법 및 그러한 방법을 위해 설계된 장치
JP7309191B2 (ja) * 2019-11-06 2023-07-18 中村留精密工業株式会社 ウェハー分割装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3147142A (en) * 1961-01-25 1964-09-01 Frank S Rudo Precision coating devices
US3583634A (en) * 1968-12-02 1971-06-08 Fmc Corp Spray nozzle
US3664586A (en) * 1970-07-06 1972-05-23 Charles R Harris Sr Sprinkler head
US4326553A (en) * 1980-08-28 1982-04-27 Rca Corporation Megasonic jet cleaner apparatus
DE4100526A1 (de) * 1991-01-10 1992-07-16 Wacker Chemitronic Vorrichtung und verfahren zum automatischen vereinzeln von gestapelten scheiben
US5255853A (en) * 1991-04-02 1993-10-26 Ingersoll-Rand Company Adjustable fluid jet cleaner
US5232155A (en) * 1991-05-17 1993-08-03 Ingersoll-Rand Company Integrity sensor for fluid jet nozzle
FR2699852B1 (fr) 1992-12-29 1995-03-17 Gaz De France Procédé et dispositif d'usinage à jet de fluide haute pression asservi.
JP3257580B2 (ja) 1994-03-10 2002-02-18 キヤノン株式会社 半導体基板の作製方法
JPH098095A (ja) * 1995-06-22 1997-01-10 Fuji Electric Co Ltd 積層半導体ウエハの分離装置およびその分離方法
KR0165467B1 (ko) 1995-10-31 1999-02-01 김광호 웨이퍼 디본더 및 이를 이용한 웨이퍼 디본딩법
JPH1022238A (ja) * 1996-06-29 1998-01-23 Komatsu Electron Metals Co Ltd 半導体ウェハのエアーブロー装置
US6382292B1 (en) 1997-03-27 2002-05-07 Canon Kabushiki Kaisha Method and apparatus for separating composite member using fluid
US6159825A (en) * 1997-05-12 2000-12-12 Silicon Genesis Corporation Controlled cleavage thin film separation process using a reusable substrate

Also Published As

Publication number Publication date
JPH115064A (ja) 1999-01-12
KR100372810B1 (ko) 2003-04-21
CA2240701A1 (en) 1998-12-16
CN1208672A (zh) 1999-02-24
AU7186998A (en) 1998-12-17
CA2240701C (en) 2003-02-04
AU724851B2 (en) 2000-10-05
KR19990007019A (ko) 1999-01-25
EP0886300A3 (en) 2000-01-26
US6427747B1 (en) 2002-08-06
EP0886300A2 (en) 1998-12-23
TW398039B (en) 2000-07-11

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