SG52861A1 - Plasma processing method and apparatus - Google Patents

Plasma processing method and apparatus

Info

Publication number
SG52861A1
SG52861A1 SG1996011142A SG1996011142A SG52861A1 SG 52861 A1 SG52861 A1 SG 52861A1 SG 1996011142 A SG1996011142 A SG 1996011142A SG 1996011142 A SG1996011142 A SG 1996011142A SG 52861 A1 SG52861 A1 SG 52861A1
Authority
SG
Singapore
Prior art keywords
processing method
plasma processing
plasma
processing
Prior art date
Application number
SG1996011142A
Other languages
English (en)
Inventor
Tomohiro Okumura
Hideo Haraguchi
Ichiro Nakayama
Yoshihiro Yanagi
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP07297994A external-priority patent/JP3083745B2/ja
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG52861A1 publication Critical patent/SG52861A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
SG1996011142A 1995-11-16 1996-11-15 Plasma processing method and apparatus SG52861A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP07297994A JP3083745B2 (ja) 1995-11-16 1995-11-16 プラズマ処理装置
JP29799395 1995-11-16

Publications (1)

Publication Number Publication Date
SG52861A1 true SG52861A1 (en) 1998-09-28

Family

ID=26561331

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996011142A SG52861A1 (en) 1995-11-16 1996-11-15 Plasma processing method and apparatus

Country Status (4)

Country Link
US (1) US5922223A (ko)
KR (1) KR100228025B1 (ko)
MY (1) MY118033A (ko)
SG (1) SG52861A1 (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3374033B2 (ja) * 1997-02-05 2003-02-04 東京エレクトロン株式会社 真空処理装置
WO1998042012A1 (fr) * 1997-03-17 1998-09-24 Matsushita Electric Industrial Co., Ltd. Procede et dispositif permettant le traitement de plasma
US6440219B1 (en) * 2000-06-07 2002-08-27 Simplus Systems Corporation Replaceable shielding apparatus
JP3983557B2 (ja) * 2002-01-29 2007-09-26 富士通株式会社 誘導結合型プラズマ処理装置
JP2004200307A (ja) * 2002-12-17 2004-07-15 Tokyo Electron Ltd プラズマ処理装置
JP3940095B2 (ja) * 2003-05-08 2007-07-04 忠弘 大見 基板処理装置
US7736939B2 (en) * 2005-07-07 2010-06-15 United Microelectronics Corp. Method for forming microlenses of different curvatures and fabricating process of solid-state image sensor
US20070079936A1 (en) * 2005-09-29 2007-04-12 Applied Materials, Inc. Bonded multi-layer RF window
DE102006051550B4 (de) * 2006-10-30 2012-02-02 Fhr Anlagenbau Gmbh Verfahren und Vorrichtung zum Strukturieren von Bauteilen unter Verwendung eines Werkstoffs auf der Basis von Siliziumoxid
WO2010027054A1 (ja) * 2008-09-05 2010-03-11 国立大学法人北陸先端科学技術大学院大学 カンチレバー加熱機構、それを用いたカンチレバーホルダ、及び、カンチレバー加熱方法
WO2010116809A1 (ja) * 2009-04-07 2010-10-14 Anbe Yoshinobu Ｘ線検査用加熱装置
US10595365B2 (en) * 2010-10-19 2020-03-17 Applied Materials, Inc. Chamber lid heater ring assembly
KR101634711B1 (ko) * 2010-12-15 2016-06-29 주식회사 원익아이피에스 진공처리장치
CN102548180A (zh) * 2010-12-27 2012-07-04 北京北方微电子基地设备工艺研究中心有限责任公司 介质窗、电感耦合线圈组件及等离子体处理设备
KR101598463B1 (ko) * 2014-04-30 2016-03-02 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6406631B2 (ja) * 2014-10-22 2018-10-17 パナソニックＩｐマネジメント株式会社 プラズマ処理装置
KR102481432B1 (ko) 2015-08-10 2022-12-27 삼성전자주식회사 커버 플레이트 및 그를 포함하는 플라즈마 처리 장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4367388A (en) * 1979-06-06 1983-01-04 Hitachi Heating Appliances Co., Ltd. Cooking heating apparatus
JPH0375389A (ja) * 1989-08-16 1991-03-29 Hitachi Ltd ドライエッチング装置
US5002631A (en) * 1990-03-09 1991-03-26 At&T Bell Laboratories Plasma etching apparatus and method
JPH042691A (ja) * 1990-04-18 1992-01-07 Shimadzu Corp ビューイングポート
US5231334A (en) * 1992-04-15 1993-07-27 Texas Instruments Incorporated Plasma source and method of manufacturing
US5277751A (en) * 1992-06-18 1994-01-11 Ogle John S Method and apparatus for producing low pressure planar plasma using a coil with its axis parallel to the surface of a coupling window
US5525159A (en) * 1993-12-17 1996-06-11 Tokyo Electron Limited Plasma process apparatus
JP3105403B2 (ja) * 1994-09-14 2000-10-30 松下電器産業株式会社 プラズマ処理装置
US5589737A (en) * 1994-12-06 1996-12-31 Lam Research Corporation Plasma processor for large workpieces
US5650032A (en) * 1995-06-06 1997-07-22 International Business Machines Corporation Apparatus for producing an inductive plasma for plasma processes
JPH0997783A (ja) * 1995-09-28 1997-04-08 Nec Corp プラズマ処理装置

Also Published As

Publication number Publication date
KR100228025B1 (ko) 1999-11-01
US5922223A (en) 1999-07-13
MY118033A (en) 2004-08-30

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