SG48716A1 - Plastic-molded-type hollow semiconductor device and process for manufacturing same - Google Patents
Plastic-molded-type hollow semiconductor device and process for manufacturing sameInfo
- Publication number
- SG48716A1 SG48716A1 SG1996000408A SG1996000408A SG48716A1 SG 48716 A1 SG48716 A1 SG 48716A1 SG 1996000408 A SG1996000408 A SG 1996000408A SG 1996000408 A SG1996000408 A SG 1996000408A SG 48716 A1 SG48716 A1 SG 48716A1
- Authority
- SG
- Singapore
- Prior art keywords
- molded
- plastic
- semiconductor device
- manufacturing same
- type hollow
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33905392A JP3192507B2 (ja) | 1992-12-18 | 1992-12-18 | 樹脂シール中空型半導体装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG48716A1 true SG48716A1 (en) | 1998-05-18 |
Family
ID=18323815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996000408A SG48716A1 (en) | 1992-12-18 | 1993-12-17 | Plastic-molded-type hollow semiconductor device and process for manufacturing same |
Country Status (6)
Country | Link |
---|---|
US (1) | US5977628A (ja) |
EP (1) | EP0602662B1 (ja) |
JP (1) | JP3192507B2 (ja) |
KR (1) | KR0133970B1 (ja) |
DE (1) | DE69317373T2 (ja) |
SG (1) | SG48716A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI261350B (en) * | 2005-09-02 | 2006-09-01 | Wintek Corp | Electronic member with conductive connection structure |
JP2009143234A (ja) * | 2008-12-24 | 2009-07-02 | Nippon Mining & Metals Co Ltd | キャリア付金属箔 |
CN103262235A (zh) * | 2010-12-16 | 2013-08-21 | 株式会社村田制作所 | 电子部件的制造方法 |
US8906747B2 (en) * | 2012-05-23 | 2014-12-09 | Freescale Semiconductor, Inc. | Cavity-type semiconductor package and method of packaging same |
JP5358724B1 (ja) | 2012-06-28 | 2013-12-04 | 太陽誘電株式会社 | 弾性波デバイス内蔵モジュール及び通信装置 |
JP6106404B2 (ja) | 2012-10-30 | 2017-03-29 | 太陽誘電株式会社 | 電子部品モジュール |
JP7200114B2 (ja) * | 2017-09-25 | 2023-01-06 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置 |
JPWO2022270633A1 (ja) * | 2021-06-24 | 2022-12-29 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1081411A (en) * | 1975-12-24 | 1980-07-15 | Philipp W.H. Schuessler | Method for hermetically sealing an electronic circuit package |
JPS6221254A (ja) * | 1985-07-22 | 1987-01-29 | Akita Denshi Kk | 電子装置 |
JPS6237949A (ja) * | 1985-08-12 | 1987-02-18 | Matsushita Electronics Corp | 電子部品塔載用パツケ−ジ |
JPS6384051A (ja) * | 1986-09-26 | 1988-04-14 | Matsushita Electronics Corp | 半導体装置の製造方法 |
JPH02185058A (ja) * | 1989-01-12 | 1990-07-19 | Mitsubishi Electric Corp | 樹脂シール中空パツケージのシール方法 |
JP2503685B2 (ja) * | 1989-10-23 | 1996-06-05 | 日本電気株式会社 | ヒ―トシンク付半導体装置 |
JPH03145746A (ja) * | 1989-10-31 | 1991-06-20 | Toshiba Corp | 中空パッケージ |
US5064968A (en) * | 1990-01-16 | 1991-11-12 | Hughes Aircraft Company | Domed lid for integrated circuit package |
US5081327A (en) * | 1990-03-28 | 1992-01-14 | Cabot Corporation | Sealing system for hermetic microchip packages |
EP0468379B1 (en) * | 1990-07-21 | 1999-11-17 | Mitsui Chemicals, Inc. | Semiconductor device having a package |
EP0472866A3 (en) * | 1990-07-23 | 1994-09-07 | Nat Semiconductor Corp | Ferroelectric device packaging techniques |
-
1992
- 1992-12-18 JP JP33905392A patent/JP3192507B2/ja not_active Expired - Fee Related
-
1993
- 1993-12-15 KR KR1019930027853A patent/KR0133970B1/ko not_active IP Right Cessation
- 1993-12-17 DE DE69317373T patent/DE69317373T2/de not_active Expired - Lifetime
- 1993-12-17 SG SG1996000408A patent/SG48716A1/en unknown
- 1993-12-17 US US08/168,185 patent/US5977628A/en not_active Expired - Lifetime
- 1993-12-17 EP EP93120389A patent/EP0602662B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0602662A1 (en) | 1994-06-22 |
JP3192507B2 (ja) | 2001-07-30 |
EP0602662B1 (en) | 1998-03-11 |
JPH06188326A (ja) | 1994-07-08 |
DE69317373D1 (de) | 1998-04-16 |
US5977628A (en) | 1999-11-02 |
KR0133970B1 (ko) | 1998-04-18 |
DE69317373T2 (de) | 1998-07-16 |
KR940016700A (ko) | 1994-07-23 |
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