JPWO2022270633A1 - - Google Patents
Info
- Publication number
- JPWO2022270633A1 JPWO2022270633A1 JP2023530149A JP2023530149A JPWO2022270633A1 JP WO2022270633 A1 JPWO2022270633 A1 JP WO2022270633A1 JP 2023530149 A JP2023530149 A JP 2023530149A JP 2023530149 A JP2023530149 A JP 2023530149A JP WO2022270633 A1 JPWO2022270633 A1 JP WO2022270633A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021105181 | 2021-06-24 | ||
PCT/JP2022/025387 WO2022270633A1 (ja) | 2021-06-24 | 2022-06-24 | 非接触通信媒体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022270633A1 true JPWO2022270633A1 (ja) | 2022-12-29 |
JPWO2022270633A5 JPWO2022270633A5 (ja) | 2024-03-28 |
Family
ID=84545514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023530149A Pending JPWO2022270633A1 (ja) | 2021-06-24 | 2022-06-24 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2022270633A1 (ja) |
WO (1) | WO2022270633A1 (ja) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01135835U (ja) * | 1988-03-11 | 1989-09-18 | ||
JP3192507B2 (ja) * | 1992-12-18 | 2001-07-30 | 三菱電機株式会社 | 樹脂シール中空型半導体装置の製造方法 |
JP4858599B2 (ja) * | 1998-12-31 | 2012-01-18 | カシオ計算機株式会社 | 電子機器 |
JP2003017514A (ja) * | 2001-03-20 | 2003-01-17 | Schlumberger Holding Ltd | 電子タグ装置および電子タグをパッケージする方法 |
DE20116141U1 (de) * | 2001-10-01 | 2003-02-13 | Siemens Ag | Hitzebeständiges Gehäuse für elektrische Funktionselemente und Verwendung einer solchen Vorrichtung für einen mobilen Datenspeicher |
JP2004297554A (ja) * | 2003-03-27 | 2004-10-21 | Seiko Epson Corp | 圧電発振器及び圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器 |
JP2006232292A (ja) * | 2005-02-22 | 2006-09-07 | Nippon Sheet Glass Co Ltd | 電子タグ付き容器およびrfidシステム |
JP4233536B2 (ja) * | 2005-03-31 | 2009-03-04 | シャープ株式会社 | 光学装置用モジュール |
JP2010087650A (ja) * | 2008-09-30 | 2010-04-15 | Daishinku Corp | 表面実装型圧電振動デバイス |
KR100899901B1 (ko) * | 2008-10-27 | 2009-05-29 | 대한민국 | 무선인식태그가 내장된 용기 뚜껑 |
JP2012235351A (ja) * | 2011-05-02 | 2012-11-29 | Denso Corp | アンテナ装置 |
JP5104982B2 (ja) * | 2011-06-27 | 2012-12-19 | カシオ計算機株式会社 | 電子機器 |
-
2022
- 2022-06-24 JP JP2023530149A patent/JPWO2022270633A1/ja active Pending
- 2022-06-24 WO PCT/JP2022/025387 patent/WO2022270633A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2022270633A1 (ja) | 2022-12-29 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231225 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231225 |